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S25FL127SABMFI101

Infineon Technologies

S25FL127SABMFI101 by Infineon Technologies

S25FL127SABMFI101 by Infineon Technologies is a NOR type flash memory with a capacity of 16MX8 and a memory density of 134217728 bits. It operates in synchronous mode with a max clock frequency of 108 MHz and has a min data retention time of 20 years. This flash memory is commonly used in industrial applications requiring high endurance and reliable data storage.

Median Price

$2.910

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,852 parts In-Stock

1+ parts

$2.440

100+ parts

$2.380

1k+ parts

$2.180

10k+ parts

-

1,852

$2.440

$2.380

$2.180

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Arrow

USA . 2,124 parts In-Stock

1+ parts

$2.898

100+ parts

$2.457

1k+ parts

$2.444

10k+ parts

-

2,124

$2.898

$2.457

$2.444

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Mouser Electronics

USA . 18,846 parts In-Stock

1+ parts

$2.910

100+ parts

$2.530

1k+ parts

$2.420

10k+ parts

$2.410

18,846

$2.910

$2.530

$2.420

$2.410

DigiKey

USA . 2,156 parts In-Stock

1+ parts

$3.580

100+ parts

$3.099

1k+ parts

$2.908

10k+ parts

$2.844

2,156

$3.580

$3.099

$2.908

$2.844

Farnell

UK . 5,404 parts In-Stock

1+ parts

$13.050

100+ parts

$7.830

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5,404

$13.050

$7.830

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Element14

Singapore . 8,069 parts In-Stock

1+ parts

$18.729

100+ parts

$11.236

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8,069

$18.729

$11.236

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Rochester

USA . 11,408 parts In-Stock

1+ parts

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$2.260

1k+ parts

$2.020

10k+ parts

$1.900

11,408

-

$2.260

$2.020

$1.900

Verical

USA . 11,408 parts In-Stock

1+ parts

-

100+ parts

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$2.525

10k+ parts

$2.375

11,408

-

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$2.525

$2.375

RS (Exports)

UK . 5,901 parts In-Stock

1+ parts

-

100+ parts

$4.063

1k+ parts

$3.861

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5,901

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$4.063

$3.861

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Flip Electronics (Authorized)

USA . 2,100 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 519 parts In-Stock

1+ parts

$1.995

100+ parts

-

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519

$1.995

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.152

100+ parts

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50

$3.152

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Ozdisan Elektronik

Türkiye . 274 parts In-Stock

1+ parts

$5.243

100+ parts

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274

$5.243

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DigiKey Marketplace

USA . 12,194 parts In-Stock

1+ parts

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100+ parts

$3.030

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12,194

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$3.030

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Chip Stock

USA . 8,930 parts In-Stock

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Vyrian

USA . 7,346 parts In-Stock

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7,346

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ACDS - Activité Composants Distribution Service

France . 2,275 parts In-Stock

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2,275

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Inventory MP

USA . 2,101 parts In-Stock

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2,101

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Flip Electronics

USA . 2,100 parts In-Stock

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Rutronik

Germany . 273 parts In-Stock

1+ parts

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100+ parts

$4.690

1k+ parts

$3.380

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273

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$4.690

$3.380

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Sensible Micro Corp

USA . 245 parts In-Stock

1+ parts

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245

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Cyclops Electronics Ltd

UK . 103 parts In-Stock

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103

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Semi Source

USA . 100 parts In-Stock

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100

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Bristol Electronics

USA . 57 parts In-Stock

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57

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Lantek

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 6,489 parts In-Stock

1+ parts

$1.820

100+ parts

$1.774

1k+ parts

$1.765

10k+ parts

-

6,489

$1.820

$1.774

$1.765

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Corphita

USA . 122 parts In-Stock

1+ parts

$1.890

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122

$1.890

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Component Stockers USA

USA . 60,466 parts In-Stock

1+ parts

$2.690

100+ parts

$2.350

1k+ parts

$2.330

10k+ parts

$2.490

60,466

$2.690

$2.350

$2.330

$2.490

Modulus Dynamics

Lithuania . 650 parts In-Stock

1+ parts

$2.800

100+ parts

$2.688

1k+ parts

$2.576

10k+ parts

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650

$2.800

$2.688

$2.576

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Argo Parts USA

USA . 2,672 parts In-Stock

1+ parts

$2.819

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2,672

$2.819

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Corohmni

South Africa . 690 parts In-Stock

1+ parts

$3.068

100+ parts

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690

$3.068

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.152

100+ parts

-

1k+ parts

$2.995

10k+ parts

$2.932

2,000

$3.152

-

$2.995

$2.932

CoreStaff

Japan . 2,275 parts In-Stock

1+ parts

$3.280

100+ parts

$2.840

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2,275

$3.280

$2.840

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Aztec Data Supply Inc.

USA . 59 parts In-Stock

1+ parts

$3.811

100+ parts

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59

$3.811

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Continental Prestige Electronics

USA . 9,730 parts In-Stock

1+ parts

$4.020

100+ parts

$2.860

1k+ parts

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9,730

$4.020

$2.860

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$5.982

100+ parts

$5.683

1k+ parts

$5.683

10k+ parts

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2,500

$5.982

$5.683

$5.683

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QUARKTWIN TECHNOLOGY LTD

USA . 27,552 parts In-Stock

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27,552

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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20,000

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Lixinc

USA . 9,671 parts In-Stock

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9,671

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S.R.D Solutions

India . 7,000 parts In-Stock

1+ parts

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7,000

-

-

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A-Z Elektronik GmbH

Germany . 6,318 parts In-Stock

1+ parts

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6,318

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-

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Futuretech Components

Singapore . 5,000 parts In-Stock

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5,000

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Perfect Parts

USA . 448 parts In-Stock

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448

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GreenTree Electronics

Israel . 273 parts In-Stock

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273

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Metaverse IC Inc.

Canada . 258 parts In-Stock

1+ parts

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258

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-

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Kepictronics

USA . 50 parts In-Stock

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100+ parts

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50

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Overview

Experience superior quality and reliability with the S25FL127SABMFI101 by Infineon Technologies. As a trusted manufacturer in the industry, Infineon Technologies brings you cutting-edge flash memory solutions. The S25FL127SABMFI101 offers countless possibilities for applications, with its small outline package and synchronous operating mode. With a nominal supply voltage of 3V, this product ensures efficient power consumption. Its hardware/software write protection feature adds an extra layer of security. Unlock the potential of your devices with the S25FL127SABMFI101 and enjoy the benefits of high-speed data transfer, reliable performance, and long-lasting endurance. Upgrade to excellence today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. The plastic/epoxy package body material ensures durability and protection for the flash memory, making it a good choice for long-lasting usage.

Surface Mount:

YES. The surface mount feature allows for easy installation and integration into various electronic devices, making it a convenient choice for manufacturers.

No. of Functions:

1. With a single function, this flash memory simplifies design and implementation processes, making it suitable for a wide range of applications.

Package Shape:

SQUARE. The square package shape offers compactness and efficient use of space, making it ideal for devices with limited size requirements.

Operating Mode:

SYNCHRONOUS. The synchronous operating mode ensures efficient communication and data transfer, enhancing the overall performance of the product.

Nominal Supply Voltage / Vsup (V):

3. The 3V nominal supply voltage provides a stable power source, contributing to reliable and consistent operation.

Power Supplies (V):

3/3.3. With multiple power supply options, this flash memory can be easily incorporated into existing systems, increasing flexibility and compatibility.

No. of Terminals:

8. The 8 terminals simplify the connection process and enable seamless integration, making it a practical choice for designers and manufacturers.

Package Style (Meter):

SMALL OUTLINE. The small outline package style offers space-saving benefits, making it suitable for devices with limited PCB real estate.

Alternate Memory Width:

4. The alternate memory width of 4 ensures compatibility with various systems and applications, enhancing versatility.

Maximum Operating Temperature:

85 °C. With a maximum operating temperature of 85°C, this flash memory can withstand high-performance and demanding environments.

Organization:

16MX8. The 16MX8 organization allows for efficient data access and management, contributing to faster read and write operations.

Output Characteristics:

3-STATE. The 3-STATE output characteristics enable multiple devices to share the same bus efficiently, making it suitable for multi-device applications.

Minimum Operating Temperature:

40 °C. With a minimum operating temperature of -40°C, this flash memory can withstand extreme cold environments, ensuring reliable performance.

Terminal Finish:

MATTE TIN. The matte tin terminal finish provides excellent electrical conductivity and corrosion resistance, ensuring reliable connections and prolonging product lifespan.

Terminal Position:

DUAL. The dual terminal position allows for flexible installation and PCB layout options, making it adaptable to different design requirements.

Write Protection:

HARDWARE/SOFTWARE. The hardware/software write protection feature ensures data security and prevents accidental data modifications, making it a secure choice for sensitive applications.

Maximum Seated Height:

2.16 mm. With a maximum seated height of 2.16mm, this flash memory can be seamlessly integrated into compact devices, maintaining a slim profile.

Maximum Clock Frequency (fCLK):

108 MHz. The maximum clock frequency of 108 MHz enables rapid data transfer and processing, enhancing overall system performance.

Width:

5.28 mm. The width of 5.28mm ensures space-efficient utilization and compatibility with various PCB layouts, making it suitable for small form factor designs.

Minimum Supply Voltage (Vsup):

2.7 V. The minimum supply voltage of 2.7V ensures compatibility with low power systems, contributing to energy-efficient operation.

Peak Reflow Temperature °C:

260. With a peak reflow temperature of 260°C, this flash memory can withstand high-temperature manufacturing processes, ensuring robustness during production.

Type:

NOR TYPE. The NOR type architecture of this flash memory provides fast random access and read speed, making it suitable for applications requiring quick data access.

Length:

5.28 mm. The length of 5.28mm offers compatibility with various designs and PCB configurations, making it suitable for a wide range of applications.

Programming Voltage (V):

3. The programming voltage of 3V ensures reliable and precise data programming, contributing to accurate and consistent memory functioning.

Temperature Grade:

INDUSTRIAL. With an industrial temperature grade rating, this flash memory is designed to operate in harsh environmental conditions, making it highly durable and reliable.

Technology:

CMOS. The CMOS technology employed in this flash memory reduces power consumption while maintaining high-speed performance, making it energy-efficient and ideal for battery-powered devices.

Parallel or Serial:

SERIAL. The serial interface allows for simplified integration and communication, making it compatible with a wide range of devices and systems.

Terminal Form:

GULL WING. The gull-wing terminal form facilitates easy soldering and ensures secure connections, making it a practical choice for mass production and automated assembly.

Maximum Supply Current:

50 mA. With a maximum supply current of 50mA, this flash memory operates efficiently even under demanding conditions, ensuring stable performance and avoiding power issues.

No. of Words:

16777216 words. The large number of words capacity enables the storage of vast amounts of data, making it suitable for applications requiring extensive memory storage.

Memory Width:

8. The memory width of 8 ensures compatibility with various data formats and systems, enhancing flexibility and versatility.

Minimum Data Retention Time:

20. With a minimum data retention time of 20 years, this flash memory guarantees long-term data preservation, making it reliable for archival and critical applications.

Terminal Pitch:

1.27 mm. The terminal pitch of 1.27mm ensures compatibility with standard PCB designs and facilitates seamless integration into various electronic devices.

No. of Words Code:

16M. The 16M words code allows for efficient addressing and management of stored data, contributing to faster access and retrieval.

Moisture Sensitivity Level (MSL):

3. The moisture sensitivity level of 3 ensures optimal protection against moisture-induced damage, making it suitable for various applications and environments.

Maximum Supply Voltage (Vsup):

3.6 V. The maximum supply voltage of 3.6V provides an extended operating range, enhancing compatibility and versatility.

Endurance:

100000 Write/Erase Cycles. With an endurance of 100,000 write/erase cycles, this flash memory ensures long-lasting performance and data integrity, making it suitable for frequent data updates and modifications.

Serial Bus Type:

SPI. The Serial Peripheral Interface (SPI) bus type allows for fast and efficient data transfer with compatible devices, making it ideal for interconnected systems.

Memory Density:

134217728 bit. The high memory density of 134,217,728 bits enables extensive storage capacity, accommodating large volumes of data and making it suitable for high-demand applications.

Memory IC Type:

FLASH. The flash memory IC type provides non-volatile storage capabilities, allowing for data retention without the need for constant power, making it reliable for critical applications.

Maximum Standby Current:

0.0001 Amp. With a maximum standby current of 0.0001 Amp, this flash memory minimizes power consumption during idle periods, maximizing energy efficiency.

Technical Specifications

Flash Memory S25FL127SABMFI101 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Alternate Memory Width:

4

Maximum Clock Frequency (fCLK):

108 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

5.28 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.16 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5.28 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL127SABMFI101 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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