Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
S29GL256P90TFIR20 by Infineon Technologies is a 256MX1 NOR flash memory with 3.3V supply voltage, operating at -40 to 85°C. It features a small outline package with 56 terminals and offers fast access time of 90ns. Ideal for industrial applications requiring high-density parallel flash memory solutions.
Median Price
$8.470
Lifecycle Status
Suppliers In-Stock
16
In-Stock Inventory
1k+
Avnet
1+ parts
$5.894
100+ parts
-
1k+ parts
10k+ parts
Chip1Stop
$6.270
Arrow
$10.390
$9.678
$8.883
Verical
Mouser Electronics
$10.660
$8.450
$7.430
Rochester
$6.550
$5.860
$5.510
Digiode
$5.956
Freelance Electronics
$6.355
$6.672
$6.291
Nova Conductors
$9.680
DF Sales Co.
$20.000
Chip Stock
Vyrian
Classic Components Corporation
Cyclops Electronics Ltd
Bristol Electronics
Modulus Dynamics
$3.339
$3.205
$3.072
Corohmni
$4.077
Aztec Data Supply Inc.
$5.129
Semicontronic
$5.330
$5.197
$5.170
Corphita
$5.643
Component Stockers USA
$7.060
$6.350
$6.190
Continental Prestige Electronics
$9.486
Microchip USA
$31.300
$30.860
$30.630
$30.410
QUARKTWIN TECHNOLOGY LTD
Perfect Parts
A-Z Elektronik GmbH
Argo Parts USA
Glotronic Ltd.
Metaverse IC Inc.
Authorized Procurement Solutions
Kepictronics
GreenTree Electronics
The plastic/epoxy package body material helps in keeping the product lightweight and durable.
The surface mount feature makes it easy to integrate into circuit boards, saving space and making installation simpler.
Operating at a nominal supply voltage of 3.3V makes it compatible with a wide range of systems and helps in energy efficiency.
The high maximum operating temperature ensures the product can withstand harsh environmental conditions.
The CMOS technology used in this flash memory offers low power consumption and high speed performance.
Flash Memory S29GL256P90TFIR20 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies
Maximum Access Time:
Alternate Memory Width:
Command User Interface:
Common Flash Interface:
Data Polling:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Sectors/Size:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Page Size (words):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Programming Voltage (V):
Qualification:
Ready or Busy:
Maximum Seated Height:
Sector Size (Words):
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Toggle Bit:
Type:
Width:
S29GL256P90TFIR20 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
1N4148
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
BAV99
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NC7WZ17P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
Dc Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Microsemi
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
FDV304P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
Hy Electronic
STM32H753IIT6
STMicroelectronics
STM32H753IIT6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs and 2-Ch 12-Bit DACs, suitable for industrial applications requiring high-speed data processing and connectivity via CAN, ETHERNET, USB, and more.
W25Q80DVUXIETR
Winbond Electronics
W25Q80DVUXIETR by Winbond Electronics is a 1MX8 NOR flash memory with SPI serial bus, operating at up to 104 MHz. It has a supply voltage range of 2.7V to 3.6V and offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed data storage in compact devices.
S25FL512SAGMFIR10
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
S29AL016J70TFI010
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Alternate Memory Width: 8;
AT45DB021E-SSHN-T
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;
IS21ES08G-JCLI
Integrated Silicon Solution
IS21ES08G-JCLI by Integrated Silicon Solution is a 3.3V synchronous flash memory with 8GX8 organization, operating at up to 200MHz clock frequency. Ideal for industrial applications, this MLC NAND type memory offers a memory density of 68719476736 bits and features a very thin profile grid array package with fine pitch terminals.
SST39VF1601-70-4C-EKE
Microchip Technology
SST39VF1601-70-4C-EKE by Microchip is a 3V NOR flash memory with 1Mx16 organization, 512 sectors, and 2K sector size. It operates in asynchronous mode with a max access time of 70ns. Ideal for applications requiring high endurance, such as embedded systems and industrial automation.
MT25QU01GBBB8E12-0SIT
Micron Technology
Micron Technology's MT25QU01GBBB8E12-0SIT is a 1Gx1 Flash Memory IC with 1073741824-bit memory density. Operating at 166MHz, it has a synchronous mode and operates b/w -40 to 85°C. Suitable for industrial applications, this thin-profile GRID ARRAY package offers serial communication with a terminal pitch of 1mm.
S29GL01GS10DHI013
Spansion's S29GL01GS10DHI013 is a 128MX8 NOR flash memory with a package shape of square and a low profile grid array style. It operates asynchronously at a nominal voltage of 3V and has a temperature grade suitable for industrial applications. With a memory density of 1073741824 bit, it offers fast access time of 100 ns and supports data polling.
SST25VF016B-50-4C-QAF
Silicon Storage Technology
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; JESD-609 Code: e4;
MTFC2GMDEA-0MWTA
MTFC2GMDEA-0MWTA by Micron Technology is a 2GX8 flash memory with 17179869184 bit density. Operating at 52 MHz, it has a very thin profile and fine pitch package style suitable for synchronous applications. With a voltage range of 2.7V to 3.6V, it is ideal for high-speed data storage in electronic devices.
S29AL008J70TFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
AT25DF081A-SSH-B
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .00001 Amp;
W25Q128JVSJQ
Winbond Electronics' W25Q128JVSJQ is a 16MX8 NOR Flash Memory with 133 MHz clock frequency, SPI serial bus type. Operating at -40 to 125 °C, it offers 100000 Write/Erase cycles and has a memory density of 134217728 bits. Ideal for industrial applications requiring high-speed data storage in compact devices.
SST39SF010A-70-4I-WHE
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
MT29F4G08ABADAH4-IT:D
Micron Technology's MT29F4G08ABADAH4-IT:D is a 512MX8 SLC NAND flash memory with 3.3V supply, operating at -40 to 85°C. It features a 2K word page size, 128K word sector size, and parallel interface. Ideal for industrial applications requiring fast access times and low standby current.
W25X40CLSNIG
Winbond Electronics' W25X40CLSNIG is a 4Mx1 NOR flash memory with SPI serial bus, operating at up to 104MHz. It has a supply voltage range of 2.7V to 3.6V and offers hardware/software write protection. This small outline package is ideal for industrial applications requiring high endurance and low standby current.
S25FL512SAGBHIC10
Infineon Technologies
Infineon's S25FL512SAGBHIC10 is a 64MX8 NOR flash memory with 512753664-bit density. It operates at 3V, supports SPI serial bus, and has a max clock frequency of 133MHz. Ideal for industrial applications requiring high endurance, it offers 100000 write/erase cycles and hardware/software write protection.
S25FL256SAGBHI200
S25FL256SAGBHI200 by Infineon Technologies is a 64MX4 NOR flash memory with 268MB density. It operates at 3V, has a clock frequency of 133MHz, and offers 100K write/erase cycles. Ideal for industrial applications requiring high endurance and reliable data storage in compact devices.
S25FL128SAGMFIG01
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP16,.4;
N25Q064A11ESE40G
Micron Technology's N25Q064A11ESE40G is a 64Mbit flash memory with synchronous operation, 108MHz clock frequency, and 1.8V programming voltage. Ideal for industrial applications requiring high-speed data storage in small outline packages.
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S29GL128S90TFI020
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 90 ns;
S29GL128S90TFI020 by Infineon Technologies is a 16MX8 NAND flash memory with 128 sectors and 3-STATE output. Operating at 3V, it offers fast access time of 90ns for applications requiring high endurance of 100,000 Write/Erase cycles. With a compact design and low standby current of 0.0001A, it is ideal for space-constrained devices needing reliable non-volatile storage.
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
S29GL032N90TFI040
S29GL032N90TFI040 by Infineon Technologies is a 32Mb NOR flash memory with 2MX16 organization, operating at 3V. It features an industrial temperature grade, parallel interface, and offers fast access time of 90ns. Ideal for applications requiring high-speed data storage in harsh environments.
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Standby Current: .000005 Amp;
S29GL064S70TFI040
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Length: 18.4 mm;
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
Infineon's S29GL064S70TFI040 is an 8MX8 flash memory with a memory density of 67108864 bit. Operating at 3V, it offers a max access time of 70 ns and operates in industrial temperature grades. This parallel memory chip is suitable for applications requiring high-speed data storage and retrieval in harsh environments.
S29GL512T10TFI010
S29GL512T10TFI010 by Infineon Technologies is a 32MX16 flash memory with 536870912 bit density. It operates at 3V, has an access time of 100ns, and supports parallel mode. Ideal for industrial applications requiring high-speed data storage in compact devices.
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Current: 60 mA;
S29GL128S90TFI023
S29GL128S90TFI023 by Infineon Technologies is a 16MX8 NAND flash memory with 128 sectors and 3-STATE output. Operating at 3V, it offers fast access time of 90ns for applications requiring high-speed data storage. With a compact design and small outline package, it is ideal for devices needing reliable non-volatile memory solutions.
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words: 16777216 words;
S29GL512T10TFI020
S29GL512T10TFI020 by Infineon Technologies is a 32MX16 flash memory with 536870912 bit density. It operates at 3V, has 100 ns access time, and supports parallel mode. Ideal for industrial applications requiring high-speed data storage in compact devices.
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Type: NOR TYPE;
S29GL01GS10DHI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: SQUARE; Page Size (words): 16;
S29GL01GS10DHI010 by Infineon Technologies is a 128Mx8 NAND flash memory with 1K sectors, operating at 3V. It features a 32-word page size, 100,000 write/erase cycles endurance, and asynchronous mode. Ideal for applications requiring high-density data storage in devices with low power consumption.
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V;
S29GL128P11FFI010
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, LOW PROFILE;
Supply Digital Components
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