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S26KS512SDPBHM020

Infineon Technologies

S26KS512SDPBHM020 by Infineon Technologies

Infineon's S26KS512SDPBHM020 is a 64MX8 Flash Memory with 536870912 bit memory density. Operating at 1.8V, it offers synchronous mode and parallel interface for fast access time of 96ns. Ideal for automotive applications due to AEC-Q100 screening and TS16949 certification.

Median Price

$26.630

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 327 parts In-Stock

1+ parts

$26.630

100+ parts

$22.720

1k+ parts

$20.040

10k+ parts

-

327

$26.630

$22.720

$20.040

-

DigiKey

USA . 121 parts In-Stock

1+ parts

$26.630

100+ parts

$22.720

1k+ parts

$21.722

10k+ parts

-

121

$26.630

$22.720

$21.722

-

Rochester

USA . 9,496 parts In-Stock

1+ parts

-

100+ parts

$14.900

1k+ parts

$13.330

10k+ parts

$12.540

9,496

-

$14.900

$13.330

$12.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 594 parts In-Stock

1+ parts

$15.713

100+ parts

-

1k+ parts

-

10k+ parts

-

594

$15.713

-

-

-

Nova Conductors

Japan . 93 parts In-Stock

1+ parts

$20.843

100+ parts

-

1k+ parts

-

10k+ parts

-

93

$20.843

-

-

-

Vyrian

USA . 3,143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,143

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,479 parts In-Stock

1+ parts

$3.686

100+ parts

$3.539

1k+ parts

$3.391

10k+ parts

-

3,479

$3.686

$3.539

$3.391

-

Ampacity Inc.

Singapore . 3,174 parts In-Stock

1+ parts

$14.060

100+ parts

-

1k+ parts

-

10k+ parts

-

3,174

$14.060

-

-

-

Corphita

USA . 145 parts In-Stock

1+ parts

$14.886

100+ parts

-

1k+ parts

-

10k+ parts

-

145

$14.886

-

-

-

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$20.840

100+ parts

$19.798

1k+ parts

-

10k+ parts

$18.548

120

$20.840

$19.798

-

$18.548

Continental Prestige Electronics

USA . 833 parts In-Stock

1+ parts

$20.843

100+ parts

-

1k+ parts

-

10k+ parts

$20.426

833

$20.843

-

-

$20.426

Component Stockers USA

USA . 475 parts In-Stock

1+ parts

$21.410

100+ parts

$16.890

1k+ parts

-

10k+ parts

-

475

$21.410

$16.890

-

-

Microchip USA

USA . 1,214 parts In-Stock

1+ parts

$56.830

100+ parts

$55.840

1k+ parts

$55.350

10k+ parts

$54.860

1,214

$56.830

$55.840

$55.350

$54.860

QUARKTWIN TECHNOLOGY LTD

USA . 19,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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19,053

-

-

-

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Argo Parts USA

USA . 701 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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701

-

-

-

-

Perfect Parts

USA . 379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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379

-

-

-

-

Overview

Unlock the power of high-quality Flash Memory with the S26KS512SDPBHM020 by Infineon Technologies. Designed to meet the rigorous standards of AEC-Q100 and TS 16949, this product offers unparalleled reliability and durability for automotive applications. With a memory density of 536870912 bits and lightning-fast access time of 96 ns, it provides seamless performance for your projects. Trust in the expertise and innovation of Infineon Technologies to deliver top-of-the-line solutions that exceed expectations. Elevate your designs with the S26KS512SDPBHM020 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the flash memory chip, ensuring a longer lifespan.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster and more efficient data transfer, making this flash memory ideal for high-performance applications.

Nominal Supply Voltage (V): 1.8

The low nominal supply voltage helps in reducing power consumption, making this flash memory energy efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this flash memory can withstand extreme conditions, making it suitable for automotive and industrial applications.

Organization: 64MX8

The organization of 64 Megabytes by 8 bits allows for efficient data storage and retrieval, making this flash memory suitable for high-capacity storage devices.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance, making this flash memory an efficient choice for various applications.

Memory IC Type: FLASH

Being a flash memory IC, this product offers non-volatile storage capability, allowing data to be retained even when power is removed.

Maximum Access Time: 96 ns

The fast access time ensures quick read and write operations, making this flash memory ideal for applications requiring high-speed data processing.

Technical Specifications

Flash Memory S26KS512SDPBHM020 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

96 ns

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Parallel or Serial:

PARALLEL

Programming Voltage (V):

1.8

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S26KS512SDPBHM020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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