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S26KS128SDPBHI020

Infineon Technologies

S26KS128SDPBHI020 by Infineon Technologies

Infineon's S26KS128SDPBHI020 is a 16Mx8 Flash Memory with 134217728-bit density. Operating at 1.8V, it offers synchronous access and 96ns max access time. Ideal for industrial applications requiring reliable memory storage in a compact grid array package.

Median Price

$7.740

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 338 parts In-Stock

1+ parts

$7.740

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$7.740

-

-

-

Verical

USA . 550 parts In-Stock

1+ parts

$8.690

100+ parts

$6.102

1k+ parts

$6.020

10k+ parts

-

550

$8.690

$6.102

$6.020

-

Mouser Electronics

USA . 873 parts In-Stock

1+ parts

$9.210

100+ parts

$6.660

1k+ parts

$5.600

10k+ parts

$5.530

873

$9.210

$6.660

$5.600

$5.530

Flip Electronics (Authorized)

USA . 658 parts In-Stock

1+ parts

-

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-

1k+ parts

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10k+ parts

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658

-

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Rochester

USA . 460 parts In-Stock

1+ parts

-

100+ parts

$5.040

1k+ parts

$4.510

10k+ parts

$4.240

460

-

$5.040

$4.510

$4.240

DigiKey

USA . 460 parts In-Stock

1+ parts

-

100+ parts

$6.630

1k+ parts

-

10k+ parts

-

460

-

$6.630

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 806 parts In-Stock

1+ parts

$5.320

100+ parts

-

1k+ parts

-

10k+ parts

-

806

$5.320

-

-

-

Flip Electronics

USA . 1,472 parts In-Stock

1+ parts

-

100+ parts

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1,472

-

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

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600

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Vyrian

USA . 248 parts In-Stock

1+ parts

-

100+ parts

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248

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 50 parts In-Stock

1+ parts

$4.760

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.760

-

-

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Corphita

USA . 625 parts In-Stock

1+ parts

$5.040

100+ parts

-

1k+ parts

-

10k+ parts

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625

$5.040

-

-

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Modulus Dynamics

Lithuania . 71 parts In-Stock

1+ parts

$6.524

100+ parts

$6.263

1k+ parts

$6.002

10k+ parts

-

71

$6.524

$6.263

$6.002

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QUARKTWIN TECHNOLOGY LTD

USA . 19,747 parts In-Stock

1+ parts

-

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1k+ parts

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19,747

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-

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Continental Prestige Electronics

USA . 3,255 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,255

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-

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Argo Parts USA

USA . 1,706 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

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1,706

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-

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Glotronic Ltd.

UK . 501 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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501

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-

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Aranea Global

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

-

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-

-

Overview

Experience the ultimate in reliable and high-quality flash memory with the S26KS128SDPBHI020 by Infineon Technologies. This top-of-the-line product boasts a range of advantages, from its durable plastic/epoxy package body material to its synchronous operating mode. Perfect for industrial applications, this grid array package style memory offers 16MX8 organization and a memory density of 134217728 bits. Trust in Infineon Technologies to deliver cutting-edge technology that exceeds expectations and provides unmatched value to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight construction for easy handling and installation.

Surface Mount: YES

Allows for easy integration onto circuit boards for efficient use of space.

Screening Level: AEC-Q100

Meets automotive industry quality standards for reliable performance in vehicles.

Operating Mode: SYNCHRONOUS

Ensures smooth and synchronized data transfer for efficient operation.

Nominal Supply Voltage / Vsup (V): 1.8

Optimal voltage for stable and efficient functioning of the flash memory.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Works reliably even in extreme cold conditions, enhancing its versatility.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed performance.

No. of Words: 16777216 words

Provides ample storage capacity for storing large amounts of data.

Memory Width: 8

Efficient memory organization for fast data retrieval and processing.

Memory Density: 134217728 bit

High memory density for storing a large volume of information in a compact form factor.

Technical Specifications

Flash Memory S26KS128SDPBHI020 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

96 ns

JESD-30 Code:

R-PBGA-B24

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Programming Voltage (V):

1.8

Screening Level:

AEC-Q100

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Position:

BOTTOM

Trade Compliance

S26KS128SDPBHI020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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