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S25FL128SAGMFIG01

Infineon Technologies

S25FL128SAGMFIG01 by Infineon Technologies

S25FL128SAGMFIG01 by Infineon is a 16MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus type, and 100000 write/erase cycles. It is ideal for industrial applications requiring high-speed data storage in small outline packages.

Median Price

$3.419

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 52 parts In-Stock

1+ parts

$2.510

100+ parts

$2.510

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$2.510

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52

$2.510

$2.510

$2.510

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Chip1Stop

Japan . 77 parts In-Stock

1+ parts

$2.840

100+ parts

$2.680

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-

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77

$2.840

$2.680

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Arrow

USA . 1,165 parts In-Stock

1+ parts

$2.848

100+ parts

$2.663

1k+ parts

$2.524

10k+ parts

$2.497

1,165

$2.848

$2.663

$2.524

$2.497

DigiKey

USA . 135 parts In-Stock

1+ parts

$3.990

100+ parts

$3.459

1k+ parts

$3.256

10k+ parts

$3.175

135

$3.990

$3.459

$3.256

$3.175

Farnell

UK . 682 parts In-Stock

1+ parts

$4.080

100+ parts

$2.880

1k+ parts

$2.590

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682

$4.080

$2.880

$2.590

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Mouser Electronics

USA . 189 parts In-Stock

1+ parts

$4.170

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$3.600

1k+ parts

$3.400

10k+ parts

$3.310

189

$4.170

$3.600

$3.400

$3.310

Element14

Singapore . 682 parts In-Stock

1+ parts

$6.550

100+ parts

$5.160

1k+ parts

$4.640

10k+ parts

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682

$6.550

$5.160

$4.640

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Flip Electronics (Authorized)

USA . 19,677 parts In-Stock

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Verical

USA . 1,165 parts In-Stock

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Rochester

USA . 141 parts In-Stock

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-

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$2.090

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$1.870

10k+ parts

$1.760

141

-

$2.090

$1.870

$1.760

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 232 parts In-Stock

1+ parts

$2.812

100+ parts

-

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232

$2.812

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.522

100+ parts

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10

$3.522

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TME

Poland . 88 parts In-Stock

1+ parts

$4.140

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88

$4.140

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Flip Electronics

USA . 18,107 parts In-Stock

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IBS Electronics

USA . 4,230 parts In-Stock

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$3.338

10k+ parts

$3.324

4,230

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$3.338

$3.324

Vyrian

USA . 1,999 parts In-Stock

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Chip Stock

USA . 829 parts In-Stock

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829

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Distributors (Availability)

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Semicontronic

India . 2,282 parts In-Stock

1+ parts

$2.520

100+ parts

$2.457

1k+ parts

$2.444

10k+ parts

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2,282

$2.520

$2.457

$2.444

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Corphita

USA . 546 parts In-Stock

1+ parts

$2.664

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546

$2.664

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Component Stockers USA

USA . 2,880 parts In-Stock

1+ parts

$3.000

100+ parts

$2.820

1k+ parts

$2.940

10k+ parts

-

2,880

$3.000

$2.820

$2.940

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Modulus Dynamics

Lithuania . 3,147 parts In-Stock

1+ parts

$3.066

100+ parts

$2.943

1k+ parts

$2.821

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3,147

$3.066

$2.943

$2.821

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$3.376

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$3.208

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$3.208

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150

$3.376

$3.208

$3.208

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$3.452

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$3.314

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100

$3.452

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$3.314

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Continental Prestige Electronics

USA . 353 parts In-Stock

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$4.910

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$3.510

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353

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Corohmni

South Africa . 691 parts In-Stock

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$5.051

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Aztec Data Supply Inc.

USA . 194 parts In-Stock

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$5.189

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QUARKTWIN TECHNOLOGY LTD

USA . 25,522 parts In-Stock

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Lixinc

USA . 6,307 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Argo Parts USA

USA . 2,212 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,964 parts In-Stock

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Perfect Parts

USA . 280 parts In-Stock

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Metaverse IC Inc.

Canada . 200 parts In-Stock

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Overview

Experience high-quality, reliable flash memory with the S25FL128SAGMFIG01 by Infineon Technologies. Built on a foundation of excellence, this flash memory device offers unparalleled value and benefits to customers across various applications. With its advanced technology and industrial-grade specifications, this product ensures optimal performance, durability, and efficiency. Whether used in automotive, industrial, or consumer electronics, the S25FL128SAGMFIG01 delivers the perfect solution for your memory needs. Trust in Infineon Technologies to provide cutting-edge products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for better handling and protection of the flash memory.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfer, increasing efficiency and performance.

Nominal Supply Voltage: 3V

Optimal supply voltage for efficient operation of the flash memory.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments, suitable for industrial use.

Endurance: 100000 Write/Erase Cycles

High endurance ensures longevity and reliability of the flash memory.

Technical Specifications

Flash Memory S25FL128SAGMFIG01 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

ALSO CONFIGURABLE AS 128M X 1

Alternate Memory Width:

2

Boot Block:

BOTTOM

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

7.5 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL128SAGMFIG01 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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