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S25FL128SAGNFI010

Infineon Technologies

S25FL128SAGNFI010 by Infineon Technologies

S25FL128SAGNFI010 by Infineon Technologies is a NOR type flash memory with 32Mx4 organization and 133MHz clock frequency. It operates at 3V, has SPI serial bus, and offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed data storage in compact form factors.

Median Price

$3.365

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 676 parts In-Stock

1+ parts

$2.460

100+ parts

$1.950

1k+ parts

$1.860

10k+ parts

-

676

$2.460

$1.950

$1.860

-

Newark

USA . 446 parts In-Stock

1+ parts

$3.790

100+ parts

$3.140

1k+ parts

$2.900

10k+ parts

-

446

$3.790

$3.140

$2.900

-

Chip1Stop

Japan . 676 parts In-Stock

1+ parts

$3.980

100+ parts

$3.490

1k+ parts

-

10k+ parts

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676

$3.980

$3.490

-

-

Mouser Electronics

USA . 414 parts In-Stock

1+ parts

$3.990

100+ parts

$3.310

1k+ parts

$2.550

10k+ parts

-

414

$3.990

$3.310

$2.550

-

Element14

Singapore . 471 parts In-Stock

1+ parts

$6.920

100+ parts

$5.990

1k+ parts

$4.710

10k+ parts

-

471

$6.920

$5.990

$4.710

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Flip Electronics (Authorized)

USA . 7,171 parts In-Stock

1+ parts

-

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7,171

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DigiKey

USA . 5,671 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.550

10k+ parts

-

5,671

-

-

$2.550

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Verical

USA . 5,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.940

10k+ parts

-

5,390

-

-

$2.940

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Rochester

USA . 220 parts In-Stock

1+ parts

-

100+ parts

$2.090

1k+ parts

$1.870

10k+ parts

$1.760

220

-

$2.090

$1.870

$1.760

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 932 parts In-Stock

1+ parts

$2.308

100+ parts

-

1k+ parts

-

10k+ parts

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932

$2.308

-

-

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Nova Conductors

Japan . 71 parts In-Stock

1+ parts

$3.882

100+ parts

-

1k+ parts

-

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71

$3.882

-

-

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Chip Stock

USA . 8,038 parts In-Stock

1+ parts

-

100+ parts

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8,038

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-

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Flip Electronics

USA . 5,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,705

-

-

-

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IBS Electronics

USA . 2,704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.405

10k+ parts

$2.366

2,704

-

-

$2.405

$2.366

Vyrian

USA . 1,846 parts In-Stock

1+ parts

-

100+ parts

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1,846

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,964 parts In-Stock

1+ parts

$2.090

100+ parts

$2.038

1k+ parts

$2.027

10k+ parts

-

1,964

$2.090

$2.038

$2.027

-

Corphita

USA . 240 parts In-Stock

1+ parts

$2.187

100+ parts

-

1k+ parts

-

10k+ parts

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240

$2.187

-

-

-

Continental Prestige Electronics

USA . 397 parts In-Stock

1+ parts

$2.580

100+ parts

$1.810

1k+ parts

$1.630

10k+ parts

-

397

$2.580

$1.810

$1.630

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Aztec Data Supply Inc.

USA . 149 parts In-Stock

1+ parts

$2.584

100+ parts

-

1k+ parts

-

10k+ parts

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149

$2.584

-

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Modulus Dynamics

Lithuania . 2,894 parts In-Stock

1+ parts

$2.872

100+ parts

$2.757

1k+ parts

$2.642

10k+ parts

-

2,894

$2.872

$2.757

$2.642

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Corohmni

South Africa . 336 parts In-Stock

1+ parts

$2.872

100+ parts

-

1k+ parts

-

10k+ parts

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336

$2.872

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-

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$2.958

100+ parts

$2.810

1k+ parts

$2.810

10k+ parts

-

2,000

$2.958

$2.810

$2.810

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.882

100+ parts

-

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1,000

$3.882

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Argo Parts USA

USA . 177 parts In-Stock

1+ parts

$3.882

100+ parts

-

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177

$3.882

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Component Stockers USA

USA . 996 parts In-Stock

1+ parts

$4.400

100+ parts

$3.490

1k+ parts

-

10k+ parts

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996

$4.400

$3.490

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QUARKTWIN TECHNOLOGY LTD

USA . 17,361 parts In-Stock

1+ parts

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17,361

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A-Z Elektronik GmbH

Germany . 6,762 parts In-Stock

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6,762

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Perfect Parts

USA . 91 parts In-Stock

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91

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Overview

Unlock endless possibilities with the S25FL128SAGNFI010 by Infineon Technologies. As a leader in flash memory technology, Infineon delivers top-quality products designed for a wide range of applications. From IoT devices to automotive systems, this flash memory offers reliable performance and durability, ensuring your data is safe and secure. With fast write and erase cycles, low power consumption, and a compact design, the S25FL128SAGNFI010 provides unmatched value and convenience. Trust Infineon to bring you cutting-edge solutions for all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the flash memory chip, making it suitable for a wide range of applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and processing, improving overall performance of the flash memory.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this flash memory can withstand harsh environmental conditions and ensure reliability in various applications.

Technology: CMOS

The CMOS technology used in this flash memory enables low power consumption and high speed operation, making it energy efficient and ideal for portable devices.

Memory Density: 134217728 bit

The high memory density of 134217728 bits allows for storing a large amount of data in a compact form factor, making it suitable for memory-intensive applications.

Technical Specifications

Flash Memory S25FL128SAGNFI010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO CONFIGURED AS 256M X 1

Alternate Memory Width:

2

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

8 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

6 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL128SAGNFI010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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