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S26KS256SDPBHI020

Infineon Technologies

S26KS256SDPBHI020 by Infineon Technologies

S26KS256SDPBHI020 by Infineon Technologies is a 32MX8 Flash Memory with 268Mbit density. Operating at 1.8V, it offers synchronous mode and 96ns access time. Ideal for industrial applications requiring high-speed parallel memory with AEC-Q100 screening level compliance.

Median Price

$8.111

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,580 parts In-Stock

1+ parts

-

100+ parts

$7.210

1k+ parts

$6.450

10k+ parts

$6.070

3,580

-

$7.210

$6.450

$6.070

Verical

USA . 2,248 parts In-Stock

1+ parts

-

100+ parts

$9.012

1k+ parts

$8.063

10k+ parts

$7.588

2,248

-

$9.012

$8.063

$7.588

Flip Electronics (Authorized)

USA . 1,356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,356

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 92 parts In-Stock

1+ parts

$7.500

100+ parts

-

1k+ parts

-

10k+ parts

-

92

$7.500

-

-

-

Digiode

USA . 28 parts In-Stock

1+ parts

$7.610

100+ parts

-

1k+ parts

-

10k+ parts

-

28

$7.610

-

-

-

Flip Electronics

USA . 2,396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,396

-

-

-

-

Vyrian

USA . 689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

689

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 64 parts In-Stock

1+ parts

$2.973

100+ parts

$2.854

1k+ parts

$2.735

10k+ parts

-

64

$2.973

$2.854

$2.735

-

Aztec Data Supply Inc.

USA . 4,138 parts In-Stock

1+ parts

$3.804

100+ parts

-

1k+ parts

-

10k+ parts

-

4,138

$3.804

-

-

-

Corohmni

South Africa . 348 parts In-Stock

1+ parts

$5.744

100+ parts

-

1k+ parts

-

10k+ parts

-

348

$5.744

-

-

-

Ampacity Inc.

Singapore . 1,585 parts In-Stock

1+ parts

$6.810

100+ parts

-

1k+ parts

-

10k+ parts

-

1,585

$6.810

-

-

-

Corphita

USA . 818 parts In-Stock

1+ parts

$7.209

100+ parts

-

1k+ parts

-

10k+ parts

-

818

$7.209

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$7.350

100+ parts

-

1k+ parts

$7.056

10k+ parts

-

1,000

$7.350

-

$7.056

-

Continental Prestige Electronics

USA . 3,684 parts In-Stock

1+ parts

$7.500

100+ parts

-

1k+ parts

-

10k+ parts

$7.350

3,684

$7.500

-

-

$7.350

Component Stockers USA

USA . 15 parts In-Stock

1+ parts

$8.120

100+ parts

$7.630

1k+ parts

-

10k+ parts

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15

$8.120

$7.630

-

-

Argo Parts USA

USA . 4,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,450

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Overview

Elevate your devices with the S26KS256SDPBHI020 by Infineon Technologies, a top-of-the-line Flash Memory that guarantees reliability and efficiency. Manufactured by a trusted industry leader, this product boasts AEC-Q100 screening level, making it ideal for automotive applications. Its synchronous operation and industrial temperature grade ensure seamless performance in challenging environments. With a superior memory density of 268435456 bits and fast access time of 96 ns, this Flash Memory is a game-changer for any project. Upgrade to the S26KS256SDPBHI020 and experience unparalleled quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into electronic circuits.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality for automotive applications.

Operating Mode: SYNCHRONOUS

Synchronous operation provides precise timing control and efficient data transfer.

Nominal Supply Voltage (Vsup): 1.8V

Low nominal supply voltage helps in reducing power consumption.

Package Style: GRID ARRAY

Grid array package style offers compact size and high terminal density for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance.

Parallel or Serial: PARALLEL

Parallel operation allows for faster data transfer compared to serial communication.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product is suitable for reflow soldering and has moderate moisture sensitivity.

Maximum Access Time: 96 ns

Low maximum access time ensures quick data retrieval and efficient memory operations.

Technical Specifications

Flash Memory S26KS256SDPBHI020 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

96 ns

JESD-30 Code:

R-PBGA-B24

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Programming Voltage (V):

1.8

Screening Level:

AEC-Q100

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Position:

BOTTOM

Trade Compliance

S26KS256SDPBHI020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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