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S26KS512SDPBHB020

Infineon Technologies

S26KS512SDPBHB020 by Infineon Technologies

Infineon's S26KS512SDPBHB020 is a 64MX8 Flash Memory with 536Mbit density. Operating at 1.8V, it offers fast access time of 96ns in industrial temperatures (-40 to 105°C). Ideal for automotive applications due to AEC-Q100 screening and compact GRID ARRAY package.

Median Price

$11.220

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,135 parts In-Stock

1+ parts

$10.145

100+ parts

-

1k+ parts

-

10k+ parts

-

1,135

$10.145

-

-

-

Verical

USA . 1,135 parts In-Stock

1+ parts

$10.145

100+ parts

-

1k+ parts

-

10k+ parts

-

1,135

$10.145

-

-

-

Chip1Stop

Japan . 1,697 parts In-Stock

1+ parts

$11.600

100+ parts

-

1k+ parts

-

10k+ parts

-

1,697

$11.600

-

-

-

Mouser Electronics

USA . 3,214 parts In-Stock

1+ parts

$15.120

100+ parts

$13.630

1k+ parts

$11.590

10k+ parts

-

3,214

$15.120

$13.630

$11.590

-

DigiKey

USA . 318 parts In-Stock

1+ parts

$19.610

100+ parts

$16.759

1k+ parts

$16.026

10k+ parts

-

318

$19.610

$16.759

$16.026

-

Rochester

USA . 789 parts In-Stock

1+ parts

-

100+ parts

$10.840

1k+ parts

$9.700

10k+ parts

$9.130

789

-

$10.840

$9.700

$9.130

Flip Electronics (Authorized)

USA . 265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

265

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 173 parts In-Stock

1+ parts

$11.737

100+ parts

-

1k+ parts

-

10k+ parts

-

173

$11.737

-

-

-

Nova Conductors

Japan . 28 parts In-Stock

1+ parts

$18.243

100+ parts

-

1k+ parts

-

10k+ parts

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28

$18.243

-

-

-

Vyrian

USA . 1,545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,545

-

-

-

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Flip Electronics

USA . 265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

265

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 75 parts In-Stock

1+ parts

$3.909

100+ parts

$3.753

1k+ parts

$3.596

10k+ parts

-

75

$3.909

$3.753

$3.596

-

Ampacity Inc.

Singapore . 1,360 parts In-Stock

1+ parts

$10.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,360

$10.500

-

-

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Corphita

USA . 315 parts In-Stock

1+ parts

$11.120

100+ parts

-

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315

$11.120

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-

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Continental Prestige Electronics

USA . 2,478 parts In-Stock

1+ parts

$18.243

100+ parts

-

1k+ parts

-

10k+ parts

$17.878

2,478

$18.243

-

-

$17.878

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$18.243

100+ parts

$17.878

1k+ parts

-

10k+ parts

-

2,000

$18.243

$17.878

-

-

Microchip USA

USA . 953 parts In-Stock

1+ parts

$51.100

100+ parts

-

1k+ parts

-

10k+ parts

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953

$51.100

-

-

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Argo Parts USA

USA . 4,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,600

-

-

-

-

RC Electronics

USA . 1,748 parts In-Stock

1+ parts

-

100+ parts

$15.120

1k+ parts

$13.800

10k+ parts

$13.390

1,748

-

$15.120

$13.800

$13.390

Overview

Unlock the power of reliable and high-performance flash memory with the S26KS512SDPBHB020 by Infineon Technologies. Manufactured with top-quality materials and adhering to strict standards, this product offers a seamless synchronous operating mode, making it ideal for a wide range of applications in industrial settings. With a compact package style and impressive memory density of 536870912 bits, customers can trust in the durability and efficiency of this flash memory chip. Elevate your projects with the innovative technology and exceptional value that Infineon Technologies brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the flash memory durable and lightweight, perfect for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making this flash memory suitable for automotive applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer speeds and efficient performance.

Nominal Supply Voltage: 1.8V

Operating at a low supply voltage of 1.8V helps in reducing power consumption and extending battery life.

Memory IC Type: FLASH

Being a flash memory type, it offers non-volatile storage, high-speed data access, and reliability for various applications.

Technical Specifications

Flash Memory S26KS512SDPBHB020 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

96 ns

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Parallel or Serial:

PARALLEL

Programming Voltage (V):

1.8

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S26KS512SDPBHB020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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