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S25FL256SAGBHI200

Infineon Technologies

S25FL256SAGBHI200 by Infineon Technologies

S25FL256SAGBHI200 by Infineon Technologies is a 64MX4 NOR flash memory with 268MB density. It operates at 3V, has a clock frequency of 133MHz, and offers 100K write/erase cycles. Ideal for industrial applications requiring high endurance and reliable data storage in compact devices.

Median Price

$3.325

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 1,161 parts In-Stock

1+ parts

$2.445

100+ parts

$2.321

1k+ parts

-

10k+ parts

-

1,161

$2.445

$2.321

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Newark

USA . 564 parts In-Stock

1+ parts

$3.290

100+ parts

$3.290

1k+ parts

$3.290

10k+ parts

-

564

$3.290

$3.290

$3.290

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Arrow

USA . 712 parts In-Stock

1+ parts

$3.325

100+ parts

-

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712

$3.325

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Chip1Stop

Japan . 1,445 parts In-Stock

1+ parts

$3.720

100+ parts

-

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1,445

$3.720

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DigiKey

USA . 1,691 parts In-Stock

1+ parts

$4.960

100+ parts

$4.281

1k+ parts

$3.998

10k+ parts

$3.939

1,691

$4.960

$4.281

$3.998

$3.939

Element14

Singapore . 66 parts In-Stock

1+ parts

$4.996

100+ parts

$4.160

1k+ parts

$4.004

10k+ parts

-

66

$4.996

$4.160

$4.004

-

Mouser Electronics

USA . 1,837 parts In-Stock

1+ parts

$5.220

100+ parts

$4.500

1k+ parts

$4.140

10k+ parts

$4.030

1,837

$5.220

$4.500

$4.140

$4.030

Farnell

UK . 66 parts In-Stock

1+ parts

$5.284

100+ parts

$4.096

1k+ parts

$3.868

10k+ parts

-

66

$5.284

$4.096

$3.868

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Future Electronics

Canada . 3,380 parts In-Stock

1+ parts

-

100+ parts

$2.930

1k+ parts

$2.870

10k+ parts

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3,380

-

$2.930

$2.870

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Rochester

USA . 2,081 parts In-Stock

1+ parts

-

100+ parts

$2.610

1k+ parts

$2.340

10k+ parts

$2.200

2,081

-

$2.610

$2.340

$2.200

Verical

USA . 1,621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.925

10k+ parts

$2.750

1,621

-

-

$2.925

$2.750

Flip Electronics (Authorized)

USA . 1,496 parts In-Stock

1+ parts

-

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1,496

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 564 parts In-Stock

1+ parts

$2.594

100+ parts

-

1k+ parts

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10k+ parts

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564

$2.594

-

-

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Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$4.150

100+ parts

-

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29

$4.150

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Flip Electronics

USA . 1,496 parts In-Stock

1+ parts

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1,496

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-

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Rutronik

Germany . 1,352 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.170

10k+ parts

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1,352

-

-

$4.170

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IBS Electronics

USA . 1,352 parts In-Stock

1+ parts

-

100+ parts

$4.151

1k+ parts

$4.207

10k+ parts

$3.380

1,352

-

$4.151

$4.207

$3.380

Vyrian

USA . 868 parts In-Stock

1+ parts

-

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868

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Cyclops Electronics Ltd

UK . 502 parts In-Stock

1+ parts

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502

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Martec Srl

Italy . 207 parts In-Stock

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207

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Resion

USA . 14 parts In-Stock

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,985 parts In-Stock

1+ parts

$2.316

100+ parts

$2.223

1k+ parts

$2.131

10k+ parts

-

2,985

$2.316

$2.223

$2.131

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Corphita

USA . 857 parts In-Stock

1+ parts

$2.457

100+ parts

-

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857

$2.457

-

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Semicontronic

India . 695 parts In-Stock

1+ parts

$2.940

100+ parts

$2.866

1k+ parts

$2.852

10k+ parts

-

695

$2.940

$2.866

$2.852

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Corohmni

South Africa . 1,116 parts In-Stock

1+ parts

$3.243

100+ parts

-

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1,116

$3.243

-

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$3.594

100+ parts

$3.271

1k+ parts

$2.947

10k+ parts

-

450

$3.594

$3.271

$2.947

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Component Stockers USA

USA . 13,953 parts In-Stock

1+ parts

$3.950

100+ parts

$3.460

1k+ parts

$3.390

10k+ parts

-

13,953

$3.950

$3.460

$3.390

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Argo Parts USA

USA . 2,039 parts In-Stock

1+ parts

$4.150

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2,039

$4.150

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Netroflash

USA . 50 parts In-Stock

1+ parts

$4.150

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50

$4.150

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Continental Prestige Electronics

USA . 177 parts In-Stock

1+ parts

$4.850

100+ parts

$3.500

1k+ parts

-

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177

$4.850

$3.500

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Aztec Data Supply Inc.

USA . 228 parts In-Stock

1+ parts

$4.870

100+ parts

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228

$4.870

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RC Electronics

USA . 9,631 parts In-Stock

1+ parts

-

100+ parts

$4.120

1k+ parts

$3.760

10k+ parts

$3.650

9,631

-

$4.120

$3.760

$3.650

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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2,500

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A-Z Elektronik GmbH

Germany . 2,319 parts In-Stock

1+ parts

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2,319

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GreenTree Electronics

Israel . 1,690 parts In-Stock

1+ parts

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1,690

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Perfect Parts

USA . 1,136 parts In-Stock

1+ parts

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1,136

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Futuretech Components

Singapore . 375 parts In-Stock

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375

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Formix International (Excess)

India . 256 parts In-Stock

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256

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Overview

Unlock the power of seamless data storage with the S25FL256SAGBHI200 by Infineon Technologies. This Flash Memory device offers unparalleled reliability and performance, thanks to its innovative design and superior manufacturing quality. Ideal for industrial applications, this product provides a secure solution for storing large amounts of data efficiently. Say goodbye to data loss worries and experience the peace of mind that comes with using a top-of-the-line memory solution. Trust Infineon Technologies to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and protection for the internal components of the flash memory, making it resistant to physical damage.

Surface Mount: YES

Surface mount technology allows for easy and secure mounting of the flash memory onto circuit boards, saving space and simplifying the assembly process.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and data transfer, improving overall performance and reliability of the flash memory.

Nominal Supply Voltage / Vsup (V): 3

The 3V supply voltage provides a stable power source for the flash memory, ensuring consistent and reliable operation in various electronic devices.

Power Supplies (V): 3/3.3

Compatibility with both 3V and 3.3V power supplies allows for versatile integration of the flash memory into a wide range of devices without any voltage conversion.

No. of Terminals: 24

The 24 terminals provide ample connection points for efficient data transfer between the flash memory and the device, enhancing overall performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this flash memory can withstand high heat environments and continue to function reliably without overheating.

Minimum Operating Temperature: -40 °C

The flash memory can operate efficiently in extremely low temperature conditions as low as -40°C, offering versatility in different environmental settings.

Write Protection: HARDWARE/SOFTWARE

The availability of both hardware and software write protection options helps prevent accidental data loss or corruption, ensuring data security and integrity.

Width: 6 mm

The compact width of 6mm makes this flash memory suitable for devices with limited space, allowing for easy integration and installation in various electronic products.

Parallel or Serial: SERIAL

Serial data transfer offers a more efficient and reliable communication protocol, enhancing the speed and performance of the flash memory in processing and storing data.

Technical Specifications

Flash Memory S25FL256SAGBHI200 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

ALSO CONFIGURABLE AS 128M X 1

Alternate Memory Width:

2

Boot Block:

BOTTOM

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Type:

NOR TYPE

Width:

6 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL256SAGBHI200 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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