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S25FL256SAGBHVB00

Infineon Technologies

S25FL256SAGBHVB00 by Infineon Technologies

S25FL256SAGBHVB00 by Infineon Technologies is a NOR flash memory with 64MX4 organization, operating at 133 MHz. It has a max temperature of 105°C and endurance of 100K cycles. Ideal for industrial applications requiring high-speed synchronous operation and reliable data storage.

Median Price

$4.619

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2,729 parts In-Stock

1+ parts

$3.480

100+ parts

$3.480

1k+ parts

$3.480

10k+ parts

-

2,729

$3.480

$3.480

$3.480

-

DigiKey

USA . 3,219 parts In-Stock

1+ parts

$5.350

100+ parts

$4.615

1k+ parts

$4.309

10k+ parts

$4.245

3,219

$5.350

$4.615

$4.309

$4.245

Mouser Electronics

USA . 2,967 parts In-Stock

1+ parts

$5.350

100+ parts

$4.620

1k+ parts

$4.250

10k+ parts

-

2,967

$5.350

$4.620

$4.250

-

Chip1Stop

Japan . 17 parts In-Stock

1+ parts

$5.660

100+ parts

$3.840

1k+ parts

$3.420

10k+ parts

-

17

$5.660

$3.840

$3.420

-

Rochester

USA . 390 parts In-Stock

1+ parts

-

100+ parts

$2.950

1k+ parts

$2.640

10k+ parts

$2.490

390

-

$2.950

$2.640

$2.490

Verical

USA . 390 parts In-Stock

1+ parts

-

100+ parts

$3.888

1k+ parts

$3.300

10k+ parts

$3.112

390

-

$3.888

$3.300

$3.112

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 811 parts In-Stock

1+ parts

$3.772

100+ parts

-

1k+ parts

-

10k+ parts

-

811

$3.772

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.060

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.060

-

-

-

Flip Electronics

USA . 4,731 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,731

-

-

-

-

Vyrian

USA . 1,471 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,471

-

-

-

-

DigiKey Marketplace

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 727 parts In-Stock

1+ parts

$3.573

100+ parts

-

1k+ parts

-

10k+ parts

-

727

$3.573

-

-

-

Continental Prestige Electronics

USA . 2,382 parts In-Stock

1+ parts

$4.060

100+ parts

-

1k+ parts

-

10k+ parts

$3.979

2,382

$4.060

-

-

$3.979

Argo Parts USA

USA . 234 parts In-Stock

1+ parts

$4.060

100+ parts

-

1k+ parts

-

10k+ parts

-

234

$4.060

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$4.060

100+ parts

$3.979

1k+ parts

-

10k+ parts

-

100

$4.060

$3.979

-

-

Component Stockers USA

USA . 4,385 parts In-Stock

1+ parts

$4.090

100+ parts

$3.840

1k+ parts

$4.220

10k+ parts

-

4,385

$4.090

$3.840

$4.220

-

Modulus Dynamics

Lithuania . 1,729 parts In-Stock

1+ parts

$4.098

100+ parts

$3.934

1k+ parts

$3.770

10k+ parts

-

1,729

$4.098

$3.934

$3.770

-

Microchip USA

USA . 2,178 parts In-Stock

1+ parts

$16.548

100+ parts

-

1k+ parts

-

10k+ parts

-

2,178

$16.548

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Unlock endless possibilities with the S25FL256SAGBHVB00 by Infineon Technologies. This cutting-edge Flash Memory device boasts unparalleled quality and reliability, making it the perfect choice for a wide range of applications. Whether you're looking to enhance the performance of your industrial machinery or streamline data storage in your automotive systems, this product delivers exceptional value with its high endurance, fast clock frequency, and versatile serial interface. Trust Infineon Technologies to provide innovative solutions that empower you to achieve more.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the product lightweight and durable, making it a good choice for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and making assembly processes smoother.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and coordinated data transfer, enhancing overall performance and reliability of the product.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 105°C makes the product suitable for use in various environmental conditions.

Memory Density: 268435456 bit

With a high memory density, this product can store a large amount of data, making it ideal for applications requiring extensive storage capacity.

Endurance: 100000 Write/Erase Cycles

The high endurance of 100,000 write/erase cycles ensures long-term reliability and durability, making the product suitable for frequent data read/write operations.

Technical Specifications

Flash Memory S25FL256SAGBHVB00 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

ALSO CONFIGURABLE AS 128M X 1

Alternate Memory Width:

2

Boot Block:

BOTTOM

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,4X6,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0003 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Type:

NOR TYPE

Width:

6 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL256SAGBHVB00 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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