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S25FL128LAGNFI013

Infineon Technologies

S25FL128LAGNFI013 by Infineon Technologies

S25FL128LAGNFI013 by Infineon is a 16MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus type. Operating at -40 to 85 °C, it offers 100000 write/erase cycles and has a memory density of 134217728 bit. Ideal for industrial applications requiring high-speed data storage in compact devices.

Median Price

$2.430

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,977 parts In-Stock

1+ parts

$2.030

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-

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2,977

$2.030

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Arrow

USA . 7,975 parts In-Stock

1+ parts

$2.153

100+ parts

-

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7,975

$2.153

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DigiKey

USA . 6,422 parts In-Stock

1+ parts

$2.430

100+ parts

$2.109

1k+ parts

$1.944

10k+ parts

$1.848

6,422

$2.430

$2.109

$1.944

$1.848

Mouser Electronics

USA . 3,802 parts In-Stock

1+ parts

$2.430

100+ parts

$2.110

1k+ parts

$1.950

10k+ parts

$1.840

3,802

$2.430

$2.110

$1.950

$1.840

Newark

USA . 7,740 parts In-Stock

1+ parts

$2.760

100+ parts

$2.500

1k+ parts

$2.370

10k+ parts

-

7,740

$2.760

$2.500

$2.370

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Verical

USA . 7,975 parts In-Stock

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7,975

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Element14

Singapore . 4,000 parts In-Stock

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$4.180

1k+ parts

$4.010

10k+ parts

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4,000

-

$4.180

$4.010

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 661 parts In-Stock

1+ parts

$1.890

100+ parts

-

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661

$1.890

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$2.710

100+ parts

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750

$2.710

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Chip Stock

USA . 25,800 parts In-Stock

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25,800

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Vyrian

USA . 5,273 parts In-Stock

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5,273

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IBS Electronics

USA . 4,000 parts In-Stock

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$1.573

4,000

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$1.573

Flip Electronics

USA . 1,310 parts In-Stock

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1,310

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,949 parts In-Stock

1+ parts

$1.180

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4,949

$1.180

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Corphita

USA . 545 parts In-Stock

1+ parts

$1.791

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545

$1.791

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Argo Parts USA

USA . 2,108 parts In-Stock

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$2.710

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2,108

$2.710

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Continental Prestige Electronics

USA . 1,440 parts In-Stock

1+ parts

$2.710

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$2.656

1,440

$2.710

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-

$2.656

Modulus Dynamics

Lithuania . 5,822 parts In-Stock

1+ parts

$5.100

100+ parts

$4.896

1k+ parts

$4.692

10k+ parts

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5,822

$5.100

$4.896

$4.692

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Corohmni

South Africa . 316 parts In-Stock

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$5.123

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316

$5.123

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Aztec Data Supply Inc.

USA . 3,960 parts In-Stock

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$5.454

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3,960

$5.454

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Lixinc

USA . 7,687 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,601 parts In-Stock

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5,601

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A-Z Elektronik GmbH

Germany . 5,066 parts In-Stock

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Futuretech Components

Singapore . 4,280 parts In-Stock

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Authorized Procurement Solutions

USA . 1,400 parts In-Stock

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Advanced Electronics

New Zealand . 750 parts In-Stock

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750

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Overview

Unlock the power of reliable and high-performance flash memory with the S25FL128LAGNFI013 by Infineon Technologies. Designed to meet the needs of various industrial applications, this product offers unmatched quality and durability. Its advanced features, such as synchronous operation and hardware/software write protection, ensure secure data storage and quick access. With a wide operating temperature range and low power consumption, this flash memory device delivers exceptional value and benefits to customers looking for a reliable solution for their memory storage needs. Trust in Infineon Technologies for top-of-the-line flash memory products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the flash memory chip, ensuring reliability and longevity.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and data transfer, enhancing overall performance of the flash memory.

Nominal Supply Voltage (Vsup): 3V

Standard voltage supply of 3V ensures compatibility with a wide range of systems and devices.

Write Protection: HARDWARE/SOFTWARE

Flexibility in write protection options allows for secure data storage and prevents accidental overwriting of important information.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities, making the flash memory efficient and cost-effective.

Endurance: 100000 Write/Erase Cycles

High endurance rating of 100,000 write/erase cycles ensures long-lasting performance and reliability for frequent data read/write operations.

Technical Specifications

Flash Memory S25FL128LAGNFI013 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

6 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00006 Amp

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL128LAGNFI013 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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