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SST39VF1601-70-4C-B3KE-T

Microchip Technology

SST39VF1601-70-4C-B3KE-T by Microchip Technology

SST39VF1601-70-4C-B3KE-T by Microchip Technology is a 1MX16 NOR flash memory with 512 sectors and 3V nominal voltage. It operates in asynchronous mode, has 100000 write/erase cycles endurance, and supports common flash interface. Ideal for applications requiring fast access time, such as embedded systems and consumer electronics.

Median Price

$3.650

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$3.650

100+ parts

-

1k+ parts

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550

$3.650

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Vyrian

USA . 7,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,959

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,275 parts In-Stock

1+ parts

$3.650

100+ parts

-

1k+ parts

-

10k+ parts

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4,275

$3.650

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Continental Prestige Electronics

USA . 3,509 parts In-Stock

1+ parts

$3.650

100+ parts

-

1k+ parts

-

10k+ parts

$3.577

3,509

$3.650

-

-

$3.577

Netroflash

USA . 500 parts In-Stock

1+ parts

$3.650

100+ parts

-

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500

$3.650

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-

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AZTECH Wire

Italy . 246 parts In-Stock

1+ parts

$6.085

100+ parts

-

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246

$6.085

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Ampacity Inc.

Singapore . 1,005 parts In-Stock

1+ parts

$12.000

100+ parts

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1,005

$12.000

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Microchip USA

USA . 4,960 parts In-Stock

1+ parts

$24.180

100+ parts

$24.030

1k+ parts

$23.960

10k+ parts

$23.880

4,960

$24.180

$24.030

$23.960

$23.880

QUARKTWIN TECHNOLOGY LTD

USA . 14,845 parts In-Stock

1+ parts

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14,845

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Kepictronics

USA . 4,907 parts In-Stock

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4,907

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Fulton Briggs Corp.

USA . 2,174 parts In-Stock

1+ parts

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100+ parts

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2,174

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GreenTree Electronics

Israel . 500 parts In-Stock

1+ parts

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500

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Lixinc

USA . 8 parts In-Stock

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8

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Overview

Unlock the power of cutting-edge technology with the SST39VF1601-70-4C-B3KE-T Flash Memory by Microchip Technology. With a reputation for excellence, Microchip Technology delivers unmatched quality and reliability in their products. This flash memory device is ideal for a wide range of applications, offering lightning-fast data access speeds and high endurance for up to 100,000 write/erase cycles. Experience seamless performance and exceptional value with the SST39VF1601-70-4C-B3KE-T, your ultimate solution for all your memory needs. Trust Microchip Technology to elevate your technology experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and resistance to physical damage, making the product suitable for various applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexible and independent operation of different functions within the flash memory, increasing efficiency and performance.

No. of Terminals: 48

Having 48 terminals allows for multiple connections and interfaces, enabling smooth communication with other devices and systems.

Memory Density: 16777216 bit

With a high memory density of 16777216 bits, this flash memory product offers ample storage capacity for data and applications, accommodating a wide range of needs.

Endurance: 100000 Write/Erase Cycles

The endurance of 100,000 write/erase cycles ensures longevity and reliability, making the product suitable for frequent data read and write operations without compromising performance.

Data Polling: YES

Support for data polling allows for efficient data retrieval and management, enhancing the overall user experience and speed of operations.

Technical Specifications

Flash Memory SST39VF1601-70-4C-B3KE-T attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Access Time:

70 ns

Additional Features:

BOTTOM BOOT BLOCK

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Sectors/Size:

512

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sector Size (Words):

2K

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Toggle Bit:

YES

Type:

NOR TYPE

Width:

6 mm

Trade Compliance

SST39VF1601-70-4C-B3KE-T Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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