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AT25SF081B-SSHD-T

Dialog Semiconductor

AT25SF081B-SSHD-T by Dialog Semiconductor

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;

Median Price

$0.510

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DigiKey

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$0.510

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$0.448

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$0.415

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$0.385

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Mouser Electronics

USA . 11,586 parts In-Stock

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$0.510

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$0.448

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$0.415

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$0.391

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Adafruit Industries

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Nova Conductors

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TME

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$0.440

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Chip Stock

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Vyrian

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Argo Parts USA

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Continental Prestige Electronics

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Netroflash

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USA . 33,773 parts In-Stock

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$0.280

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Technical Specifications

Flash Memory AT25SF081B-SSHD-T attributes and parameters. Explore more Flash Memory devices from Dialog Semiconductor

Specs

Maximum Clock Frequency (fCLK):

108 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.925 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00003 Amp

Maximum Supply Current:

18.5 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

3.9 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

AT25SF081B-SSHD-T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Dialog Semiconductor

TOKYO, Japan, August 31, 2021 JST | LONDON, United Kingdom, August 31, 2021 ― Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Dialog Semiconductor Plc (“Dialog”), a leading provider of battery and power management, Wi-Fi, Bluetooth® low energy and Industrial edge computing solutions, today announced the successful completion of Renesas’ acquisition of the entire issued and to be issued share capital of Dialog. Renesas will fund the cash consideration payable to Dialog shareholders of approximately EUR 4.8 billion (approximately 624.0 billion yen at an exchange rate of 130 yen to the Euro) through a combination of debt, cash on hand and the proceeds of an equity offering of approximately 222.6 billion yen.

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