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M25P32-VME6G

Micron Technology

M25P32-VME6G by Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Power Supplies (V): 3/3.3;

Median Price

$6.325

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.110

100+ parts

-

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10

$1.110

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Component Electronics Inc.

Canada . 19 parts In-Stock

1+ parts

$11.540

100+ parts

$8.650

1k+ parts

$7.500

10k+ parts

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19

$11.540

$8.650

$7.500

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Vyrian

USA . 2,724 parts In-Stock

1+ parts

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2,724

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Digiode

USA . 2,502 parts In-Stock

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Anansix

USA . 2,075 parts In-Stock

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2,075

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LIBRA Elektronik GmbH

Germany . 770 parts In-Stock

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770

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Chip Stock

USA . 611 parts In-Stock

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611

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Martec Srl

Italy . 110 parts In-Stock

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110

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Goldney Electronics S.L.

Spain . 75 parts In-Stock

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75

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Cyclops Electronics Ltd

UK . 58 parts In-Stock

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58

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Dark Horse Electronics

USA . 45 parts In-Stock

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45

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

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BCID Electronics Ltd.

Israel . 5 parts In-Stock

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5

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Bristol Electronics

USA . 4 parts In-Stock

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4

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Zilex Electronics Inc.

Canada . 2 parts In-Stock

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2

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Prism Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 774 parts In-Stock

1+ parts

$1.000

100+ parts

$0.975

1k+ parts

$0.970

10k+ parts

-

774

$1.000

$0.975

$0.970

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Argo Parts USA

USA . 4,798 parts In-Stock

1+ parts

$1.110

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4,798

$1.110

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.110

100+ parts

$1.088

1k+ parts

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10k+ parts

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1,000

$1.110

$1.088

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Continental Prestige Electronics

USA . 878 parts In-Stock

1+ parts

$1.110

100+ parts

-

1k+ parts

-

10k+ parts

$1.088

878

$1.110

-

-

$1.088

Aztec Data Supply Inc.

USA . 1,975 parts In-Stock

1+ parts

$1.985

100+ parts

-

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1,975

$1.985

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IDEA Electronic Components Group

UK . 74 parts In-Stock

1+ parts

$5.452

100+ parts

-

1k+ parts

$4.907

10k+ parts

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74

$5.452

-

$4.907

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Corohmni

South Africa . 190 parts In-Stock

1+ parts

$5.737

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190

$5.737

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$6.603

100+ parts

$6.009

1k+ parts

$5.414

10k+ parts

-

2,000

$6.603

$6.009

$5.414

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Andel Nordic

Denmark . 5,227 parts In-Stock

1+ parts

$8.896

100+ parts

-

1k+ parts

$8.540

10k+ parts

$8.540

5,227

$8.896

-

$8.540

$8.540

MKK Technologies

India . 2,149 parts In-Stock

1+ parts

$10.252

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2,149

$10.252

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DigiPath Technology Company

USA . 2,149 parts In-Stock

1+ parts

$10.252

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2,149

$10.252

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AZTECH Wire

Italy . 487 parts In-Stock

1+ parts

$17.465

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487

$17.465

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Component Stockers USA

USA . 678 parts In-Stock

1+ parts

$99.990

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678

$99.990

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RC Electronics

USA . 40,324 parts In-Stock

1+ parts

-

100+ parts

$1.130

1k+ parts

$1.030

10k+ parts

$1.000

40,324

-

$1.130

$1.030

$1.000

Kepictronics

USA . 11,212 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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Microchip USA

USA . 4,950 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,527 parts In-Stock

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3,527

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Alle Elektronik GmbH

Germany . 3,409 parts In-Stock

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3,409

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Metaverse IC Inc.

Canada . 2,387 parts In-Stock

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2,387

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Corphita

USA . 1,695 parts In-Stock

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1,695

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Parana Technologies

USA . 258 parts In-Stock

1+ parts

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$6.519

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258

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$6.519

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Perfect Parts

USA . 2 parts In-Stock

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2

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Technical Specifications

Flash Memory M25P32-VME6G attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-XDSO-N8

Length:

8 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M25P32-VME6G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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