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M25P40-VMN6TPB

Micron Technology

M25P40-VMN6TPB by Micron Technology

M25P40-VMN6TPB by Micron Technology is a NOR type Flash Memory with 512Kx8 organization, operating at 50 MHz clock frequency. It offers 100000 Write/Erase cycles endurance and SPI serial bus interface. Ideal for industrial applications requiring reliable data storage in a compact form factor.

Median Price

$2.540

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 77,500 parts In-Stock

1+ parts

$2.540

100+ parts

-

1k+ parts

$1.450

10k+ parts

$1.250

77,500

$2.540

-

$1.450

$1.250

Verical

USA . 77,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$2.540

77,500

-

-

-

$2.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,280 parts In-Stock

1+ parts

$2.413

100+ parts

-

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2,280

$2.413

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Vyrian

USA . 82,144 parts In-Stock

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82,144

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Kruse

Germany . 32,480 parts In-Stock

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32,480

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Kruse Electronics AG

Switzerland . 29,980 parts In-Stock

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29,980

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Touchstone Systems

USA . 9,936 parts In-Stock

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9,936

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Cyclops Electronics Ltd

UK . 9,000 parts In-Stock

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Sensible Micro Corp

USA . 6,458 parts In-Stock

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6,458

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EPE Components Inc.

USA . 5,202 parts In-Stock

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5,202

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Component Sense

UK . 5,095 parts In-Stock

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5,095

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Dynamic Solutions

Germany . 4,000 parts In-Stock

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4,000

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Chip Stock

USA . 3,200 parts In-Stock

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3,200

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ComSIT Distribution GmbH

Germany . 2,845 parts In-Stock

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2,845

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ComSIT USA

USA . 2,500 parts In-Stock

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2,500

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Semi Source

USA . 2,328 parts In-Stock

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2,328

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Goldney Electronics S.L.

Spain . 2,123 parts In-Stock

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2,123

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Eagle Technology Solutions

USA . 250 parts In-Stock

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250

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J & M Industries LLC

USA . 234 parts In-Stock

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234

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Prism Electronics

USA . 213 parts In-Stock

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213

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Electronics Depot

USA . 155 parts In-Stock

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155

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Bristol Electronics

USA . 107 parts In-Stock

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107

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Speed Components Ltd

Israel . 90 parts In-Stock

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90

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Atlantic Semiconductor

USA . 69 parts In-Stock

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69

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Tectiva GmbH

Germany . 30 parts In-Stock

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30

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A&K Electronics

USA . 18 parts In-Stock

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18

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Inventory MP

USA . 13 parts In-Stock

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13

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Avant Electronics Limited

UK . 10 parts In-Stock

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10

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 77,455 parts In-Stock

1+ parts

$2.160

100+ parts

$2.106

1k+ parts

$2.095

10k+ parts

-

77,455

$2.160

$2.106

$2.095

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Corphita

USA . 2,006 parts In-Stock

1+ parts

$2.286

100+ parts

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2,006

$2.286

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Corohmni

South Africa . 193 parts In-Stock

1+ parts

$2.970

100+ parts

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193

$2.970

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Aztec Data Supply Inc.

USA . 4,440 parts In-Stock

1+ parts

$4.290

100+ parts

-

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4,440

$4.290

-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$4.614

100+ parts

$4.384

1k+ parts

$4.384

10k+ parts

-

1,000

$4.614

$4.384

$4.384

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Andel Nordic

Denmark . 3,127 parts In-Stock

1+ parts

$9.098

100+ parts

-

1k+ parts

$8.734

10k+ parts

$8.734

3,127

$9.098

-

$8.734

$8.734

Perfect Parts

USA . 357,139 parts In-Stock

1+ parts

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357,139

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Assy Fe

Spain . 109,976 parts In-Stock

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109,976

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S.R.D Solutions

India . 60,500 parts In-Stock

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60,500

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RC Electronics

USA . 43,149 parts In-Stock

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43,149

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Kepictronics

USA . 35,000 parts In-Stock

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35,000

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GreenTree Electronics

Israel . 3,132 parts In-Stock

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3,132

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

-

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Argo Parts USA

USA . 2,723 parts In-Stock

1+ parts

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2,723

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

1+ parts

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2,250

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Continental Prestige Electronics

USA . 2,105 parts In-Stock

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2,105

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Pacific Micro-Tech

USA . 1,823 parts In-Stock

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1,823

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

1+ parts

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1,500

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Stability Electronics

USA . 1,191 parts In-Stock

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1,191

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Cyclops Electronics Ltd (Excess)

UK . 229 parts In-Stock

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229

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Futuretech Components

Singapore . 225 parts In-Stock

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225

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Formix International (Excess)

India . 168 parts In-Stock

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168

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Modulus Dynamics

Lithuania . 82 parts In-Stock

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82

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Bastille Electronics

Australia . 49 parts In-Stock

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49

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Lucentia Tech

USA . 20 parts In-Stock

1+ parts

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100+ parts

$0.889

1k+ parts

$0.889

10k+ parts

$0.889

20

-

$0.889

$0.889

$0.889

ChipstoGo Electronic ltd

UK . 11 parts In-Stock

1+ parts

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11

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Robosynatics

Brazil . 10 parts In-Stock

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10

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-

Overview

Unlock the power of reliable and high-quality flash memory with the M25P40-VMN6TPB by Micron Technology. This versatile product offers endless possibilities in various applications, ensuring seamless performance and efficiency. With a focus on durability and innovation, Micron Technology delivers unparalleled value to customers seeking cutting-edge solutions. Experience the benefits of top-tier technology with the M25P40-VMN6TPB and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, making the product easy to handle and long-lasting.

Operating Mode: SYNCHRONOUS

Allows for efficient and synchronized data transfer, enhancing the overall performance of the flash memory.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat may be a concern.

Memory Density: 4194304 bit

High memory density allows for storing large amounts of data in a compact space, making it ideal for various applications.

Endurance: 100000 Write/Erase Cycles

Withstands frequent write and erase operations, ensuring longevity and reliability of the flash memory.

Technical Specifications

Flash Memory M25P40-VMN6TPB attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

3.9 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M25P40-VMN6TPB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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