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M25P64-VMF6P

Micron Technology

M25P64-VMF6P by Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;

Median Price

$2.800

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 4 parts In-Stock

1+ parts

$2.800

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4

$2.800

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DF Sales Co.

USA . 4 parts In-Stock

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$2.800

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4

$2.800

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Freelance Electronics

USA . 1 parts In-Stock

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$5.051

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1

$5.051

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Touchstone Systems

USA . 6,772 parts In-Stock

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6,772

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Chip Stock

USA . 5,842 parts In-Stock

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Digiode

USA . 4,675 parts In-Stock

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Anansix

USA . 1,429 parts In-Stock

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Vyrian

USA . 1,230 parts In-Stock

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Rebound Electronics

UK . 1,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 941 parts In-Stock

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941

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Inventory MP

USA . 343 parts In-Stock

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343

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Semi Source

USA . 275 parts In-Stock

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275

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First Choice Components Inc.

USA . 201 parts In-Stock

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201

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Goldney Electronics S.L.

Spain . 146 parts In-Stock

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Prism Electronics

USA . 136 parts In-Stock

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136

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Bristol Electronics

USA . 102 parts In-Stock

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102

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Mil-Aero Solutions, Inc.

USA . 59 parts In-Stock

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59

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LIBRA Elektronik GmbH

Germany . 35 parts In-Stock

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Pegasus Components GmbH

Germany . 25 parts In-Stock

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25

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Speed Components Ltd

Israel . 20 parts In-Stock

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20

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Electronics Depot

USA . 12 parts In-Stock

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12

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Sensible Micro Corp

USA . 10 parts In-Stock

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10

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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10

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Sunrise Surplus Inc.

USA . 7 parts In-Stock

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PC Components Company LLC

USA . 4 parts In-Stock

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A2Z Electronics, Inc.

USA . 2 parts In-Stock

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2

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MRC Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Benley Electronics

USA . 2 parts In-Stock

1+ parts

$1.750

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2

$1.750

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$2.397

100+ parts

$2.277

1k+ parts

$2.277

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450

$2.397

$2.277

$2.277

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IDEA Electronic Components Group

UK . 25 parts In-Stock

1+ parts

$2.468

100+ parts

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$2.222

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25

$2.468

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$2.222

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Aztec Data Supply Inc.

USA . 655 parts In-Stock

1+ parts

$2.963

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655

$2.963

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MKK Technologies

India . 2,071 parts In-Stock

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$4.642

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2,071

$4.642

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DigiPath Technology Company

USA . 2,071 parts In-Stock

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$4.642

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2,071

$4.642

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Corohmni

South Africa . 641 parts In-Stock

1+ parts

$5.409

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641

$5.409

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AZTECH Wire

Italy . 878 parts In-Stock

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$19.206

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878

$19.206

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Semicontronic

India . 943 parts In-Stock

1+ parts

$23.000

100+ parts

$22.425

1k+ parts

$22.310

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943

$23.000

$22.425

$22.310

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Component Stockers USA

USA . 695 parts In-Stock

1+ parts

$99.990

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695

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 28,990 parts In-Stock

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28,990

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Metaverse IC Inc.

Canada . 16,381 parts In-Stock

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Perfect Parts

USA . 11,200 parts In-Stock

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GreenTree Electronics

Israel . 10,436 parts In-Stock

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Infinite Electronics LLP (Excess)

. 10,436 parts In-Stock

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10,436

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Epart123

USA . 10,000 parts In-Stock

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$5.770

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S.R.D Solutions

India . 7,500 parts In-Stock

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7,500

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,510 parts In-Stock

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5,510

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Kepictronics

USA . 5,000 parts In-Stock

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CPlus Electronics

USA . 3,785 parts In-Stock

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Corphita

USA . 1,653 parts In-Stock

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1,653

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Argo Parts USA

USA . 1,630 parts In-Stock

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1,630

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Alle Elektronik GmbH

Germany . 1,358 parts In-Stock

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1,358

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Continental Prestige Electronics

USA . 593 parts In-Stock

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593

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Parana Technologies

USA . 182 parts In-Stock

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$2.951

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182

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$2.951

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

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50

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iodParts Technologies Inc.

India . 5 parts In-Stock

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5

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Technical Specifications

Flash Memory M25P64-VMF6P attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

75 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

7.5 mm

Maximum Write Cycle Time (tWC):

15 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M25P64-VMF6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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