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M25P16-VMN6TP

Micron Technology

M25P16-VMN6TP by Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;

Median Price

$0.990

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 27,558 parts In-Stock

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Chip Stock

USA . 10,543 parts In-Stock

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Digiode

USA . 4,889 parts In-Stock

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Dynamic Solutions

Germany . 4,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,586 parts In-Stock

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ComSIT USA

USA . 2,586 parts In-Stock

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K-1 Technologies

USA . 2,500 parts In-Stock

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Martec Srl

Italy . 2,313 parts In-Stock

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Component Sense

UK . 2,278 parts In-Stock

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Sensible Micro Corp

USA . 2,112 parts In-Stock

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Connect4Technologies Inc.

Canada . 1,400 parts In-Stock

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Maritex

Poland . 782 parts In-Stock

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Technoshack Inc.

Canada . 471 parts In-Stock

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Micros

Poland . 446 parts In-Stock

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$0.990

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Anansix

USA . 412 parts In-Stock

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Sea View Technologies

USA . 277 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 271 parts In-Stock

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Vyrian

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Bristol Electronics

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Classic Components Corporation

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A&K Electronics

USA . 80 parts In-Stock

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Nova Conductors

Japan . 68 parts In-Stock

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Inventory MP

USA . 50 parts In-Stock

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Semi Source

USA . 30 parts In-Stock

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Component Electronics Inc.

Canada . 22 parts In-Stock

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Prism Electronics

USA . 18 parts In-Stock

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NexGen Digital

USA . 5 parts In-Stock

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IBS Electronics

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Distributors (Availability)

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Component Stockers USA

USA . 703 parts In-Stock

1+ parts

$1.270

100+ parts

$1.210

1k+ parts

$1.170

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703

$1.270

$1.210

$1.170

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IDEA Electronic Components Group

UK . 2,344 parts In-Stock

1+ parts

$2.493

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$2.244

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2,344

$2.493

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Aztec Data Supply Inc.

USA . 3,569 parts In-Stock

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$3.280

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Corohmni

South Africa . 651 parts In-Stock

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$4.614

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$4.614

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MKK Technologies

India . 1,167 parts In-Stock

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$4.688

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DigiPath Technology Company

USA . 1,167 parts In-Stock

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$4.688

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$4.688

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Semicontronic

India . 493 parts In-Stock

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$15.000

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$14.625

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$14.550

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493

$15.000

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$14.550

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AZTECH Wire

Italy . 599 parts In-Stock

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$19.640

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Perfect Parts

USA . 271,771 parts In-Stock

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Assy Fe

Spain . 72,737 parts In-Stock

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Kepictronics

USA . 50,000 parts In-Stock

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RC Electronics

USA . 36,556 parts In-Stock

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A-Z Elektronik GmbH

Germany . 24,879 parts In-Stock

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Futuretech Components

Singapore . 16,949 parts In-Stock

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Continental Prestige Electronics

USA . 4,441 parts In-Stock

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GreenTree Electronics

Israel . 3,230 parts In-Stock

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Argo Parts USA

USA . 3,049 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

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S.R.D Solutions

India . 1,500 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 813 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Corphita

USA . 212 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Pacific Micro-Tech

USA . 79 parts In-Stock

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Ashlea Components Ltd (Excess)

UK . 58 parts In-Stock

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Component Connect

USA . 58 parts In-Stock

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Parana Technologies

USA . 45 parts In-Stock

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$2.981

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SIE Connect GmbH (Excess)

Germany . 38 parts In-Stock

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Technical Specifications

Flash Memory M25P16-VMN6TP attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

25 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

15 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M25P16-VMN6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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