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MT29F128G08AJAAAWP-IT:A

Micron Technology

MT29F128G08AJAAAWP-IT:A by Micron Technology

MT29F128G08AJAAAWP-IT:A by Micron Technology is a 16GX8 SLC NAND flash memory with 1M sector size. It operates at -40 to 85 °C, has 48 terminals, and consumes up to 50 mA current. Ideal for industrial applications requiring fast access time of 20 ns and high memory density of 137438953472 bit.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 4,883 parts In-Stock

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Vyrian

USA . 4,400 parts In-Stock

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4,400

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Digiode

USA . 999 parts In-Stock

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999

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Nova Conductors

Japan . 63 parts In-Stock

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J2 Sourcing AB

Sweden . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 503 parts In-Stock

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$9.712

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503

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Ampacity Inc.

Singapore . 618 parts In-Stock

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$11.000

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618

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Continental Prestige Electronics

USA . 4,499 parts In-Stock

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Argo Parts USA

USA . 2,454 parts In-Stock

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Corphita

USA . 230 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 37 parts In-Stock

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Overview

Unlock the potential of cutting-edge technology with the MT29F128G08AJAAAWP-IT:A by Micron Technology. As a leader in flash memory, Micron delivers unparalleled quality and reliability. Ideal for industrial applications, this SLC NAND type memory offers lightning-fast access times and low power consumption. With a memory density of 137438953472 bits, this small outline package is designed for optimal performance in demanding environments. Elevate your products with Micron's superior flash memory solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight construction, making it suitable for various applications.

Surface Mount: YES

Enables easy installation and secure mounting on circuit boards.

Maximum Operating Temperature: 85 °C

Allows the flash memory to operate reliably in high temperature environments.

Organization: 16GX8

Offers a high data organization for efficient data storage and retrieval.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance.

Memory Density: 137438953472 bit

Provides a large memory capacity for storing a vast amount of data.

Maximum Access Time: 20 ns

Ensures fast data access and retrieval for improved overall performance.

Technical Specifications

Flash Memory MT29F128G08AJAAAWP-IT:A attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Access Time:

20 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G48

Memory Density:

137438953472 bit

Memory IC Type:

Memory Width:

8

No. of Sectors/Size:

16K

No. of Terminals:

48

No. of Words:

17179869184 words

No. of Words Code:

16G

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Page Size (words):

8K

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Ready or Busy:

YES

Sector Size (Words):

1M

Maximum Standby Current:

.00001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

50 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

NO

Type:

SLC NAND TYPE

Trade Compliance

MT29F128G08AJAAAWP-IT:A Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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