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MT29F8G08ABACAWP-IT:CTR

Micron Technology

MT29F8G08ABACAWP-IT:CTR by Micron Technology

MT29F8G08ABACAWP-IT:CTR by Micron Technology is a 3.3V SLC NAND flash memory with 1GX8 organization, offering 8K sectors and 2K page size. Operating in industrial temperature range (-40 to 85 °C), it has a max endurance of 100k cycles. Ideal for applications requiring high-density, reliable storage solutions.

Median Price

$6.440

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 850 parts In-Stock

1+ parts

$38.500

100+ parts

-

1k+ parts

-

10k+ parts

-

850

$38.500

-

-

-

EBV Elektronik

Germany . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Future Electronics

Canada . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.630

10k+ parts

-

5,000

-

-

$3.630

-

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.328

10k+ parts

$6.039

3,000

-

-

$6.328

$6.039

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.552

10k+ parts

$6.230

3,000

-

-

$6.552

$6.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

$6.455

100+ parts

-

1k+ parts

-

10k+ parts

-

36

$6.455

-

-

-

Digiode

USA . 2,393 parts In-Stock

1+ parts

$6.564

100+ parts

-

1k+ parts

-

10k+ parts

-

2,393

$6.564

-

-

-

Chip Stock

USA . 5,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,765

-

-

-

-

Vyrian

USA . 1,068 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,068

-

-

-

-

Bristol Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$142.634

1k+ parts

-

10k+ parts

-

1,000

-

$142.634

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,249 parts In-Stock

1+ parts

$5.067

100+ parts

-

1k+ parts

-

10k+ parts

$4.965

6,249

$5.067

-

-

$4.965

Aztec Data Supply Inc.

USA . 4,551 parts In-Stock

1+ parts

$5.400

100+ parts

-

1k+ parts

-

10k+ parts

-

4,551

$5.400

-

-

-

Semicontronic

India . 7,980 parts In-Stock

1+ parts

$5.870

100+ parts

$5.723

1k+ parts

$5.694

10k+ parts

-

7,980

$5.870

$5.723

$5.694

-

Ampacity Inc.

Singapore . 2,465 parts In-Stock

1+ parts

$5.870

100+ parts

-

1k+ parts

-

10k+ parts

-

2,465

$5.870

-

-

-

Corphita

USA . 918 parts In-Stock

1+ parts

$6.219

100+ parts

-

1k+ parts

-

10k+ parts

-

918

$6.219

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,615

-

-

-

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Argo Parts USA

USA . 2,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,486

-

-

-

-

Corohmni

South Africa . 1,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,442

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,200

-

-

-

-

GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Advanced Electronics

New Zealand . 105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

105

-

-

-

-

Overview

Enhance your devices with the cutting-edge MT29F8G08ABACAWP-IT:CTR Flash Memory by Micron Technology. This top-quality product boasts reliable performance and durability, making it ideal for a wide range of applications. With a compact design and industrial-grade temperature tolerance, this flash memory offers unmatched value and benefits to customers seeking high-performance storage solutions. Trust Micron Technology to deliver exceptional quality and innovation in every product they offer. Elevate your devices with the MT29F8G08ABACAWP-IT:CTR and experience seamless operation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape is a standard form factor, making it compatible with a wide range of applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode provides fast and efficient data transfer, improving overall system performance.

Nominal Supply Voltage (Vsup): 3.3V

The 3.3V nominal supply voltage ensures compatibility with a variety of systems, offering flexibility in design.

No. of Terminals: 48

With 48 terminals, the product allows for a robust connection interface for reliable data transfer.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style saves space and enables compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in demanding environments.

Organization: 1GX8

The 1GX8 organization provides a good balance between capacity and speed for efficient data storage and retrieval.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the product to function in extreme cold conditions.

No. of Sectors/Size: 8K

With 8K sectors, the product offers efficient data management and organization capabilities.

Terminal Position: DUAL

The dual terminal position enhances connectivity options, ensuring secure and reliable data transmission.

Maximum Seated Height: 1.2 mm

The low maximum seated height makes the product suitable for slim and compact device designs.

Width: 12 mm

The 12mm width provides a compact form factor, suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.7V

The 2.7V minimum supply voltage allows for operation in low power scenarios, extending battery life.

Page Size (words): 2K

The 2K page size optimizes data transfer efficiency, enhancing overall system performance.

Technical Specifications

Flash Memory MT29F8G08ABACAWP-IT:CTR attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Command User Interface:

YES

Data Polling:

NO

Minimum Data Retention Time:

10

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G48

Length:

18.4 mm

Memory Density:

8589934592 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

8K

No. of Terminals:

48

No. of Words:

1073741824 words

No. of Words Code:

1G

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Page Size (words):

2K

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

3.3

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

128K

Maximum Standby Current:

.0001 Amp

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Toggle Bit:

NO

Type:

SLC NAND TYPE

Width:

12 mm

Trade Compliance

MT29F8G08ABACAWP-IT:CTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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