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SST25VF016B-75-4I-S2AF

Microchip Technology

SST25VF016B-75-4I-S2AF by Microchip Technology

SST25VF016B-75-4I-S2AF by Microchip: 16MX1 NOR Flash Memory with 80MHz clock, SPI serial bus. Ideal for industrial applications, offers 100k write/erase cycles and operates at -40 to 85°C. Package style: small outline, terminal finish: nickel palladium gold.

Median Price

$3.895

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

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$1.069

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$1.069

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Bristol Electronics

USA . 179 parts In-Stock

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$6.720

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$2.912

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$2.755

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179

$6.720

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$2.755

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Chip Stock

USA . 21,016 parts In-Stock

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Vyrian

USA . 450 parts In-Stock

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Prism Electronics

USA . 76 parts In-Stock

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ComSIT Distribution GmbH

Germany . 41 parts In-Stock

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ComSIT USA

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Cyclops Electronics Ltd

UK . 12 parts In-Stock

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Semi Source

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Semtec, LLC

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,797 parts In-Stock

1+ parts

$1.069

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$1.048

5,797

$1.069

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$1.048

Argo Parts USA

USA . 1,267 parts In-Stock

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$1.069

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Component Stockers USA

USA . 5,255 parts In-Stock

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$2.020

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$1.920

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$1.860

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Aztec Data Supply Inc.

USA . 2,433 parts In-Stock

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$3.772

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Corohmni

South Africa . 271 parts In-Stock

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$4.181

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Ampacity Inc.

Singapore . 1,515 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 743 parts In-Stock

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Semicontronic

India . 1,100 parts In-Stock

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$20.475

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$20.370

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RC Electronics

USA . 67,679 parts In-Stock

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$0.930

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$0.850

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$0.820

67,679

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S.R.D Solutions

India . 15,000 parts In-Stock

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Perfect Parts

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Kepictronics

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West Coast Incorporated

USA . 5,456 parts In-Stock

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Advanced Electronics

New Zealand . 750 parts In-Stock

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Microchip USA

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GreenTree Electronics

Israel . 286 parts In-Stock

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ChipstoGo Electronic ltd

UK . 148 parts In-Stock

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iodParts Technologies Inc.

India . 35 parts In-Stock

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Overview

Unlock the power of reliable and high-quality flash memory with the SST25VF016B-75-4I-S2AF by Microchip Technology. Designed for industrial applications, this small outline package offers a wide operating temperature range and 16Mx1 organization. With hardware/software write protection and 100,000 write/erase cycles endurance, this NOR type memory IC ensures data integrity and security. Trust in Microchip Technology's expertise in producing top-notch components for your next project. Experience superior performance and durability with the SST25VF016B-75-4I-S2AF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into electronic circuits, saving space and facilitating automated assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data transfer between the flash memory and the system is synchronized, leading to efficient performance.

Power Supplies (V): 3/3.3

Support for a voltage range of 3/3.3V makes the flash memory compatible with a variety of systems and power sources.

Write Protection: HARDWARE/SOFTWARE

Having both hardware and software-based write protection options provides added security for the stored data, preventing accidental overwriting or corruption.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the flash memory.

Endurance: 100000 Write/Erase Cycles

High endurance rating indicates the flash memory's ability to withstand frequent read and write operations, ensuring long-term durability.

Parallel or Serial: SERIAL

Serial interface simplifies communication with other devices, streamlining data transfer and enhancing compatibility in various applications.

Memory Density: 16777216 bit

High memory density allows the flash memory to store a large amount of data in a compact form factor, suitable for diverse storage needs.

Technical Specifications

Flash Memory SST25VF016B-75-4I-S2AF attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

80 MHz

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

5.275 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.16 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5.275 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

SST25VF016B-75-4I-S2AF Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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