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IS21ES04G-JCLI-TR

Integrated Silicon Solution

IS21ES04G-JCLI-TR by Integrated Silicon Solution

IS21ES04G-JCLI-TR by Integrated Silicon Solution is a synchronous flash memory with 4GX8 organization, 34359738368 bit memory density, and operates at industrial temperature grade. It features a very thin profile grid array package with 153 terminals and is suitable for applications requiring high-speed data storage in industrial environments.

Median Price

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Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 3,541 parts In-Stock

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Chip Stock

USA . 2,780 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Sensible Micro Corp

USA . 16 parts In-Stock

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Cyclops Electronics Ltd

UK . 4 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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Corohmni

South Africa . 128 parts In-Stock

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$3.234

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Aztec Data Supply Inc.

USA . 168 parts In-Stock

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$4.150

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AZTECH Wire

Italy . 739 parts In-Stock

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$13.920

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Robosynatics

Brazil . 3,000 parts In-Stock

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Lucentia Tech

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Argo Parts USA

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Futuretech Components

Singapore . 894 parts In-Stock

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Advanced Electronics

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ChipstoGo Electronic ltd

UK . 48 parts In-Stock

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Bastille Electronics

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Overview

Unlock the power of cutting-edge technology with the IS21ES04G-JCLI-TR Flash Memory by Integrated Silicon Solution. Designed for seamless integration and high-performance applications, this memory module offers unmatched reliability and efficiency. Whether you're a tech enthusiast, a professional developer, or a business owner looking to enhance your products, this flash memory is the perfect solution. Trust in the quality and expertise of Integrated Silicon Solution to take your projects to the next level. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and reducing production time.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise and coordinated data transfer, making the product reliable for high-performance applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage provides a standard power source for the product, compatible with most electronic systems.

No. of Terminals: 153

Having 153 terminals allows for a high level of connectivity and functionality in the product, suitable for complex data storage and retrieval tasks.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand extended periods of use in various environmental conditions.

Organization: 4GX8

The 4GX8 organization offers a balance between storage capacity and data access speed, making the product versatile for different applications.

Minimum Operating Temperature: -40 °C

The product can operate efficiently even at extremely low temperatures, ensuring reliable performance in harsh environments.

Maximum Seated Height: 1 mm

With a low seated height of 1mm, the product is slim and space-efficient, fitting well in compact electronic devices.

Width: 11.5 mm

The 11.5mm width of the product allows for easy integration into various electronic designs, accommodating space constraints in devices.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V ensures that the product can operate efficiently even when power sources are limited or fluctuating.

Length: 13 mm

The 13mm length provides a compact form factor for the product, making it suitable for small electronic devices or applications with limited space.

Programming Voltage (V): 3.3

The 3.3V programming voltage simplifies the operation and configuration of the product, ensuring ease of use for developers and designers.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating makes the product rugged and reliable for use in demanding industrial environments.

Technology: CMOS

The use of CMOS technology in the product ensures low power consumption and high-speed performance, making it energy-efficient and reliable.

Parallel or Serial: PARALLEL

The parallel data transfer mode allows for faster and simultaneous read/write operations, enhancing the product's overall data processing capability.

Terminal Form: BALL

The ball terminal form provides a secure and reliable connection to the circuit board, minimizing the risk of connectivity issues or signal loss.

No. of Words: 4294967296 words

With a vast number of words available for storage, the product offers ample capacity for data storage and processing, suitable for large-scale applications.

Memory Width: 8

The 8-bit memory width allows for efficient data handling and processing, making the product versatile for various computational tasks.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch offers precise and compact terminal placement on the circuit board, optimizing space utilization and connectivity.

No. of Words Code: 4G

The 4G words code signifies a high level of memory capacity and data storage capabilities, making the product suitable for demanding applications.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides a buffer for voltage fluctuations, ensuring stable and reliable operation of the product.

Memory Density: 34359738368 bit

The high memory density of 34359738368 bits offers ample space for storing and processing data, making the product efficient for data-intensive applications.

Memory IC Type: FLASH

The use of flash memory technology provides fast read/write speeds and reliable data storage, making the product suitable for high-performance applications.

Technical Specifications

Flash Memory IS21ES04G-JCLI-TR attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

JESD-30 Code:

R-PBGA-B153

Length:

13 mm

Memory Density:

34359738368 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

153

No. of Words:

4294967296 words

No. of Words Code:

4G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

3.3

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.5 mm

Trade Compliance

IS21ES04G-JCLI-TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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