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S29GL064N90TFI040

Infineon Technologies

S29GL064N90TFI040 by Infineon Technologies

Infineon's S29GL064N90TFI040 is a 3V NOR flash memory with 4Mx16 organization, operating at -40 to 85°C. It features an industrial temperature grade, parallel interface, and 8K/64K sector size. Ideal for applications requiring fast access times and high memory density.

Median Price

$6.840

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

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Arrow

USA . 960 parts In-Stock

1+ parts

$6.840

100+ parts

$5.409

1k+ parts

$5.219

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960

$6.840

$5.409

$5.219

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Chip1Stop

Japan . 1 parts In-Stock

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$8.960

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DigiKey

USA . 3,715 parts In-Stock

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$7.350

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Flip Electronics (Authorized)

USA . 3,715 parts In-Stock

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Rochester

USA . 2,079 parts In-Stock

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$3.130

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Verical

USA . 384 parts In-Stock

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Digiode

USA . 469 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Chip Stock

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Cyclops Electronics Ltd

UK . 4,771 parts In-Stock

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Vyrian

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Semi Source

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Bristol Electronics

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J2 Sourcing AB

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Sinequanon

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Zilex Electronics Inc.

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Component Sense

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ACDS - Activité Composants Distribution Service

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Diverse Electronics

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Halfin

Belgium . 96 parts In-Stock

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Tectiva GmbH

Germany . 96 parts In-Stock

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LWI Electronics Inc

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Holdelec - ElecDif-Pro

France . 76 parts In-Stock

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ComSIT Distribution GmbH

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Ashlea Components Ltd

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Sensible Micro Corp

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Inventory MP

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Semtec, LLC

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Component Stockers USA

USA . 6,666 parts In-Stock

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$1.470

100+ parts

$1.390

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$1.350

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$1.470

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.771

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$2.522

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$2.272

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$2.771

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Aztec Data Supply Inc.

USA . 2,331 parts In-Stock

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$2.920

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Semicontronic

India . 1,710 parts In-Stock

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$2.970

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$2.896

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$2.881

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Corphita

USA . 678 parts In-Stock

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$3.141

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Corohmni

South Africa . 419 parts In-Stock

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$3.756

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Continental Prestige Electronics

USA . 4,114 parts In-Stock

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$3.981

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$3.902

4,114

$3.981

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$3.902

Argo Parts USA

USA . 1,623 parts In-Stock

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$3.981

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Netroflash

USA . 100 parts In-Stock

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$3.981

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Modulus Dynamics

Lithuania . 5,162 parts In-Stock

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$4.209

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$4.041

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$3.872

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Perfect Parts

USA . 35,773 parts In-Stock

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S.R.D Solutions

India . 30,000 parts In-Stock

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GreenTree Electronics

Israel . 26,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 16,653 parts In-Stock

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

USA . 11,234 parts In-Stock

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Microchip USA

USA . 11,181 parts In-Stock

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Lixinc

USA . 6,556 parts In-Stock

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Kepictronics

USA . 5,760 parts In-Stock

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Epart123

USA . 4,800 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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CPlus Electronics

USA . 927 parts In-Stock

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ChipstoGo Electronic ltd

UK . 802 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 431 parts In-Stock

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iodParts Technologies Inc.

India . 106 parts In-Stock

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Glotronic Ltd.

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Overview

Unlock the power of reliable and high-performance flash memory with the S29GL064N90TFI040 by Infineon Technologies. Designed with precision and quality in mind, this product offers exceptional value for a wide range of applications. Whether you're looking to enhance the speed and efficiency of your devices or improve data storage capabilities, the S29GL064N90TFI040 delivers unmatched benefits. Trust in Infineon Technologies' expertise and innovation to take your projects to the next level. Choose superior quality, choose the S29GL064N90TFI040.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product reliable and easy to handle.

Surface Mount: YES

This allows for easy and secure installation on circuit boards, improving the overall efficiency of the product.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables independent and simultaneous access to different parts of the memory, enhancing performance.

Nominal Supply Voltage / Vsup (V): 3

A stable supply voltage of 3V ensures consistent performance and reliability of the product.

No. of Terminals: 48

The high number of terminals allow for efficient data transfer and connectivity within the product.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes it suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance even in extreme cold conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Technical Specifications

Flash Memory S29GL064N90TFI040 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

90 ns

Alternate Memory Width:

8

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Sectors/Size:

8,127

No. of Terminals:

48

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Page Size (words):

8/16

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

8K,64K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

12 mm

Trade Compliance

S29GL064N90TFI040 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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