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S25FL256SAGMFI003

Infineon Technologies

S25FL256SAGMFI003 by Infineon Technologies

S25FL256SAGMFI003 by Infineon Tech is a 64MX4 NOR flash memory with 133 MHz clock frequency, SPI serial bus type. Operating at -40 to 85 °C, it has 100k write/erase cycles and 268MB memory density. Ideal for industrial applications requiring high endurance and fast data transfer over SPI interface.

Median Price

$4.582

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,594 parts In-Stock

1+ parts

$3.010

100+ parts

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2,594

$3.010

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Newark

USA . 1,394 parts In-Stock

1+ parts

$3.390

100+ parts

$3.390

1k+ parts

$3.390

10k+ parts

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1,394

$3.390

$3.390

$3.390

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Arrow

USA . 1,415 parts In-Stock

1+ parts

$4.344

100+ parts

$3.480

1k+ parts

$2.851

10k+ parts

-

1,415

$4.344

$3.480

$2.851

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Farnell

UK . 1,497 parts In-Stock

1+ parts

$4.820

100+ parts

$3.620

1k+ parts

$3.450

10k+ parts

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1,497

$4.820

$3.620

$3.450

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DigiKey

USA . 5,089 parts In-Stock

1+ parts

$4.960

100+ parts

$4.281

1k+ parts

$4.042

10k+ parts

$3.887

5,089

$4.960

$4.281

$4.042

$3.887

Mouser Electronics

USA . 2,297 parts In-Stock

1+ parts

$4.960

100+ parts

$4.150

1k+ parts

$3.890

10k+ parts

$3.630

2,297

$4.960

$4.150

$3.890

$3.630

RS (Exports)

UK . 72 parts In-Stock

1+ parts

$5.964

100+ parts

$4.751

1k+ parts

$4.454

10k+ parts

-

72

$5.964

$4.751

$4.454

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Element14

Singapore . 1,721 parts In-Stock

1+ parts

$6.224

100+ parts

$4.966

1k+ parts

$4.571

10k+ parts

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1,721

$6.224

$4.966

$4.571

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Flip Electronics (Authorized)

USA . 35,822 parts In-Stock

1+ parts

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35,822

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Verical

USA . 2,900 parts In-Stock

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$3.296

2,900

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$3.296

Rochester

USA . 24 parts In-Stock

1+ parts

-

100+ parts

$2.610

1k+ parts

$2.340

10k+ parts

$2.200

24

-

$2.610

$2.340

$2.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 204 parts In-Stock

1+ parts

$2.860

100+ parts

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204

$2.860

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Nova Conductors

Japan . 82 parts In-Stock

1+ parts

$5.265

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82

$5.265

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DigiKey Marketplace

USA . 14,450 parts In-Stock

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14,450

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Vyrian

USA . 5,013 parts In-Stock

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5,013

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Flip Electronics

USA . 4,197 parts In-Stock

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4,197

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Bristol Electronics

USA . 2,187 parts In-Stock

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2,187

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Flex Direct, LLC

USA . 2,187 parts In-Stock

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2,187

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IBS Electronics

USA . 1,450 parts In-Stock

1+ parts

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$4.264

1,450

-

-

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$4.264

NexGen Digital

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,968 parts In-Stock

1+ parts

$2.560

100+ parts

$2.496

1k+ parts

$2.483

10k+ parts

-

4,968

$2.560

$2.496

$2.483

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Corphita

USA . 911 parts In-Stock

1+ parts

$2.709

100+ parts

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911

$2.709

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Aztec Data Supply Inc.

USA . 1,003 parts In-Stock

1+ parts

$4.207

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1,003

$4.207

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Continental Prestige Electronics

USA . 1,853 parts In-Stock

1+ parts

$4.810

100+ parts

$3.830

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1,853

$4.810

$3.830

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$5.159

100+ parts

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$4.953

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2,000

$5.159

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$4.953

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Corohmni

South Africa . 473 parts In-Stock

1+ parts

$5.191

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473

$5.191

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Modulus Dynamics

Lithuania . 6,102 parts In-Stock

1+ parts

$5.338

100+ parts

$5.124

1k+ parts

$4.911

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6,102

$5.338

$5.124

$4.911

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$6.070

100+ parts

$5.766

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$5.766

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3,000

$6.070

$5.766

$5.766

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QUARKTWIN TECHNOLOGY LTD

USA . 19,335 parts In-Stock

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Lixinc

USA . 16,352 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,719 parts In-Stock

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Argo Parts USA

USA . 2,164 parts In-Stock

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2,164

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Metaverse IC Inc.

Canada . 1,627 parts In-Stock

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Authorized Procurement Solutions

USA . 1,300 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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300

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Kepictronics

USA . 67 parts In-Stock

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67

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Overview

Enhance your electronic devices with the top-of-the-line S25FL256SAGMFI003 Flash Memory from Infineon Technologies. With a reputation for superior quality and reliability, Infineon Technologies delivers cutting-edge technology that guarantees peak performance. This versatile product is ideal for a wide range of applications, offering unmatched value, benefits, and advantages to customers looking to optimize their systems. Upgrade your devices today with the S25FL256SAGMFI003 and experience the difference in speed, efficiency, and overall performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory chip, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and improving overall efficiency.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures faster and more reliable data transfer, making the flash memory chip ideal for high-performance applications.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level, making it compatible with a wide range of devices and systems.

No. of Terminals: 16

Sufficient terminals for connecting the flash memory chip to other components, ensuring stable and secure data transmission.

Maximum Operating Temperature: 85 °C

Capable of functioning reliably in high-temperature environments, suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures without compromising performance, making it suitable for a variety of operating conditions.

Write Protection: HARDWARE/SOFTWARE

Offers multiple layers of write protection, preventing accidental data loss or corruption.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation, making the flash memory chip energy efficient and reliable.

Technical Specifications

Flash Memory S25FL256SAGMFI003 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO CONFIGURED AS 256M X 1

Alternate Memory Width:

2

Boot Block:

BOTTOM

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

7.5 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL256SAGMFI003 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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