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IS21ES08G-JCLI

Integrated Silicon Solution

IS21ES08G-JCLI by Integrated Silicon Solution

IS21ES08G-JCLI by Integrated Silicon Solution is a 3.3V synchronous flash memory with 8GX8 organization, operating at up to 200MHz clock frequency. Ideal for industrial applications, this MLC NAND type memory offers a memory density of 68719476736 bits and features a very thin profile grid array package with fine pitch terminals.

Median Price

$17.436

Lifecycle Status

EOL

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Nova Conductors

Japan . 77 parts In-Stock

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Martec Srl

Italy . 10,666 parts In-Stock

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ComSIT Distribution GmbH

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Vyrian

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Rebound Electronics

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Bristol Electronics

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Atlantic Semiconductor

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LWI Electronics Inc

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Semtec, LLC

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NexGen Digital

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$2.508

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Corohmni

South Africa . 225 parts In-Stock

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Aztec Data Supply Inc.

USA . 271 parts In-Stock

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AZTECH Wire

Italy . 415 parts In-Stock

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Continental Prestige Electronics

USA . 3,958 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$16.215

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Microchip USA

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S.R.D Solutions

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Argo Parts USA

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iodParts Technologies Inc.

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Lucentia Tech

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GreenTree Electronics

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Overview

Experience the cutting-edge technology of the IS21ES08G-JCLI Flash Memory by Integrated Silicon Solution. With a focus on quality and reliability, ISS is a trusted manufacturer in the industry. This versatile product offers a wide range of applications, providing customers with high-performance memory solutions for their electronic devices. Benefit from the value and advantages that ISS brings to the table with this innovative flash memory product, perfect for industrial-grade environments. Choose ISS for superior quality and performance in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape helps with space-saving and efficient placement on circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data transfer, making this product reliable for high-performance applications.

Nominal Supply Voltage (Vsup): 3.3V

The 3.3V nominal supply voltage provides a stable power source for consistent and reliable performance.

No. of Terminals: 153

With 153 terminals, this product offers a high level of connectivity for versatile usage in various electronic devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch design enhances the product's overall performance and compatibility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the product's durability and reliability in harsh environments.

Organization: 8GX8

The 8GX8 organization provides a high level of memory organization for efficient data storage and retrieval.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for multiple device connections without interference, making this product versatile in usage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

The bottom terminal position ensures easy access and secure connection during installation and maintenance of the product.

Maximum Seated Height: 1 mm

The slim profile with a maximum seated height of 1mm allows for compact design and efficient use of space in devices.

Maximum Clock Frequency (fCLK): 200 MHz

The high maximum clock frequency of 200MHz allows for fast data processing and efficient operation.

Width: 11.5 mm

The compact width of 11.5mm makes this product suitable for use in space-constrained electronic applications.

Minimum Supply Voltage (Vsup): 2.7V

The 2.7V minimum supply voltage ensures low power consumption and efficient energy usage.

Maximum Time At Peak Reflow Temperature: 10s

The maximum time at peak reflow temperature of 10 seconds ensures quick and effective soldering during assembly.

Peak Reflow Temperature: 260 C

The peak reflow temperature of 260°C guarantees secure soldering and proper functioning of the product.

Type: MLC NAND TYPE

The MLC NAND type offers high storage capacity and reliable performance for data-intensive applications.

Length: 13 mm

The compact length of 13mm allows for easy integration into various electronic devices without taking up much space.

Programming Voltage (V): 3.3V

The 3.3V programming voltage ensures precise data programming and storage for efficient operation.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in a wide range of temperature conditions.

Technology: CMOS

The CMOS technology used in this product provides high-speed operation and low power consumption.

Parallel or Serial: PARALLEL

The parallel operation allows for simultaneous data transfer, increasing efficiency and speed of operation.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections, preventing signal loss or interruptions during usage.

No. of Words: 8589934592 words

With a high number of words, this product offers ample storage capacity for storing large amounts of data.

Memory Width: 8

The memory width of 8 bits allows for efficient data processing and storage, making this product suitable for high-performance applications.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm enables precise and secure connection, ensuring stable data transfer and performance.

No. of Words Code: 8G

The 8G words code provides a standardized format for data storage and retrieval, simplifying data management.

Moisture Sensitivity Level (MSL): 3

The MSL 3 level indicates that this product is resistant to moisture, ensuring long-term reliability in various environmental conditions.

Maximum Supply Voltage (Vsup): 3.6V

The 3.6V maximum supply voltage allows for versatile usage and compatibility with a wide range of electronic devices.

Memory Density: 68719476736 bit

The high memory density of 68719476736 bits provides ample storage capacity for storing large amounts of data.

Memory IC Type: FLASH

The FLASH memory IC type offers fast data access and efficient data storage, making this product suitable for high-speed applications.

Technical Specifications

Flash Memory IS21ES08G-JCLI attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

200 MHz

Command User Interface:

NO

Data Polling:

NO

JESD-30 Code:

R-PBGA-B153

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

68719476736 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

153

No. of Words:

8589934592 words

No. of Words Code:

8G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8GX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA153,14X14,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

3.3

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

10

Toggle Bit:

NO

Type:

MLC NAND TYPE

Width:

11.5 mm

Trade Compliance

IS21ES08G-JCLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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