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S29GL064N90TFI030

Infineon Technologies

S29GL064N90TFI030 by Infineon Technologies

S29GL064N90TFI030 by Infineon Technologies is a 3V NOR flash memory with 4MX16 organization, operating at industrial temperature grade. It features an 8K/64K sector size, parallel interface, and asynchronous mode. Ideal for applications requiring fast access times and high memory density.

Median Price

$5.881

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 692 parts In-Stock

1+ parts

$5.881

100+ parts

$5.042

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692

$5.881

$5.042

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Arrow

USA . 420 parts In-Stock

1+ parts

$6.424

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$5.362

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$5.078

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420

$6.424

$5.362

$5.078

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Verical

USA . 420 parts In-Stock

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$5.362

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$5.078

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420

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Flip Electronics (Authorized)

USA . 48 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 45 parts In-Stock

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$4.250

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Digiode

USA . 185 parts In-Stock

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$5.587

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$5.587

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Component Electronics Inc.

Canada . 3 parts In-Stock

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$15.380

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$11.540

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$10.000

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3

$15.380

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Chip Stock

USA . 11,500 parts In-Stock

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Vyrian

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Component Sense

UK . 448 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 168 parts In-Stock

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Bristol Electronics

USA . 118 parts In-Stock

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ACDS - Activité Composants Distribution Service

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A&K Electronics

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Rotakorn

Sweden . 88 parts In-Stock

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Dan-Mar Components

USA . 61 parts In-Stock

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Flip Electronics

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Lantek

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Atlantic Semiconductor

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Semi Source

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J2 Sourcing AB

Sweden . 20 parts In-Stock

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Prism Electronics

USA . 19 parts In-Stock

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Speed Components Ltd

Israel . 16 parts In-Stock

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NexGen Digital

USA . 3 parts In-Stock

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

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Velocity Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 260 parts In-Stock

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$2.017

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260

$2.017

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Modulus Dynamics

Lithuania . 850 parts In-Stock

1+ parts

$3.616

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$3.471

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$3.327

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850

$3.616

$3.471

$3.327

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Aztec Data Supply Inc.

USA . 2,771 parts In-Stock

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$3.979

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$3.979

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Continental Prestige Electronics

USA . 5,129 parts In-Stock

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$4.250

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$4.165

5,129

$4.250

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$4.165

Netroflash

USA . 2,000 parts In-Stock

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$4.250

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$4.038

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$3.952

2,000

$4.250

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$4.038

$3.952

Argo Parts USA

USA . 728 parts In-Stock

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$4.250

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728

$4.250

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Corphita

USA . 158 parts In-Stock

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$5.293

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Semicontronic

India . 264 parts In-Stock

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$10.050

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$9.799

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$9.748

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264

$10.050

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$9.748

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Kepictronics

USA . 19,112 parts In-Stock

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S.R.D Solutions

India . 10,000 parts In-Stock

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Perfect Parts

USA . 9,725 parts In-Stock

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Lixinc

USA . 8,581 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,782 parts In-Stock

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Microchip USA

USA . 4,737 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,732 parts In-Stock

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ChipstoGo Electronic ltd

UK . 75 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 25 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the S29GL064N90TFI030 from Infineon Technologies. This high-quality flash memory device offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. With a compact design and advanced features, this product provides customers with exceptional value and benefits. Experience faster data access, enhanced storage capabilities, and seamless integration with Infineon's innovative solutions. Upgrade your systems today and stay ahead of the competition with the S29GL064N90TFI030.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory, making it suitable for various environments.

Operating Mode: ASYNCHRONOUS

The asynchronous operation allows for independent read and write functions, leading to efficient data management.

Nominal Supply Voltage / Vsup (V): 3

The 3V supply voltage is common and easily accessible, making it compatible with a wide range of devices.

No. of Words: 4194304 words

Having a high number of words allows for storing a large amount of data, making this flash memory suitable for applications requiring high memory capacity.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with extreme temperatures.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the flash memory energy efficient and fast.

Technical Specifications

Flash Memory S29GL064N90TFI030 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

90 ns

Alternate Memory Width:

8

Boot Block:

TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Sectors/Size:

8,127

No. of Terminals:

48

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Page Size (words):

8/16

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

8K,64K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

12 mm

Trade Compliance

S29GL064N90TFI030 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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