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IS21ES08GA-JCLI

Integrated Silicon Solution

IS21ES08GA-JCLI by Integrated Silicon Solution

IS21ES08GA-JCLI by Integrated Silicon Solution is a 3.3V NAND Flash Memory with 8GX8 organization, operating at up to 200MHz clock frequency. It features a very thin profile grid array package suitable for applications requiring high-speed synchronous operation and a memory density of 68719476736 bits.

Median Price

$16.602

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 231 parts In-Stock

1+ parts

$19.041

100+ parts

$11.424

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231

$19.041

$11.424

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EBV Elektronik

Germany . 35,264 parts In-Stock

1+ parts

-

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35,264

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Verical

USA . 148 parts In-Stock

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-

100+ parts

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$14.163

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148

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$14.163

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$14.702

100+ parts

-

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50

$14.702

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Chip Stock

USA . 11,500 parts In-Stock

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11,500

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NAC Semi

USA . 2,365 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$7.860

10k+ parts

$7.270

2,365

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-

$7.860

$7.270

Vyrian

USA . 438 parts In-Stock

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438

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Distributors (Availability)

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Corohmni

South Africa . 974 parts In-Stock

1+ parts

$2.186

100+ parts

-

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974

$2.186

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Aztec Data Supply Inc.

USA . 331 parts In-Stock

1+ parts

$3.300

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331

$3.300

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Continental Prestige Electronics

USA . 243 parts In-Stock

1+ parts

$14.070

100+ parts

$10.810

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243

$14.070

$10.810

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Netroflash

USA . 500 parts In-Stock

1+ parts

$14.702

100+ parts

-

1k+ parts

$13.967

10k+ parts

$13.673

500

$14.702

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$13.967

$13.673

Argo Parts USA

USA . 1,327 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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300

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Authorized Procurement Solutions

USA . 132 parts In-Stock

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132

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Overview

Elevate your device's performance with the IS21ES08GA-JCLI by Integrated Silicon Solution. As a leading manufacturer in the industry, this Flash Memory offers unparalleled quality and reliability for a wide range of applications. With its advanced technology and synchronous operating mode, this product ensures optimal performance at a maximum clock frequency of 200 MHz. Experience seamless functionality and enhanced data storage capabilities with the IS21ES08GA-JCLI, designed to meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient and synchronized data transfer, enhancing overall performance.

Nominal Supply Voltage: 3.3V

Nominal supply voltage of 3.3V provides efficient power usage while maintaining stable performance.

Maximum Operating Temperature: 85°C

With a maximum operating temperature of 85°C, this flash memory can function reliably even in high-temperature environments.

Organization: 8GX8

Organized in a 8GX8 configuration, this flash memory offers efficient organization of data storage.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed performance.

Memory Density: 68719476736 bit

High memory density allows for storing a large amount of data in a compact form factor.

Memory IC Type: FLASH CARD

Being a flash card memory IC type, it offers fast read/write speeds and reliability in data storage.

Technical Specifications

Flash Memory IS21ES08GA-JCLI attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Maximum Clock Frequency (fCLK):

200 MHz

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PBGA-B153

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

68719476736 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

153

No. of Words:

8589934592 words

No. of Words Code:

8G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA153,14X14,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

3.3

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Toggle Bit:

NO

Type:

NAND TYPE

Width:

11.5 mm

Trade Compliance

IS21ES08GA-JCLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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