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M29W640GH70ZA6E

Micron Technology

M29W640GH70ZA6E by Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;

Median Price

$6.390

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 122 parts In-Stock

1+ parts

$3.600

100+ parts

$3.110

1k+ parts

$2.940

10k+ parts

$2.770

122

$3.600

$3.110

$2.940

$2.770

Arrow

USA . 139,051 parts In-Stock

1+ parts

$11.620

100+ parts

$6.390

1k+ parts

$3.660

10k+ parts

$3.160

139,051

$11.620

$6.390

$3.660

$3.160

Verical

USA . 139,051 parts In-Stock

1+ parts

-

100+ parts

$6.390

1k+ parts

$3.660

10k+ parts

$3.160

139,051

-

$6.390

$3.660

$3.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,733 parts In-Stock

1+ parts

$1.406

100+ parts

-

1k+ parts

-

10k+ parts

-

3,733

$1.406

-

-

-

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$2.563

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$2.563

-

-

-

Vyrian

USA . 69,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

69,910

-

-

-

-

Chip Stock

USA . 12,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,100

-

-

-

-

Kruse Electronics AG

Switzerland . 4,488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,488

-

-

-

-

Kruse

Germany . 4,488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,488

-

-

-

-

ARCO, INC.

USA . 4,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,400

-

-

-

-

Anansix

USA . 1,088 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,088

-

-

-

-

Prism Electronics

USA . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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25

-

-

-

-

Connector Distribution Corp

USA . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7

-

-

-

-

Right Parts Inc.

USA . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,675 parts In-Stock

1+ parts

$1.332

100+ parts

-

1k+ parts

-

10k+ parts

-

2,675

$1.332

-

-

-

Continental Prestige Electronics

USA . 3,751 parts In-Stock

1+ parts

$2.563

100+ parts

-

1k+ parts

-

10k+ parts

$2.511

3,751

$2.563

-

-

$2.511

Argo Parts USA

USA . 1,687 parts In-Stock

1+ parts

$2.563

100+ parts

-

1k+ parts

-

10k+ parts

-

1,687

$2.563

-

-

-

IDEA Electronic Components Group

UK . 2,191 parts In-Stock

1+ parts

$4.663

100+ parts

-

1k+ parts

$4.196

10k+ parts

-

2,191

$4.663

-

$4.196

-

MKK Technologies

India . 996 parts In-Stock

1+ parts

$8.768

100+ parts

-

1k+ parts

-

10k+ parts

-

996

$8.768

-

-

-

DigiPath Technology Company

USA . 996 parts In-Stock

1+ parts

$8.768

100+ parts

-

1k+ parts

-

10k+ parts

-

996

$8.768

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,301 parts In-Stock

1+ parts

-

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-

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17,301

-

-

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-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8,000

-

-

-

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Kepictronics

USA . 7,854 parts In-Stock

1+ parts

-

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-

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7,854

-

-

-

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A-Z Elektronik GmbH

Germany . 6,348 parts In-Stock

1+ parts

-

100+ parts

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6,348

-

-

-

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Alle Elektronik GmbH

Germany . 4,232 parts In-Stock

1+ parts

-

100+ parts

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4,232

-

-

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Microchip USA

USA . 2,261 parts In-Stock

1+ parts

-

100+ parts

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2,261

-

-

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Metaverse IC Inc.

Canada . 979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

979

-

-

-

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Parana Technologies

USA . 88 parts In-Stock

1+ parts

-

100+ parts

$5.575

1k+ parts

-

10k+ parts

-

88

-

$5.575

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$2.511

1k+ parts

$2.435

10k+ parts

$2.383

50

-

$2.511

$2.435

$2.383

Perfect Parts

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17

-

-

-

-

Technical Specifications

Flash Memory M29W640GH70ZA6E attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Access Time:

70 ns

Additional Features:

BOTTOM BOOT BLOCK

Alternate Memory Width:

8

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

128

No. of Terminals:

48

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Page Size (words):

4/8

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Toggle Bit:

YES

Type:

NOR TYPE

Width:

6 mm

Trade Compliance

M29W640GH70ZA6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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