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M29W160ET70N6E

Micron Technology

M29W160ET70N6E by Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Functions: 1;

Median Price

$1.139

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 73 parts In-Stock

1+ parts

$1.139

100+ parts

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73

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Chip Stock

USA . 35,900 parts In-Stock

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Cyclops Electronics Ltd

UK . 18,837 parts In-Stock

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Sternenhof Electronics

Switzerland . 6,912 parts In-Stock

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Digiode

USA . 5,414 parts In-Stock

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Dynamic Solutions

Germany . 4,000 parts In-Stock

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North Shore Components

USA . 2,652 parts In-Stock

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Pegasus Components GmbH

Germany . 1,628 parts In-Stock

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Anansix

USA . 1,102 parts In-Stock

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Vyrian

USA . 1,084 parts In-Stock

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J2 Sourcing AB

Sweden . 532 parts In-Stock

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532

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Touchstone Systems

USA . 513 parts In-Stock

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Atlantic Semiconductor

USA . 505 parts In-Stock

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505

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Bristol Electronics

USA . 488 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 201 parts In-Stock

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201

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Diverse Electronics

Canada . 200 parts In-Stock

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200

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Zilex Electronics Inc.

Canada . 90 parts In-Stock

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90

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Inventory MP

USA . 83 parts In-Stock

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83

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A&K Electronics

USA . 68 parts In-Stock

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Rotakorn

Sweden . 68 parts In-Stock

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Tectiva GmbH

Germany . 20 parts In-Stock

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20

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LWI Electronics Inc

India . 8 parts In-Stock

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8

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Prism Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,173 parts In-Stock

1+ parts

$1.139

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3,173

$1.139

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Continental Prestige Electronics

USA . 2,293 parts In-Stock

1+ parts

$1.139

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$1.116

2,293

$1.139

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-

$1.116

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.139

100+ parts

$1.116

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1,000

$1.139

$1.116

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$1.295

100+ parts

$1.191

1k+ parts

$1.116

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350

$1.295

$1.191

$1.116

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IDEA Electronic Components Group

UK . 1,642 parts In-Stock

1+ parts

$1.875

100+ parts

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1k+ parts

$1.687

10k+ parts

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1,642

$1.875

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$1.687

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MKK Technologies

India . 839 parts In-Stock

1+ parts

$3.526

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839

$3.526

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DigiPath Technology Company

USA . 839 parts In-Stock

1+ parts

$3.526

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839

$3.526

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Corohmni

South Africa . 335 parts In-Stock

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$4.719

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335

$4.719

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Aztec Data Supply Inc.

USA . 973 parts In-Stock

1+ parts

$5.779

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973

$5.779

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AZTECH Wire

Italy . 507 parts In-Stock

1+ parts

$6.112

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507

$6.112

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Semicontronic

India . 498 parts In-Stock

1+ parts

$25.000

100+ parts

$24.375

1k+ parts

$24.250

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498

$25.000

$24.375

$24.250

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Component Stockers USA

USA . 527 parts In-Stock

1+ parts

$99.990

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527

$99.990

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Perfect Parts

USA . 60,019 parts In-Stock

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60,019

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GreenTree Electronics

Israel . 50,000 parts In-Stock

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RC Electronics

USA . 40,577 parts In-Stock

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$1.140

1k+ parts

$1.040

10k+ parts

$1.010

40,577

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$1.140

$1.040

$1.010

Kepictronics

USA . 37,916 parts In-Stock

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S.R.D Solutions

India . 30,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 28,889 parts In-Stock

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Lixinc

USA . 18,214 parts In-Stock

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Assy Fe

Spain . 6,218 parts In-Stock

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Corphita

USA . 5,968 parts In-Stock

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ChipstoGo Electronic ltd

UK . 3,625 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,717 parts In-Stock

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Parana Technologies

USA . 1,257 parts In-Stock

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$2.242

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$2.242

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Microchip USA

USA . 421 parts In-Stock

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421

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Computer Components Inc. - USA

USA . 96 parts In-Stock

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96

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Speed Components Ltd (Excess)

Israel . 57 parts In-Stock

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57

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iodParts Technologies Inc.

India . 20 parts In-Stock

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Technical Specifications

Flash Memory M29W160ET70N6E attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Access Time:

70 ns

Additional Features:

TOP BOOT BLOCK

Alternate Memory Width:

8

Boot Block:

TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

1,2,1,31

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

YES

Type:

NOR TYPE

Width:

12 mm

Trade Compliance

M29W160ET70N6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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