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M29W320DB70N6E

STMicroelectronics

M29W320DB70N6E by STMicroelectronics

STMicroelectronics M29W320DB70N6E is a 32Mb NOR Flash Memory with 2MX16 organization, operating at 3.3V. It features asynchronous mode, industrial temperature grade, and parallel interface. Ideal for applications requiring fast access time and reliable data storage in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

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Chip Stock

USA . 17,901 parts In-Stock

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Digiode

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Cyclops Electronics Ltd

UK . 5,909 parts In-Stock

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A&K Electronics

USA . 4,564 parts In-Stock

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Dynamic Solutions

Germany . 4,000 parts In-Stock

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Rotakorn

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J2 Sourcing AB

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Sensible Micro Corp

USA . 1,161 parts In-Stock

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Vyrian

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Anansix

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Nova Conductors

Japan . 750 parts In-Stock

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Velocity Electronics

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Bristol Electronics

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North Shore Components

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EZ Electronic Parts

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NexGen Digital

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Prism Electronics

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

France . 12 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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NAC Semi

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Distributors (Availability)

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Semicontronic

India . 806 parts In-Stock

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$3.000

100+ parts

$2.925

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$2.910

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806

$3.000

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$2.910

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IDEA Electronic Components Group

UK . 1,064 parts In-Stock

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$3.758

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$3.382

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$3.758

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$3.382

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Aztec Data Supply Inc.

USA . 1,549 parts In-Stock

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$5.051

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Corohmni

South Africa . 69 parts In-Stock

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$5.292

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MKK Technologies

India . 1,423 parts In-Stock

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$7.067

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DigiPath Technology Company

USA . 1,423 parts In-Stock

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$7.067

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AZTECH Wire

Italy . 636 parts In-Stock

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$12.022

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636

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Component Stockers USA

USA . 236 parts In-Stock

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$99.990

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RC Electronics

USA . 65,033 parts In-Stock

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$0.810

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$0.740

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$0.720

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A-Z Elektronik GmbH

Germany . 24,684 parts In-Stock

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Perfect Parts

USA . 24,588 parts In-Stock

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Kepictronics

USA . 23,790 parts In-Stock

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Lixinc

USA . 10,851 parts In-Stock

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Corphita

USA . 4,959 parts In-Stock

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Assy Fe

Spain . 3,308 parts In-Stock

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Futuretech Components

Singapore . 3,229 parts In-Stock

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USA . 2,702 parts In-Stock

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GreenTree Electronics

Israel . 2,304 parts In-Stock

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Authorized Procurement Solutions

USA . 2,304 parts In-Stock

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Continental Prestige Electronics

USA . 1,421 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,152 parts In-Stock

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Parana Technologies

USA . 924 parts In-Stock

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$4.494

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S.R.D Solutions

India . 900 parts In-Stock

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Argo Parts USA

USA . 581 parts In-Stock

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Microchip USA

USA . 462 parts In-Stock

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Infinite Electronics LLP (Excess)

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Bastille Electronics

Australia . 26 parts In-Stock

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Overview

STMicroelectronics presents the M29W320DB70N6E, a top-tier Flash Memory solution that guarantees superior quality and reliability. This versatile product is ideal for a wide range of applications, providing customers with exceptional value and performance. With STMicroelectronics' reputation for innovation and excellence in technology, you can trust that the M29W320DB70N6E will meet and exceed your expectations, delivering seamless functionality and unparalleled benefits for all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the flash memory, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time during production and assembly.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for efficient data transfer without the need for synchronization signals, improving overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage of 3.3V, making it compatible with a wide range of devices and systems.

Width: 12 mm

Compact width of 12 mm enables the flash memory to be easily integrated into space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial grade temperature tolerance ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Memory IC Type: FLASH

Flash memory technology provides non-volatile storage, allowing data to be retained even when power is removed, making it ideal for storing critical information.

Technical Specifications

Flash Memory M29W320DB70N6E attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

BOTTOM BOOT BLOCK

Alternate Memory Width:

8

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3/e6

Length:

18.4 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

1,2,1,63

No. of Terminals:

48

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Toggle Bit:

YES

Type:

NOR TYPE

Width:

12 mm

Trade Compliance

M29W320DB70N6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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