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S25FL128LAGMFI010

Infineon Technologies

S25FL128LAGMFI010 by Infineon Technologies

S25FL128LAGMFI010 by Infineon is a NOR type flash memory with 16MX8 organization, operating at up to 133 MHz clock frequency. It offers 100000 write/erase cycles and has a memory density of 134217728 bits. Ideal for industrial applications requiring high-speed synchronous operation and reliable data storage.

Median Price

$2.415

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 461 parts In-Stock

1+ parts

$2.146

100+ parts

$1.684

1k+ parts

$1.650

10k+ parts

$1.573

461

$2.146

$1.684

$1.650

$1.573

Newark

USA . 2,387 parts In-Stock

1+ parts

$2.250

100+ parts

$2.010

1k+ parts

$1.940

10k+ parts

-

2,387

$2.250

$2.010

$1.940

-

Chip1Stop

Japan . 1,614 parts In-Stock

1+ parts

$2.400

100+ parts

-

1k+ parts

-

10k+ parts

-

1,614

$2.400

-

-

-

Mouser Electronics

USA . 1,279 parts In-Stock

1+ parts

$2.430

100+ parts

$2.110

1k+ parts

$1.940

10k+ parts

$1.830

1,279

$2.430

$2.110

$1.940

$1.830

Farnell

UK . 175 parts In-Stock

1+ parts

$2.660

100+ parts

$2.270

1k+ parts

$2.150

10k+ parts

-

175

$2.660

$2.270

$2.150

-

DigiKey

USA . 7,995 parts In-Stock

1+ parts

$2.780

100+ parts

$2.412

1k+ parts

$2.270

10k+ parts

$2.214

7,995

$2.780

$2.412

$2.270

$2.214

Element14

Singapore . 175 parts In-Stock

1+ parts

$4.220

100+ parts

$3.600

1k+ parts

$3.420

10k+ parts

$3.160

175

$4.220

$3.600

$3.420

$3.160

Verical

USA . 5,450 parts In-Stock

1+ parts

-

100+ parts

$1.940

1k+ parts

$1.806

10k+ parts

$1.693

5,450

-

$1.940

$1.806

$1.693

Rochester

USA . 1,436 parts In-Stock

1+ parts

-

100+ parts

$1.430

1k+ parts

$1.280

10k+ parts

$1.210

1,436

-

$1.430

$1.280

$1.210

RS (Exports)

UK . 223 parts In-Stock

1+ parts

-

100+ parts

$3.593

1k+ parts

$3.047

10k+ parts

-

223

-

$3.593

$3.047

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 636 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

-

10k+ parts

-

636

$1.520

-

-

-

Nova Conductors

Japan . 47 parts In-Stock

1+ parts

$3.234

100+ parts

-

1k+ parts

-

10k+ parts

-

47

$3.234

-

-

-

TME

Poland . 1,219 parts In-Stock

1+ parts

$4.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,219

$4.910

-

-

-

Mobius Materials

USA . 2,376 parts In-Stock

1+ parts

$5.004

100+ parts

$4.014

1k+ parts

-

10k+ parts

-

2,376

$5.004

$4.014

-

-

Chip Stock

USA . 11,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,360

-

-

-

-

Flip Electronics

USA . 2,793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,793

-

-

-

-

DigiKey Marketplace

USA . 2,793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,793

-

-

-

-

Vyrian

USA . 1,375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,375

-

-

-

-

ComSIT Distribution GmbH

Germany . 821 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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821

-

-

-

-

Mil-Aero Solutions, Inc.

USA . 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,867 parts In-Stock

1+ parts

$1.360

100+ parts

-

1k+ parts

-

10k+ parts

-

1,867

$1.360

-

-

-

Semicontronic

India . 1,701 parts In-Stock

1+ parts

$1.360

100+ parts

$1.326

1k+ parts

$1.319

10k+ parts

-

1,701

$1.360

$1.326

$1.319

-

Corphita

USA . 607 parts In-Stock

1+ parts

$1.440

100+ parts

-

1k+ parts

-

10k+ parts

-

607

$1.440

-

-

-

Argo Parts USA

USA . 4,530 parts In-Stock

1+ parts

$3.098

100+ parts

-

1k+ parts

-

10k+ parts

-

4,530

$3.098

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.234

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$3.234

-

-

-

Aztec Data Supply Inc.

USA . 1,989 parts In-Stock

1+ parts

$3.879

100+ parts

-

1k+ parts

-

10k+ parts

-

1,989

$3.879

-

-

-

Continental Prestige Electronics

USA . 2,128 parts In-Stock

1+ parts

$4.050

100+ parts

$2.880

1k+ parts

-

10k+ parts

-

2,128

$4.050

$2.880

-

-

Modulus Dynamics

Lithuania . 5,512 parts In-Stock

1+ parts

$4.626

100+ parts

$4.441

1k+ parts

$4.256

10k+ parts

-

5,512

$4.626

$4.441

$4.256

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$5.456

100+ parts

$5.183

1k+ parts

$5.183

10k+ parts

-

10

$5.456

$5.183

$5.183

-

Corohmni

South Africa . 278 parts In-Stock

1+ parts

$5.819

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$5.819

-

-

-

Lixinc

USA . 3,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,071

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Infinite Electronics LLP (Excess)

. 1,051 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,051

-

-

-

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GreenTree Electronics

Israel . 1,044 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,044

-

-

-

-

Futuretech Components

Singapore . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

-

-

-

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Perfect Parts

USA . 264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

264

-

-

-

-

Overview

Elevate your project with the S25FL128LAGMFI010 by Infineon Technologies, a top-tier flash memory solution that brings unparalleled reliability and performance to the table. Crafted with precision and expertise, this product boasts a wide range of applications in various industries. From its durable plastic/epoxy package body to its efficient synchronous operating mode, every detail is designed to maximize value for customers. Say goodbye to data loss worries and hello to seamless functionality with this cutting-edge technology that offers 100,000 write/erase cycles and a fast clock frequency of up to 133 MHz. Upgrade your system today with the Infineon advantage.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy makes the package lightweight and durable, suitable for portable devices.

Surface Mount: YES

The ability to be surface mounted allows for easy integration into circuit boards, saving space and reducing assembly time.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise timing and faster data transfer speeds, enhancing overall performance.

Nominal Supply Voltage: 3V

The low voltage requirement of 3V makes this product energy efficient, extending battery life in devices.

Max Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in harsh environments or industrial applications.

Output Characteristics: 3-STATE

The 3-state output allows for tristate logic, enabling multiple devices to share a common bus without interference.

Write Protection: HARDWARE/SOFTWARE

The option for both hardware and software write protection adds an extra layer of security to prevent accidental data loss or tampering.

Maximum Clock Frequency: 133 MHz

The high maximum clock frequency of 133 MHz enables fast read and write speeds, ideal for applications requiring quick data access.

Memory Density: 134217728 bit

With a high memory density, this flash memory can store a large amount of data in a compact package, making it suitable for storing multimedia files or complex programs.

Technical Specifications

Flash Memory S25FL128LAGMFI010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

5.28 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

2.16 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00006 Amp

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5.28 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL128LAGMFI010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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