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S25FL256SAGNFI003

Infineon Technologies

S25FL256SAGNFI003 by Infineon Technologies

S25FL256SAGNFI003 by Infineon is a 64MX4 NOR flash memory with 268MB density. It operates at 3V, has SPI serial interface, and supports up to 133MHz clock frequency. Ideal for industrial applications requiring high endurance with 100k write/erase cycles.

Median Price

$4.950

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4,919 parts In-Stock

1+ parts

$3.710

100+ parts

$3.670

1k+ parts

$3.660

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4,919

$3.710

$3.670

$3.660

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Newark

USA . 5,054 parts In-Stock

1+ parts

$4.150

100+ parts

$3.290

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$3.150

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5,054

$4.150

$3.290

$3.150

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Farnell

UK . 5,679 parts In-Stock

1+ parts

$4.950

100+ parts

$3.630

1k+ parts

$3.390

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5,679

$4.950

$3.630

$3.390

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DigiKey

USA . 22,077 parts In-Stock

1+ parts

$4.960

100+ parts

$4.281

1k+ parts

$3.941

10k+ parts

$3.809

22,077

$4.960

$4.281

$3.941

$3.809

Mouser Electronics

USA . 2,135 parts In-Stock

1+ parts

$4.960

100+ parts

$4.290

1k+ parts

$3.950

10k+ parts

$3.800

2,135

$4.960

$4.290

$3.950

$3.800

RS (Exports)

UK . 89 parts In-Stock

1+ parts

$6.350

100+ parts

$5.065

1k+ parts

$5.039

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89

$6.350

$5.065

$5.039

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Element14

Singapore . 6,066 parts In-Stock

1+ parts

$6.615

100+ parts

$5.280

1k+ parts

$4.932

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6,066

$6.615

$5.280

$4.932

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Flip Electronics (Authorized)

USA . 41,820 parts In-Stock

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Future Electronics

Canada . 12,500 parts In-Stock

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$2.620

12,500

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$2.620

Verical

USA . 4,919 parts In-Stock

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$4.130

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4,919

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$4.130

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 393 parts In-Stock

1+ parts

$4.845

100+ parts

-

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393

$4.845

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Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$6.864

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72

$6.864

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Flip Electronics

USA . 39,281 parts In-Stock

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Vyrian

USA . 8,860 parts In-Stock

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8,860

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IBS Electronics

USA . 7,500 parts In-Stock

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$3.406

7,500

-

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$3.406

Rutronik

Germany . 2,500 parts In-Stock

1+ parts

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$3.460

2,500

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$3.460

ComSIT Distribution GmbH

Germany . 257 parts In-Stock

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257

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K-1 Technologies

USA . 177 parts In-Stock

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177

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Inventory MP

USA . 88 parts In-Stock

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88

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Bristol Electronics

USA . 88 parts In-Stock

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88

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 9,034 parts In-Stock

1+ parts

$3.380

100+ parts

$3.296

1k+ parts

$3.279

10k+ parts

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9,034

$3.380

$3.296

$3.279

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$3.402

100+ parts

$3.232

1k+ parts

$3.232

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900

$3.402

$3.232

$3.232

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Component Stockers USA

USA . 12,185 parts In-Stock

1+ parts

$3.770

100+ parts

$3.770

1k+ parts

$3.770

10k+ parts

$4.200

12,185

$3.770

$3.770

$3.770

$4.200

Modulus Dynamics

Lithuania . 5,567 parts In-Stock

1+ parts

$4.125

100+ parts

$3.960

1k+ parts

$3.795

10k+ parts

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5,567

$4.125

$3.960

$3.795

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Corphita

USA . 486 parts In-Stock

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$4.590

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486

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Aztec Data Supply Inc.

USA . 246 parts In-Stock

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$5.243

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Corohmni

South Africa . 394 parts In-Stock

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$5.449

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394

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Continental Prestige Electronics

USA . 6,892 parts In-Stock

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$5.720

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$4.160

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6,892

$5.720

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Microchip USA

USA . 1,319 parts In-Stock

1+ parts

$28.540

100+ parts

$28.360

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$28.280

10k+ parts

$28.190

1,319

$28.540

$28.360

$28.280

$28.190

QUARKTWIN TECHNOLOGY LTD

USA . 29,146 parts In-Stock

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Kepictronics

USA . 12,360 parts In-Stock

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RC Electronics

USA . 8,825 parts In-Stock

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$5.500

1k+ parts

$5.020

10k+ parts

$4.870

8,825

-

$5.500

$5.020

$4.870

A-Z Elektronik GmbH

Germany . 6,389 parts In-Stock

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6,389

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Argo Parts USA

USA . 4,314 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Perfect Parts

USA . 2,308 parts In-Stock

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Robosynatics

Brazil . 668 parts In-Stock

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$3.197

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$3.132

10k+ parts

$3.132

668

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$3.197

$3.132

$3.132

Lucentia Tech

USA . 668 parts In-Stock

1+ parts

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100+ parts

$3.197

1k+ parts

$3.132

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$3.132

668

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$3.132

$3.132

Benley Electronics

USA . 587 parts In-Stock

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587

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Futuretech Components

Singapore . 79 parts In-Stock

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Overview

Elevate your data storage and retrieval capabilities with the S25FL256SAGNFI003 by Infineon Technologies. Crafted with precision and reliability in mind, this Flash Memory device offers seamless performance in a compact package. Whether you're looking to enhance your industrial equipment or streamline your consumer electronics, this product delivers unparalleled value with its endurance of 100,000 Write/Erase cycles and maximum clock frequency of 133 MHz. Trust in the quality of Infineon Technologies and unlock new possibilities with the S25FL256SAGNFI003.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, suitable for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient data transfer and communication with other components.

Nominal Supply Voltage / Vsup (V): 3

Standard supply voltage of 3V provides compatibility with a wide range of systems.

Power Supplies (V): 3/3.3

Dual power supply options offer flexibility in different system configurations.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance of 85°C ensures reliable performance in challenging environments.

Minimum Operating Temperature: -40 °C

Wide temperature range of -40°C to 85°C allows for operation in extreme conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Endurance: 100000 Write/Erase Cycles

High endurance of 100,000 write/erase cycles ensures longevity and reliability of the memory.

Technical Specifications

Flash Memory S25FL256SAGNFI003 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO CONFIGURED AS 256M X 1

Alternate Memory Width:

2

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

8 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

6 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL256SAGNFI003 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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