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S29GL064S80TFV030

Infineon Technologies

S29GL064S80TFV030 by Infineon Technologies

S29GL064S80TFV030 by Infineon Technologies is an 8MX8 Flash Memory with 67108864 bit memory density and 80 ns max access time. It operates at a nominal voltage of 3V, suitable for industrial applications requiring fast and reliable data storage in a compact form factor. The package style is small outline, thin profile, shrink pitch, making it ideal for space-constrained designs that demand high-speed performance.

Median Price

$5.975

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 140 parts In-Stock

1+ parts

$5.580

100+ parts

$4.817

1k+ parts

$4.518

10k+ parts

$4.418

140

$5.580

$4.817

$4.518

$4.418

Mouser Electronics

USA . 403 parts In-Stock

1+ parts

$6.370

100+ parts

$5.480

1k+ parts

$5.170

10k+ parts

$5.040

403

$6.370

$5.480

$5.170

$5.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.176

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.176

-

-

-

Digiode

USA . 418 parts In-Stock

1+ parts

$4.750

100+ parts

-

1k+ parts

-

10k+ parts

-

418

$4.750

-

-

-

Vyrian

USA . 319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

319

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,943 parts In-Stock

1+ parts

$3.215

100+ parts

-

1k+ parts

-

10k+ parts

-

1,943

$3.215

-

-

-

Corohmni

South Africa . 88 parts In-Stock

1+ parts

$3.469

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$3.469

-

-

-

Modulus Dynamics

Lithuania . 5,092 parts In-Stock

1+ parts

$3.841

100+ parts

$3.687

1k+ parts

$3.534

10k+ parts

-

5,092

$3.841

$3.687

$3.534

-

Semicontronic

India . 177 parts In-Stock

1+ parts

$3.910

100+ parts

$3.812

1k+ parts

$3.793

10k+ parts

-

177

$3.910

$3.812

$3.793

-

Argo Parts USA

USA . 4,509 parts In-Stock

1+ parts

$4.176

100+ parts

-

1k+ parts

-

10k+ parts

-

4,509

$4.176

-

-

-

Continental Prestige Electronics

USA . 2,601 parts In-Stock

1+ parts

$4.176

100+ parts

-

1k+ parts

-

10k+ parts

$4.093

2,601

$4.176

-

-

$4.093

Corphita

USA . 311 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

311

$4.500

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$4.845

100+ parts

$4.457

1k+ parts

$4.176

10k+ parts

-

3,000

$4.845

$4.457

$4.176

-

AZTECH Wire

Italy . 574 parts In-Stock

1+ parts

$9.096

100+ parts

-

1k+ parts

-

10k+ parts

-

574

$9.096

-

-

-

Microchip USA

USA . 2,467 parts In-Stock

1+ parts

$14.168

100+ parts

-

1k+ parts

-

10k+ parts

-

2,467

$14.168

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13,376

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Unlock the power of high-quality Flash Memory with the S29GL064S80TFV030 by Infineon Technologies. Designed with precision and reliability in mind, this product offers unrivaled performance for a wide range of applications. With its small outline, thin profile, and industrial temperature grade, this memory solution provides exceptional value and benefits to customers seeking fast access times and high memory density. Trust in Infineon Technologies to deliver cutting-edge technology that meets your needs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic is a durable and lightweight material, making the package of this flash memory product sturdy and easy to handle.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, making the installation process convenient and efficient.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode enables data transfer without the need for a synchronized clock signal, increasing flexibility in data communication.

Nominal Supply Voltage / Vsup (V): 3

Operating at a voltage of 3V provides a balance between power efficiency and performance for this flash memory product.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this flash memory product is suitable for industrial applications where heat resistance is crucial.

Memory Density: 67108864 bit

The high memory density of 67108864 bits ensures ample storage capacity for data-intensive applications, making this product versatile and capable of handling large amounts of information.

Technical Specifications

Flash Memory S29GL064S80TFV030 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

80 ns

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

14 mm

Trade Compliance

S29GL064S80TFV030 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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