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S25FL128LAGNFV010

Infineon Technologies

S25FL128LAGNFV010 by Infineon Technologies

S25FL128LAGNFV010 by Infineon is a 16MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus type. Operating at -40 to 105 °C, it offers 100000 write/erase cycles and has a memory density of 134217728 bits. Ideal for industrial applications requiring high-speed data storage in compact devices.

Median Price

$2.200

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 770 parts In-Stock

1+ parts

$1.371

100+ parts

-

1k+ parts

-

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770

$1.371

-

-

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Farnell

UK . 31 parts In-Stock

1+ parts

$1.960

100+ parts

$1.500

1k+ parts

$1.470

10k+ parts

-

31

$1.960

$1.500

$1.470

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Chip1Stop

Japan . 1,017 parts In-Stock

1+ parts

$2.200

100+ parts

-

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-

10k+ parts

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1,017

$2.200

-

-

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Mouser Electronics

USA . 653 parts In-Stock

1+ parts

$2.550

100+ parts

$2.200

1k+ parts

$2.110

10k+ parts

$1.930

653

$2.550

$2.200

$2.110

$1.930

DigiKey

USA . 1,019 parts In-Stock

1+ parts

$2.620

100+ parts

$2.271

1k+ parts

$2.095

10k+ parts

$2.064

1,019

$2.620

$2.271

$2.095

$2.064

Element14

Singapore . 186 parts In-Stock

1+ parts

$4.539

100+ parts

$3.578

1k+ parts

$3.205

10k+ parts

-

186

$4.539

$3.578

$3.205

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Verical

USA . 2,448 parts In-Stock

1+ parts

-

100+ parts

$1.693

1k+ parts

$1.667

10k+ parts

$1.591

2,448

-

$1.693

$1.667

$1.591

Future Electronics

Canada . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.480

10k+ parts

$1.440

490

-

-

$1.480

$1.440

RS (Exports)

UK . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.053

10k+ parts

-

440

-

-

$3.053

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Flip Electronics (Authorized)

USA . 270 parts In-Stock

1+ parts

-

100+ parts

-

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270

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 498 parts In-Stock

1+ parts

$1.083

100+ parts

-

1k+ parts

-

10k+ parts

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498

$1.083

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-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.713

100+ parts

-

1k+ parts

-

10k+ parts

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100

$3.713

-

-

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IBS Electronics

USA . 980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.104

10k+ parts

$2.076

980

-

-

$2.104

$2.076

Vyrian

USA . 289 parts In-Stock

1+ parts

-

100+ parts

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289

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Flip Electronics

USA . 270 parts In-Stock

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100+ parts

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270

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 653 parts In-Stock

1+ parts

$0.750

100+ parts

$0.731

1k+ parts

$0.728

10k+ parts

-

653

$0.750

$0.731

$0.728

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Ampacity Inc.

Singapore . 536 parts In-Stock

1+ parts

$0.750

100+ parts

-

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-

10k+ parts

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536

$0.750

-

-

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Corphita

USA . 832 parts In-Stock

1+ parts

$1.026

100+ parts

-

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832

$1.026

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Continental Prestige Electronics

USA . 710 parts In-Stock

1+ parts

$1.660

100+ parts

$1.250

1k+ parts

$1.170

10k+ parts

-

710

$1.660

$1.250

$1.170

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Aztec Data Supply Inc.

USA . 2,919 parts In-Stock

1+ parts

$2.613

100+ parts

-

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-

10k+ parts

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2,919

$2.613

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$2.944

100+ parts

$2.797

1k+ parts

$2.797

10k+ parts

-

500

$2.944

$2.797

$2.797

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Corohmni

South Africa . 1,007 parts In-Stock

1+ parts

$3.191

100+ parts

-

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-

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1,007

$3.191

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Argo Parts USA

USA . 4,684 parts In-Stock

1+ parts

$3.713

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4,684

$3.713

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Netroflash

USA . 50 parts In-Stock

1+ parts

$3.713

100+ parts

$3.638

1k+ parts

-

10k+ parts

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50

$3.713

$3.638

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Modulus Dynamics

Lithuania . 2,719 parts In-Stock

1+ parts

$3.862

100+ parts

$3.708

1k+ parts

$3.553

10k+ parts

-

2,719

$3.862

$3.708

$3.553

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QUARKTWIN TECHNOLOGY LTD

USA . 18,198 parts In-Stock

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18,198

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Glotronic Ltd.

UK . 580 parts In-Stock

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580

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Overview

Unlock the power of reliable and high-performance flash memory with the S25FL128LAGNFV010 by Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and innovation in every product they create. The S25FL128LAGNFV010 is perfect for a wide range of applications due to its impressive features and benefits. Customers can expect seamless operation and fast data transfer speeds, making it ideal for industrial use. Experience the value and efficiency that this flash memory device offers, providing you with the reliability and performance you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Easy installation and integration into various electronic devices.

Operating Mode: SYNCHRONOUS

Enables synchronized data transfers, leading to efficient performance.

Nominal Supply Voltage / Vsup (V): 3

Suitable voltage level for optimal operation and compatibility with a wide range of devices.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial applications.

No. of Terminals: 8

Compact design with a sufficient number of terminals for connectivity.

Write Protection: HARDWARE/SOFTWARE

Allows for secure data storage and prevents accidental overwriting of important information.

Technology: CMOS

Low power consumption and high speed operation, ideal for portable devices.

Endurance: 100000 Write/Erase Cycles

High endurance for frequent read/write operations, ensuring longevity of the product.

Technical Specifications

Flash Memory S25FL128LAGNFV010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

6 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00006 Amp

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL128LAGNFV010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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