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S70FL01GSAGMFI011

Infineon Technologies

S70FL01GSAGMFI011 by Infineon Technologies

S70FL01GSAGMFI011 by Infineon Technologies is a 128MX8 NOR type Flash Memory with 133 MHz clock frequency. Operating at 3V, it offers 100000 Write/Erase cycles and supports SPI serial bus type. Ideal for industrial applications requiring high-speed data storage in compact form factors.

Median Price

$10.008

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 83 parts In-Stock

1+ parts

$8.720

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83

$8.720

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Newark

USA . 138 parts In-Stock

1+ parts

$9.730

100+ parts

$9.730

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$9.730

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138

$9.730

$9.730

$9.730

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Arrow

USA . 585 parts In-Stock

1+ parts

$10.166

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585

$10.166

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RS (Exports)

UK . 425 parts In-Stock

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$10.548

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425

$10.548

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Farnell

UK . 891 parts In-Stock

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$12.210

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$9.460

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891

$12.210

$9.460

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Mouser Electronics

USA . 889 parts In-Stock

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$17.600

100+ parts

$12.690

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889

$17.600

$12.690

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Element14

Singapore . 137 parts In-Stock

1+ parts

$26.510

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$22.780

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137

$26.510

$22.780

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Flip Electronics (Authorized)

USA . 40,995 parts In-Stock

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40,995

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DigiKey

USA . 22,491 parts In-Stock

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$8.870

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$8.870

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Verical

USA . 12,960 parts In-Stock

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$10.248

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12,960

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$10.248

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Rochester

USA . 914 parts In-Stock

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$9.260

1k+ parts

$8.290

10k+ parts

$7.800

914

-

$9.260

$8.290

$7.800

Avnet

USA . 68 parts In-Stock

1+ parts

-

100+ parts

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$8.670

10k+ parts

$8.351

68

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$8.670

$8.351

Future Electronics

Canada . 47 parts In-Stock

1+ parts

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$9.850

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47

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$9.850

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Distributors (In-Stock)

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Digiode

USA . 363 parts In-Stock

1+ parts

$9.226

100+ parts

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363

$9.226

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Maritex

Poland . 14,250 parts In-Stock

1+ parts

$11.970

100+ parts

$10.409

1k+ parts

$9.986

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14,250

$11.970

$10.409

$9.986

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Nova Conductors

Japan . 92 parts In-Stock

1+ parts

$14.017

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92

$14.017

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Flip Electronics

USA . 24,982 parts In-Stock

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24,982

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 3,991 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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1,000

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IBS Electronics

USA . 705 parts In-Stock

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$12.132

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$14.137

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705

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$12.132

$14.137

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Classic Components Corporation

USA . 65 parts In-Stock

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65

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$2.316

100+ parts

$2.201

1k+ parts

$2.201

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-

3,000

$2.316

$2.201

$2.201

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Modulus Dynamics

Lithuania . 5,095 parts In-Stock

1+ parts

$2.578

100+ parts

$2.475

1k+ parts

$2.372

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5,095

$2.578

$2.475

$2.372

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Corohmni

South Africa . 251 parts In-Stock

1+ parts

$4.612

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251

$4.612

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Aztec Data Supply Inc.

USA . 517 parts In-Stock

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$5.555

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517

$5.555

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Semicontronic

India . 3,891 parts In-Stock

1+ parts

$7.600

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$7.410

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$7.372

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3,891

$7.600

$7.410

$7.372

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Corphita

USA . 228 parts In-Stock

1+ parts

$8.741

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228

$8.741

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Component Stockers USA

USA . 2,685 parts In-Stock

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$14.580

100+ parts

$10.840

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2,685

$14.580

$10.840

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Continental Prestige Electronics

USA . 512 parts In-Stock

1+ parts

$14.790

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$11.490

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512

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$11.490

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Perfect Parts

USA . 6,037 parts In-Stock

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6,037

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,590 parts In-Stock

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Lixinc

USA . 4,261 parts In-Stock

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4,261

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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4,000

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S.R.D Solutions

India . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,681 parts In-Stock

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1,681

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Robosynatics

Brazil . 1,587 parts In-Stock

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$4.233

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$4.146

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$4.146

1,587

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$4.233

$4.146

$4.146

Lucentia Tech

USA . 1,587 parts In-Stock

1+ parts

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$4.233

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$4.146

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$4.146

1,587

-

$4.233

$4.146

$4.146

Netroflash

USA . 1,000 parts In-Stock

1+ parts

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$13.737

1k+ parts

$13.317

10k+ parts

$13.036

1,000

-

$13.737

$13.317

$13.036

Futuretech Components

Singapore . 1,000 parts In-Stock

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Overview

Unlock the power of reliable and high-performance flash memory with the S70FL01GSAGMFI011 by Infineon Technologies. As a leader in the industry, Infineon ensures top-notch quality and cutting-edge technology in every product they offer. This flash memory device is perfect for a wide range of applications, providing fast and efficient data storage solutions. With its durable construction, easy installation, and seamless operation, the S70FL01GSAGMFI011 delivers exceptional value to customers looking for a dependable memory solution. Trust Infineon to elevate your experience with the latest in flash memory technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and more efficient performance.

Nominal Supply Voltage / Vsup (V): 3

A standard supply voltage makes it compatible with a wide range of devices and systems.

Maximum Operating Temperature: 85 °C

With a high operating temperature limit, the product can withstand harsh environmental conditions.

Memory Density: 1073741824 bit

High memory density allows for storing large amounts of data in a compact space.

Endurance: 100000 Write/Erase Cycles

With a high endurance level, the product is reliable and can handle frequent data read/write operations.

Technical Specifications

Flash Memory S70FL01GSAGMFI011 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

200 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

7.5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S70FL01GSAGMFI011 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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