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S70FS01GSDSBHI210

Infineon Technologies

S70FS01GSDSBHI210 by Infineon Technologies

Infineon Technologies' S70FS01GSDSBHI210 is a 256MX4 flash memory with a memory density of 1.07Gb. It operates at a max clock frequency of 80MHz and has an industrial temperature grade, making it suitable for various applications requiring high-speed data storage.

Median Price

$11.575

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,241 parts In-Stock

1+ parts

$16.850

100+ parts

$14.417

1k+ parts

$13.438

10k+ parts

-

3,241

$16.850

$14.417

$13.438

-

Rochester

USA . 13,062 parts In-Stock

1+ parts

-

100+ parts

$9.260

1k+ parts

$8.290

10k+ parts

$7.800

13,062

-

$9.260

$8.290

$7.800

Flip Electronics (Authorized)

USA . 11,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,760

-

-

-

-

Verical

USA . 10,609 parts In-Stock

1+ parts

-

100+ parts

$11.575

1k+ parts

$10.363

10k+ parts

$9.750

10,609

-

$11.575

$10.363

$9.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 926 parts In-Stock

1+ parts

$10.574

100+ parts

-

1k+ parts

-

10k+ parts

-

926

$10.574

-

-

-

Nova Conductors

Japan . 31 parts In-Stock

1+ parts

$11.616

100+ parts

-

1k+ parts

-

10k+ parts

-

31

$11.616

-

-

-

Vyrian

USA . 7,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,145

-

-

-

-

Flip Electronics

USA . 6,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,760

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 28,798 parts In-Stock

1+ parts

$5.283

100+ parts

-

1k+ parts

-

10k+ parts

-

28,798

$5.283

-

-

-

Semicontronic

India . 7,415 parts In-Stock

1+ parts

$9.460

100+ parts

$9.224

1k+ parts

$9.176

10k+ parts

-

7,415

$9.460

$9.224

$9.176

-

Ampacity Inc.

Singapore . 7,332 parts In-Stock

1+ parts

$9.460

100+ parts

-

1k+ parts

-

10k+ parts

-

7,332

$9.460

-

-

-

Corphita

USA . 394 parts In-Stock

1+ parts

$10.017

100+ parts

-

1k+ parts

-

10k+ parts

-

394

$10.017

-

-

-

Continental Prestige Electronics

USA . 3,418 parts In-Stock

1+ parts

$11.616

100+ parts

-

1k+ parts

-

10k+ parts

$11.384

3,418

$11.616

-

-

$11.384

Netroflash

USA . 50 parts In-Stock

1+ parts

$11.616

100+ parts

$11.384

1k+ parts

-

10k+ parts

-

50

$11.616

$11.384

-

-

Component Stockers USA

USA . 11,804 parts In-Stock

1+ parts

$13.050

100+ parts

$11.370

1k+ parts

$10.810

10k+ parts

-

11,804

$13.050

$11.370

$10.810

-

Modulus Dynamics

Lithuania . 1,658 parts In-Stock

1+ parts

$13.355

100+ parts

$12.821

1k+ parts

$12.287

10k+ parts

-

1,658

$13.355

$12.821

$12.287

-

Corohmni

South Africa . 238 parts In-Stock

1+ parts

$13.355

100+ parts

-

1k+ parts

-

10k+ parts

-

238

$13.355

-

-

-

Microchip USA

USA . 2,708 parts In-Stock

1+ parts

$47.210

100+ parts

$46.530

1k+ parts

$46.200

10k+ parts

$45.860

2,708

$47.210

$46.530

$46.200

$45.860

QUARKTWIN TECHNOLOGY LTD

USA . 20,648 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20,648

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,000

-

-

-

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Argo Parts USA

USA . 3,315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,315

-

-

-

-

Overview

Discover the S70FS01GSDSBHI210 by Infineon Technologies, a cutting-edge flash memory that offers unparalleled quality and performance. Designed by a trusted manufacturer, this product stands out in its category for its reliability and durability. With endless applications, this flash memory is perfect for data storage, embedded systems, and more. Experience the value and benefits it brings to your projects with its synchronous operating mode and high clock frequency. Say goodbye to slow data transfers and hello to efficiency and speed. Upgrade your technology today with the S70FS01GSDSBHI210 from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability for long-term usage.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient data transfer and processing.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage of 1.8V helps in reducing power consumption.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for various applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliability under varying conditions.

Memory Density: 1073741824 bit

High memory density of over 1 billion bits offers ample storage capacity for data-intensive applications.

Technical Specifications

Flash Memory S70FS01GSDSBHI210 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO HAVE MEMORY WIDTH X1

Alternate Memory Width:

2

Maximum Clock Frequency (fCLK):

80 MHz

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

1.8

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S70FS01GSDSBHI210 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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