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S70FL01GSAGBHIC10

Infineon Technologies

S70FL01GSAGBHIC10 by Infineon Technologies

S70FL01GSAGBHIC10 by Infineon is a 128MX8 NOR flash memory with 133 MHz clock frequency, 3V programming voltage, and 100K write/erase cycles. It operates in industrial temperature range (-40 to 85 °C) and uses SPI serial bus for applications requiring high-speed data storage in compact devices.

Median Price

$16.666

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 72 parts In-Stock

1+ parts

$4.490

100+ parts

$4.490

1k+ parts

$4.490

10k+ parts

-

72

$4.490

$4.490

$4.490

-

Farnell

UK . 638 parts In-Stock

1+ parts

$12.450

100+ parts

$9.540

1k+ parts

-

10k+ parts

-

638

$12.450

$9.540

-

-

Verical

USA . 1,390 parts In-Stock

1+ parts

$15.651

100+ parts

$13.278

1k+ parts

$11.823

10k+ parts

-

1,390

$15.651

$13.278

$11.823

-

Arrow

USA . 376 parts In-Stock

1+ parts

$16.666

100+ parts

$13.742

1k+ parts

$12.064

10k+ parts

-

376

$16.666

$13.742

$12.064

-

Chip1Stop

Japan . 491 parts In-Stock

1+ parts

$16.800

100+ parts

-

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-

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491

$16.800

-

-

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DigiKey

USA . 860 parts In-Stock

1+ parts

$16.850

100+ parts

$14.417

1k+ parts

$13.438

10k+ parts

-

860

$16.850

$14.417

$13.438

-

Mouser Electronics

USA . 113 parts In-Stock

1+ parts

$16.850

100+ parts

$14.420

1k+ parts

$13.600

10k+ parts

-

113

$16.850

$14.420

$13.600

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Element14

Singapore . 638 parts In-Stock

1+ parts

$21.590

100+ parts

$17.060

1k+ parts

-

10k+ parts

-

638

$21.590

$17.060

-

-

Future Electronics

Canada . 338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.160

10k+ parts

-

338

-

-

$10.160

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 375 parts In-Stock

1+ parts

$11.780

100+ parts

-

1k+ parts

-

10k+ parts

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375

$11.780

-

-

-

Nova Conductors

Japan . 400 parts In-Stock

1+ parts

$14.017

100+ parts

-

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-

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400

$14.017

-

-

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DF Sales Co.

USA . 14 parts In-Stock

1+ parts

$18.750

100+ parts

-

1k+ parts

-

10k+ parts

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14

$18.750

-

-

-

DF Sales Co.

USA . 14 parts In-Stock

1+ parts

$18.750

100+ parts

-

1k+ parts

-

10k+ parts

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14

$18.750

-

-

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RLX Solution Inc.

Canada . 440 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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440

-

-

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IBS Electronics

USA . 338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$14.334

10k+ parts

-

338

-

-

$14.334

-

Vyrian

USA . 213 parts In-Stock

1+ parts

-

100+ parts

-

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-

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213

-

-

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Flip Electronics

USA . 89 parts In-Stock

1+ parts

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89

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Semtec, LLC

USA . 1 parts In-Stock

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-

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-

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-

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1

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,355 parts In-Stock

1+ parts

$4.287

100+ parts

-

1k+ parts

-

10k+ parts

-

3,355

$4.287

-

-

-

Semicontronic

India . 344 parts In-Stock

1+ parts

$10.470

100+ parts

$10.208

1k+ parts

$10.156

10k+ parts

-

344

$10.470

$10.208

$10.156

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Corphita

USA . 258 parts In-Stock

1+ parts

$11.160

100+ parts

-

1k+ parts

-

10k+ parts

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258

$11.160

-

-

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Modulus Dynamics

Lithuania . 1,302 parts In-Stock

1+ parts

$12.023

100+ parts

$11.542

1k+ parts

$11.061

10k+ parts

-

1,302

$12.023

$11.542

$11.061

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Corohmni

South Africa . 368 parts In-Stock

1+ parts

$12.023

100+ parts

-

1k+ parts

-

10k+ parts

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368

$12.023

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-

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Continental Prestige Electronics

USA . 430 parts In-Stock

1+ parts

$13.200

100+ parts

$10.150

1k+ parts

-

10k+ parts

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430

$13.200

$10.150

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Microchip USA

USA . 3,046 parts In-Stock

1+ parts

$42.280

100+ parts

-

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10k+ parts

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3,046

$42.280

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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5,000

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Argo Parts USA

USA . 2,290 parts In-Stock

1+ parts

-

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2,290

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$13.737

1k+ parts

$13.317

10k+ parts

$13.036

500

-

$13.737

$13.317

$13.036

Electronic Sources GmbH

Germany . 38 parts In-Stock

1+ parts

-

100+ parts

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38

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Overview

Unlock the power of cutting-edge technology with the S70FL01GSAGBHIC10 by Infineon Technologies. Crafted with precision and expertise, this Flash Memory device offers unparalleled reliability and performance in a wide range of applications. Whether you're looking to enhance your industrial machinery or streamline your IoT devices, this product delivers high-quality storage solutions that are built to last. Experience seamless operation, fast data transfer speeds, and secure data protection with the S70FL01GSAGBHIC10. Upgrade your systems today and elevate your business to new heights with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it ideal for portable devices.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer speeds and more efficient use of power, enhancing overall performance.

Nominal Supply Voltage (Vsup): 3V

The 3V supply voltage ensures compatibility with a wide range of devices and allows for reliable operation.

Write Protection: HARDWARE/SOFTWARE

The ability to enable write protection through hardware or software ensures data security and prevents accidental data loss or corruption.

Maximum Clock Frequency (fCLK): 133 MHz

The high clock frequency enables rapid data access and processing, making the product suitable for applications requiring high-speed performance.

Memory Density: 1073741824 bit

The high memory density allows for storing a large amount of data in a compact form factor, making it suitable for storage-intensive applications.

Technical Specifications

Flash Memory S70FL01GSAGBHIC10 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0002 Amp

Maximum Supply Current:

200 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Type:

NOR TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S70FL01GSAGBHIC10 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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