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S70FS01GSDSBHV210

Infineon Technologies

S70FS01GSDSBHV210 by Infineon Technologies

S70FS01GSDSBHV210 by Infineon Technologies is a 256MX4 flash memory with 1.8V programming voltage, operating at up to 80MHz clock frequency. It features a thin profile grid array package suitable for industrial applications, offering high memory density of 1073741824 bits in a compact size of 6mm x 8mm. Ideal for synchronous operations in devices requiring reliable non-volatile storage solutions.

Median Price

$15.325

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 124 parts In-Stock

1+ parts

$18.150

100+ parts

$15.540

1k+ parts

$14.030

10k+ parts

-

124

$18.150

$15.540

$14.030

-

DigiKey

USA . 32 parts In-Stock

1+ parts

$18.150

100+ parts

$15.516

1k+ parts

$14.461

10k+ parts

-

32

$18.150

$15.516

$14.461

-

Rochester

USA . 291 parts In-Stock

1+ parts

-

100+ parts

$10.000

1k+ parts

$8.950

10k+ parts

$8.420

291

-

$10.000

$8.950

$8.420

Verical

USA . 177 parts In-Stock

1+ parts

-

100+ parts

$12.500

1k+ parts

$11.188

10k+ parts

$10.525

177

-

$12.500

$11.188

$10.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4 parts In-Stock

1+ parts

$11.504

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$11.504

-

-

-

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$13.070

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$13.070

-

-

-

Flip Electronics

USA . 2,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,028

-

-

-

-

Vyrian

USA . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,121 parts In-Stock

1+ parts

$5.843

100+ parts

-

1k+ parts

-

10k+ parts

-

2,121

$5.843

-

-

-

Ampacity Inc.

Singapore . 205 parts In-Stock

1+ parts

$10.290

100+ parts

-

1k+ parts

-

10k+ parts

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205

$10.290

-

-

-

Semicontronic

India . 16 parts In-Stock

1+ parts

$10.290

100+ parts

$10.033

1k+ parts

$9.981

10k+ parts

-

16

$10.290

$10.033

$9.981

-

Corphita

USA . 200 parts In-Stock

1+ parts

$10.899

100+ parts

-

1k+ parts

-

10k+ parts

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200

$10.899

-

-

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Component Stockers USA

USA . 1,566 parts In-Stock

1+ parts

$12.250

100+ parts

$11.510

1k+ parts

-

10k+ parts

-

1,566

$12.250

$11.510

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$13.070

100+ parts

-

1k+ parts

$12.416

10k+ parts

$12.155

1,000

$13.070

-

$12.416

$12.155

Continental Prestige Electronics

USA . 236 parts In-Stock

1+ parts

$13.070

100+ parts

-

1k+ parts

-

10k+ parts

$12.809

236

$13.070

-

-

$12.809

Modulus Dynamics

Lithuania . 5,237 parts In-Stock

1+ parts

$14.865

100+ parts

$14.270

1k+ parts

$13.676

10k+ parts

-

5,237

$14.865

$14.270

$13.676

-

Corohmni

South Africa . 145 parts In-Stock

1+ parts

$14.865

100+ parts

-

1k+ parts

-

10k+ parts

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145

$14.865

-

-

-

Argo Parts USA

USA . 4,771 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,771

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-

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Speed Components Ltd (Excess)

Israel . 5 parts In-Stock

1+ parts

-

100+ parts

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5

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Overview

Elevate your device's performance with the S70FS01GSDSBHV210 from Infineon Technologies. As a leading manufacturer of high-quality flash memory products, Infineon delivers reliability and innovation in every package. This flash memory is perfect for a wide range of applications, offering seamless integration and enhanced functionality. With a nominal supply voltage of 1.8V, advanced synchronous operating mode, and industrial temperature grade, this product provides outstanding value, efficiency, and performance. Upgrade your technology today with the S70FS01GSDSBHV210 and experience the difference Infineon Technologies can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight construction, making it a reliable choice for various applications.

Surface Mount: YES

The surface-mount feature allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape provides a compact and space-saving design, making it suitable for devices with limited space availability.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient data transfer and synchronization, making it ideal for high-performance applications.

Nominal Supply Voltage: 1.8V

The low nominal supply voltage helps in reducing power consumption, making it an energy-efficient solution.

No. of Terminals: 24

With 24 terminals, this flash memory offers versatile connectivity options for seamless integration into various systems.

Package Style: GRID ARRAY, THIN PROFILE

The grid array and thin profile design enhance the overall performance by providing better heat dissipation and electrical connections.

Alternate Memory Width: 2

The alternate memory width of 2 enhances data processing speed and efficiency, making it a suitable choice for quick data access.

Maximum Operating Temperature: 105 °C

With a high operating temperature range, this flash memory can withstand harsh environmental conditions, ensuring reliable performance in tough settings.

Organization: 256MX4

The 256MX4 organization offers high memory capacity and efficient data storage, making it suitable for storing large amounts of data.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin-silver-copper ensures excellent conductivity and corrosion resistance, improving the overall durability and reliability of the product.

Technical Specifications

Flash Memory S70FS01GSDSBHV210 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO HAS X1 MEMORY WIDTH

Alternate Memory Width:

2

Maximum Clock Frequency (fCLK):

80 MHz

JESD-30 Code:

R-PBGA-B24

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

1.8

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S70FS01GSDSBHV210 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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