Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SS-104-G-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, rated at 1A current. It features a rectangular PCB contact pattern, glass-filled polyester housing material, and gold finish with nickel barrier. Ideal for SIP4 devices, it operates b/w -65°C to 125°C and has a mating contact pitch of 0.1 inch.
Median Price
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Kepictronics
The rectangular PCB contact pattern provides a secure and reliable connection, making this product a good choice for applications requiring high reliability.
The use of glass filled polyester housing material ensures durability and resistance to high temperatures, making this product suitable for harsh environments.
Designed for use with SIP4 devices, this IC & component socket is compatible with a wide range of applications, making it a versatile choice.
With a minimum operating temperature of -65°C, this product can withstand extremely low temperatures, making it ideal for a variety of industrial applications.
The solder termination type ensures a secure and stable connection, making this product a reliable choice for applications requiring consistent performance.
The 0.1-inch mating contact pitch allows for easy and efficient connections, making this product suitable for applications requiring precise alignment.
The compact body length of 0.4 inches makes this product space-saving and suitable for applications with limited space constraints.
The use of beryllium copper contact material ensures excellent conductivity and durability, making this product a high-performance choice for demanding applications.
With 4 contacts, this IC & component socket can accommodate multiple connections, making it suitable for applications requiring multiple input/output channels.
The gold and nickel contact finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.
The straight mounting style offers a secure and stable installation, making this product suitable for applications requiring robust connections.
The round pin socket contact style allows for easy insertion and removal of components, making this product user-friendly and convenient.
With a current rating of 1 ampere, this IC & component socket can handle moderate electrical loads, making it suitable for a variety of low to medium power applications.
The slim body width of 0.1 inches makes this product suitable for applications where space is limited, while still providing a secure connection.
The gold and nickel barrier contact finish ensures excellent conductivity and corrosion resistance, making this product a reliable choice for long-term use.
The body depth of 0.175 inches provides a compact and space-saving design, making this product suitable for applications with tight space requirements.
This IC & component socket is specifically designed for use with integrated circuits, ensuring compatibility and high performance in a variety of electronic applications.
The rectangular contact configuration provides a secure and reliable connection, making this product a good choice for applications requiring stable electrical connections.
With a maximum operating temperature of 125°C, this product can withstand high temperatures, making it suitable for applications in demanding thermal environments.
The 2.54mm terminal pitch allows for easy and precise connections, making this product suitable for applications requiring accurate alignment.
Chip Carrier IC & Component Sockets SS-104-G-2-N attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
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SS-104-G-2-N Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
2N7002
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
CRCW04020000Z0EDHP
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
FT232RL-REEL
FTDI
FTDI's FT232RL-REEL is a bus controller with 28 terminals, operating at 3.3V to 5.25V. It supports USB, VBUS, and UART buses with a data transfer rate of 60MBps. Ideal for industrial applications due to its CMOS technology and compatibility with RS232, RS422, and RS485 standards.
1N4148WT
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
1N4148
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
LL4148
Continental Device India
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Promax-johnton
Crimson Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
6-1415035-1
TE Connectivity's 6-1415035-1 is an IC socket with 8 contacts, rated for 16A current. With a body size of 3.031" x 0.622" x 2.421", it operates b/w -40°C to 70°C and uses screw termination. Ideal for chip carrier ICs on relays.
5-1415043-1
IC SOCKET; No. of Contacts: 2; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
P2RF-05-E
Omron
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Maximum Operating Temperature: 70 Cel; Contact Material: NOT APPLICABLE; No. of Contacts: 5; Minimum Operating Temperature: -40 Cel;
828-AG11D-ESL
Abb Installation Products
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: POLYESTER; Body Depth: .105 inch;
XR2T-0811-N
IC SOCKET; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; JESD-609 Code: e4;
PY08-02
RELAY SOCKET; No. of Contacts: 8; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
ICF-624-T-O-TR
Samtec
Samtec's ICF-624-T-O-TR is a Chip Carrier IC Socket with 24 contacts, Beryllium Copper material, and Matte Tin finish. It has a 15.24mm PCB contact row spacing and operates b/w -55°C to 125°C. Ideal for DIP24 devices, it features a rectangular contact pattern for surface mount termination in electronic applications.
342-40-139-00-591000
Mill-max Mfg
Mill-max Mfg's 342-40-139-00-591000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 contacts. It features MATTE TIN OVER NICKEL finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
PTFZ-08-E
Omron's PTFZ-08-E is a Chip Carrier IC Socket with 8 contacts, rated at 15A current. It has a straight mounting style and blade pin-skt contact style, suitable for use on relays. With a min operating temperature of -25°C and screw termination type, it offers reliable performance in various applications.
HLT-1910-G-H
The Samtec HLT-1910-G-H is a plastic IC socket with 190 brass contacts. It features gold over nickel mating finish and gold with nickel termination finish. Designed for use on PGA190 devices, it is ideal for chip carrier applications.
XR2C-2001-N
IC SOCKET; Manufacturer Series: XR2; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
110-43-628-41-001000
110-43-628-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing material, 28 contacts, and Matte Tin over Nickel termination. It is designed for use on DIP28 devices, featuring a rectangular contact configuration suitable for various electronic applications.
116-43-314-41-008000
116-43-314-41-008000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP14 devices with 14 contacts. Featuring MATTE TIN OVER NICKEL finish, it is ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
510-93-169-17-101003
Mill-max Mfg's 510-93-169-17-101003 is a PGA169 IC socket with 169 contacts. It features gold over nickel mating finish and tin/lead termination. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier IC applications.
XR2B-1601-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
173-10-314-00-001000
Mill-max Mfg's 173-10-314-00-001000 is a plastic chip carrier IC socket with 14 gold over nickel contacts. It is used for DIP14 devices and has a rectangular contact configuration.
HLT-1712-T-T
The Samtec HLT-1712-T-T is a plastic IC socket with 204 brass contacts, featuring tin over nickel mating finish. It is designed for use on PGA204 devices and offers reliable connection termination with tin (Sn) and nickel (Ni) barrier. Ideal for chip carrier applications requiring secure component sockets.
CQF100-158A
Texas Instruments
IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 100;
XR2T-2821-N
IC SOCKET; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2T; JESD-609 Code: e4;
326-93-108-41-003000
Mill-max Mfg's 326-93-108-41-003000 is a PLASTIC IC SOCKET for SIP8 devices with 8 contacts. Features GOLD (30) OVER NICKEL (100) finish for mating and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
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SS-104-TT-2-N
SS-104-TT-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, BE-CU contact material, and SN mating finish. It has a rectangular PCB contact pattern and glass-filled polyester housing. Ideal for SIP4 devices, it operates b/w -65°C to 125°C, making it suitable for various electronic applications.
SS-104-G-22-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Body Length: .4 inch;
SS-104-G-1A-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; PCB Contact Pattern: RECTANGULAR;
SS-104-G-1B-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Body Width: .1 inch;
SS-104-G-1C-N
SS-104-G-21A-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Contact Config: RECTANGLE;
SS-104-G-21B-N
SS-104-G-21C-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Mating Contact Pitch (inch): 0.1;
SS-104-G-28-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Rating (Current): 1 A;
SS-104-G-28
SS-104-G-29-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Maximum Operating Temperature: 125 Cel;
SS-104-G-29
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Contact Finish (Mating): AU ON NI;
SS-104-G-38-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; No. of Contacts: 4;
SS-104-G-5A-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Terminal Pitch (mm): 2.54;
SS-104-G-5
IC SOCKET; Device Type Used On: SIP4; Mounting Style: RIGHT ANGLE; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; PCB Contact Pattern: RECTANGULAR;
SS-104-G-7-N
SS-104-S-22-N
SS-104-T-2-L-N
SS-104-T-21A-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Body Depth: .193 inch;
SS-104-TT-22-N
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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