Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Samtec APH-1508-G-T is a DIP8 IC socket with 8 brass contacts and gold over nickel finish. It features a polyethylene housing material and rectangular contact configuration. Ideal for chip carrier applications, this IC socket is designed to provide reliable connections in electronic devices.
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Nova Conductors
Continental Prestige Electronics
Argo Parts USA
Netroflash
Polyethylene is a durable and cost-effective material, making the product long-lasting and affordable.
Designed specifically for DIP8 devices, ensuring a perfect fit and secure connection.
Brass is a reliable and conductive material, providing good electrical connectivity.
Having 8 contacts allows for a wide range of compatibility with various components and devices.
Gold mating finish provides excellent conductivity and durability, ensuring a strong and reliable connection.
Gold with nickel barrier termination provides corrosion resistance and superior contact reliability.
Specifically designed as an IC socket, ensuring compatibility with integrated circuits and easy installation.
Rectangle contact configuration provides stability and secure fit for the component, minimizing the risk of disconnection.
Chip Carrier IC & Component Sockets APH-1508-G-T attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
APH-1508-G-T Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
1N4148
Won-top Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
LL4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
Fagor Electronica S Coop
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
LM317T
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
Telefunken Microelectronics
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
BAT54SLT1G
Onsemi
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
1N4148WS
Vishay Intertechnology
Vishay Intertechnology's 1N4148WS is a single rectifier diode with a max forward voltage of 1V and output current of 0.15A. With a fast reverse recovery time of 0.004us, it operates up to 150°C. Ideal for applications requiring high-speed switching and low power consumption in surface mount configurations.
DP83848IVVX/NOPB
Texas Instruments
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
1N4148 by Texas Instruments is a rectifier diode with max reverse recovery time of 0.004 us and max forward voltage of 1V. Ideal for applications requiring low reverse current such as signal demodulation circuits. Operates at max temp of 200°C, making it suitable for high-temperature environments.
2N2222A
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
LM317TG
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
2-1571552-3
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP14; Housing Material: PCT PLASTIC POLYESTER; JESD-609 Code: e3; Contact Finish (Termination): TIN OVER NICKEL; Contact Material: BERYLLIUM COPPER;
P2CF-11-E
Omron
Omron's P2CF-11-E chip carrier IC socket has 11 contacts, 5A current rating, and 1 billion ohm insulation resistance. It is used for relay devices with screw termination, offering a dielectric voltage of 2000VAC. Ideal for applications requiring a reliable and high-performance relay socket solution.
416-43-226-41-006000
Mill-max Mfg
Mill-max Mfg's 416-43-226-41-006000 is a PLASTIC IC SOCKET for DIP26 devices with 26 contacts and TIN finish. It features RECTANGLE contact configuration, ideal for Chip Carrier IC & Component Sockets applications.
XR2T-3201-N
IC SOCKET; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD;
P6D-04P
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
350-10-108-00-001000
350-10-108-00-001000 by Mill-max Mfg is a POLYETHYLENE Chip Carrier IC Socket for SIP8 devices with 8 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for electronic applications requiring reliable connection and durability.
A28-LC-TT
Assmann Wsw Components
A28-LC-TT by Assmann Wsw Components is a DIP28 IC socket with 28 contacts made of phosphor bronze and tin finish. Its housing material is polybutylene terephthalate, suitable for chip carrier applications. The rectangular contact configuration makes it ideal for various electronic devices.
12-1508-30
Aries Electronics
Aries Electronics 12-1508-30 is a DIP12 IC socket with 2.54mm terminal pitch, gold over nickel contact finish, and nylon46 housing material. It has 12 contacts rated at 3A for wire wrap termination, suitable for chip carrier applications on PCBs with rectangular contact pattern spacing of 0.1 inch.
390261-6
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
2-1571552-9
TE Connectivity
TE Connectivity's 2-1571552-9 is a DIP28 IC socket with 28 contacts, rated at 3A current. Featuring a PCB contact row spacing of 15.24mm and rectangular pattern, it uses solder termination for applications requiring a dielectric voltage withstand of 1400VAC.
D2818-42
Harwin Plc
D2818-42 by Harwin PLC is a Chip Carrier IC Socket with 18 contacts, rated for 1A current. Made of plastic, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for DIP18 devices, this socket features solder termination and round pin contact style.
540-88-044-17-400-TR
Preci-dip Sa
IC SOCKET; Device Type Used On: PLCC44; Housing Material: PPS THERMOPLASTIC; Additional Features: STANDARD: UL 94V-0, LOW PROFILE; No. of Contacts: 44; Contact Material: NOT SPECIFIED;
PLE08-0
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8;
XR2A-1605
IC SOCKET; Manufacturer Series: XR2;
614-91-964-31-012000
IC SOCKET;
342-40-156-00-593000
Mill-max Mfg's 342-40-156-00-593000 is a POLYETHYLENE IC SOCKET for SIP56 devices with 56 contacts. It features MATTE TIN OVER NICKEL finish, RECTANGLE contact config, ideal for Chip Carrier IC & Component Sockets applications.
PTFZ-08-E
Omron's PTFZ-08-E is a Chip Carrier IC Socket with 8 contacts, rated at 15A current. It has a straight mounting style and blade pin-skt contact style, suitable for use on relays. With a min operating temperature of -25°C and screw termination type, it offers reliable performance in various applications.
XR2T-2467-N
IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH;
1437540-3
IC SOCKET; Device Type Used On: DIP32; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): Tin/Lead (Sn/Pb); No. of Contacts: 32;
110-13-314-41-801000
110-13-314-41-801000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing material. It is designed for DIP14 devices, featuring 14 gold over nickel contacts in a rectangular configuration. Ideal for secure and reliable connections in electronic applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
APH-1016-T-T
Samtec
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; JESD-609 Code: e3; Contact Material: BRASS; Contact Finish (Mating): TIN OVER NICKEL (50);
APH-1016-G-T
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; No. of Contacts: 16; Contact Config: RECTANGLE; Contact Material: BRASS;
APH-1016-T-R
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Material: BRASS; No. of Contacts: 16;
APH-1502-G-H
IC SOCKET; Device Type Used On: DIP2; Housing Material: POLYETHYLENE; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); JESD-609 Code: e4; Additional Features: LOW PROFILE;
APH-1502-G-R
IC SOCKET; Device Type Used On: DIP2; Housing Material: POLYETHYLENE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Config: RECTANGLE; No. of Contacts: 2;
APH-1502-G-T
IC SOCKET; Device Type Used On: DIP2; Housing Material: POLYETHYLENE; JESD-609 Code: e4; Additional Features: UL 94V-0; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
APH-1504-G-H
IC SOCKET; Device Type Used On: DIP4; Housing Material: POLYETHYLENE; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Additional Features: LOW PROFILE;
APH-1504-G-R
IC SOCKET; Device Type Used On: DIP4; Housing Material: POLYETHYLENE; JESD-609 Code: e4; No. of Contacts: 4; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
APH-1504-G-T
IC SOCKET; Device Type Used On: DIP4; Housing Material: POLYETHYLENE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Additional Features: UL 94V-0; Contact Config: RECTANGLE;
APH-1506-G-H
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYETHYLENE; Additional Features: LOW PROFILE; No. of Contacts: 6; JESD-609 Code: e4;
APH-1506-G-R
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYETHYLENE; No. of Contacts: 6; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Config: RECTANGLE;
APH-1506-G-T
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYETHYLENE; Additional Features: UL 94V-0; Contact Material: BRASS; No. of Contacts: 6;
APH-1508-G-H
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; No. of Contacts: 8; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Config: RECTANGLE;
APH-1508-G-R
APH-1508-T-H
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; Contact Material: BRASS; No. of Contacts: 8; Additional Features: LOW PROFILE;
APH-1508-T-R
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; Additional Features: LOW PROFILE; No. of Contacts: 8; Contact Material: BRASS;
APH-1508-T-T
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; Contact Material: BRASS; Contact Finish (Mating): TIN OVER NICKEL (50); JESD-609 Code: e3;
APH-1524-G-R
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYETHYLENE; No. of Contacts: 24; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
APH-1534-G-H
IC SOCKET; Device Type Used On: DIP34; Housing Material: POLYETHYLENE; Contact Material: BRASS; JESD-609 Code: e4; Contact Config: RECTANGLE;
APH-1540-G-R
IC SOCKET; Device Type Used On: DIP40; Housing Material: POLYETHYLENE; JESD-609 Code: e4; Contact Material: BRASS; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
Supply Digital Components
$106.00
$54.25
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$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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