Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Samtec's ICF-624-F-O is a Chip Carrier IC Socket with 24 contacts, 15.24mm PCB row spacing, and liquid crystal polymer housing. It features gold flash over nickel contact finish, suitable for DIP24 devices in applications requiring a current rating of 1A and operating temperatures from -55°C to 125°C.
Median Price
$2.950
Lifecycle Status
Suppliers In-Stock
2
In-Stock Inventory
1k+
Nova Conductors
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
Continental Prestige Electronics
$2.891
Argo Parts USA
Netroflash
AZTECH Wire
$19.691
Aztec Data Supply Inc.
Corohmni
The close spacing of the PCB contacts allows for efficient use of board space and compact design.
Liquid crystal polymer provides excellent mechanical and thermal properties, making the product durable and reliable in various operating conditions.
The wide temperature range allows for the product to be used in extreme environments without compromising performance.
The fine pitch ensures precise alignment and reliable connection between the chip carrier and the socket.
Beryllium copper alloy offers excellent conductivity and durability, ensuring reliable electrical connections.
With 24 contacts, the chip carrier IC & component socket can accommodate a wide range of devices and components for versatile applications.
High insulation resistance ensures that there is no leakage of current between contacts, preventing electrical malfunctions.
Gold flash over nickel finish provides excellent conductivity and corrosion resistance, ensuring long-lasting performance.
Straight mounting style simplifies installation and ensures secure attachment to the PCB.
The 1 amp current rating allows the chip carrier IC & component socket to handle moderate power requirements.
The high dielectric voltage withstand capability ensures safe operation under high voltage conditions.
Tin with nickel barrier termination provides reliable solder connections for a stable and durable electrical connection.
The IC socket type is specifically designed for integrated circuits, ensuring compatibility and proper connection.
The high maximum operating temperature allows for reliable performance in challenging thermal environments.
The 2.54mm terminal pitch enables compatibility with a wide range of components and devices, making it a versatile choice.
Chip Carrier IC & Component Sockets ICF-624-F-O attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
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ICF-624-F-O Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
BAV99
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
SN65HVD234DR
Texas Instruments
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
Fairchild Semiconductor
Sensitron Semiconductor
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Tesla Elektronicke Soucastky
LM358AN
Signetics
BSS123NH6327XTSA1
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
Silicon Standard
PY14-Y3
Omron
RELAY SOCKET;
2271484
Phoenix Contact
251-5949-01-0602
3m Electronic Products Division
The 3m Electronic Products Division's 251-5949-01-0602 is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing. It has 51 BERYLLIUM COPPER contacts finished in GOLD over NICKEL for ZIP51 devices. Ideal for applications requiring reliable connections and durability.
PYFZ-08
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
MT78745
IC SOCKET; Housing Material: POLYAMIDE; Termination Type: SCREW; No. of Contacts: 8; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
3-1393143-2
IC SOCKET; Housing Material: NYLON; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER; No. of Contacts: 11; Contact Material: NOT APPLICABLE;
SR3P-05
Idec
Idec's SR3P-05 chip carrier IC socket has 11 RND PIN-SKT contacts, rated for 10A current. With a temperature range of -5 to 40°C, it is ideal for relay applications requiring secure screw terminations. Measuring 2.165" x 1.654" x 1.122", this RELAY SOCKET offers reliable connectivity in various electronic devices.
ICO-308-NGG
Samtec
The Samtec ICO-308-NGG is a Chip Carrier IC Socket with 8 contacts, featuring a PCB contact row spacing of 7.62mm and rectangular contact pattern. It uses beryllium copper for contacts, gold finish over nickel for mating, and operates b/w -65°C to 125°C. Ideal for DIP8 devices, it has a current rating of 1A and dielectric voltage withstand of 1000VAC.
08-6501-21
Aries Electronics
Aries Electronics 08-6501-21 is a DIP8 IC socket with 15.24mm PCB contact row spacing and rectangular pattern. It features wire wrap termination, gold over nickel mating finish, and P-CUSN contact material. Ideal for applications requiring a current rating of 1.5A at temperatures up to 125°C.
XR2T-2473-N
IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
ICA-203-S-TG30
ICA-203-S-TG30 by 3M EPD is a DIP20 IC socket with 20 contacts, rated at 1A current. Featuring gold over nickel contact finish, it has a body length of 0.995" and operates b/w -65°C to 125°C. Ideal for chip carrier ICs, its rectangular PCB pattern with 7.62mm row spacing suits various applications requiring reliable connections.
HLS-0403-G-2
Samtec's HLS-0403-G-2 is a 12-contact IC socket with gold finish, ideal for PGA12 devices. Made of plastic, it offers reliable connectivity and durability. Suitable for chip carrier applications requiring secure component sockets.
RSE116166
Amphenol
XR2A-2802
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Termination): GOLD;
150-10-316-00-006101
Preci-dip Sa
150-10-316-00-006101 by Preci-dip Sa is a DIP16 IC socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts plated with GOLD. It has 16 contacts for chip carrier ICs and components, suitable for various electronic applications requiring reliable connections.
XR2C-3215
IC SOCKET; Contact Finish (Termination): GOLD; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
RXZE2M114M
Schneider Electric Sa
XR2T-1801-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
P2R-08A
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
173-10-328-00-001000
Mill-max Mfg
The Mill-max Mfg 173-10-328-00-001000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
ICF-624-T-O-TR
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Length: 1.2 inch;
ICF-624-TM-O
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Maximum Operating Temperature: 125 Cel;
ICF-624-TM-O-TR
ICF-624-TM-O-TR by Samtec is a chip carrier IC socket with 24 contacts and a rectangular contact pattern. It has a PCB contact row spacing of 15.24mm and is made of liquid crystal polymer. This socket is used on DIP24 devices and can operate in temperatures ranging from -55°C to 125°C.
ICF-628-T-O
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-628-T-O-TR
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Width: .675 inch;
ICF-624-S-I
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-640-S-O
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-628-S-O
ICF-624-F-I
ICF-624-F-O-TR
ICF-624-S-O
ICF-624-T-I
ICF-624-T-O
ICF-624-TL-I-TR
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: BERYLLIUM COPPER ALLOY;
ICF-624-S
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Depth: .18 inch;
ICF-624-T
ICF-624-SM-O-TR
ICF-624-STL-O-TR
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Mating Contact Pitch (inch): 0.1;
ICF-624-STL-O
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; No. of Contacts: 24;
ICF-624-TM-I-TR
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; PCB Contact Row Spacing (mm): 15.24;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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