Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Samtec's ICF-640-S-O is a Chip Carrier IC Socket with 40 contacts, featuring Beryllium Copper pins and Liquid Crystal Polymer housing. It has a contact pitch of 0.1", suitable for DIP40 devices, with operating temperatures ranging from -55 to 125°C. Ideal for surface mount applications in electronics requiring high insulation resistance and dielectric voltage withstand capabilities.
Median Price
$9.592
Lifecycle Status
Suppliers In-Stock
10
In-Stock Inventory
1k+
Mouser Electronics
1+ parts
$8.140
100+ parts
$7.640
1k+ parts
$6.210
10k+ parts
$5.510
Verical
$9.215
$8.711
-
DigiKey
$9.970
$7.056
$5.714
$5.419
Samtec
$7.060
$5.710
$4.820
Powell Electronics
Arrow
Vyrian
ACDS - Activité Composants Distribution Service
Nova Conductors
LWI Electronics Inc
Authorized Procurement Solutions
Continental Prestige Electronics
Perfect Parts
Argo Parts USA
Netroflash
Cyclops Electronics Ltd (Excess)
The wide spacing between PCB contacts allows for easier soldering and reduces the risk of short circuits, making this product user-friendly.
Liquid Crystal Polymer provides excellent heat resistance and dimensional stability, ensuring the reliability and durability of the chip carrier IC socket.
The wide range of operating temperatures makes this chip carrier IC socket suitable for use in extreme environments or industrial applications.
The close contact pitch allows for a high density of connections, making this socket ideal for applications where space is limited and a large number of connections are required.
Beryllium Copper provides excellent conductivity and durability, ensuring a reliable connection for the IC chip and preventing signal loss or degradation.
The high insulation resistance ensures that there is minimal leakage of current between contacts, reducing the risk of electrical shorts and improving overall system performance.
The gold and nickel plating provides excellent corrosion resistance and ensures a stable and low-resistance contact interface, minimizing signal loss and ensuring a reliable electrical connection.
The high maximum operating temperature allows for reliable performance in a wide range of operating environments, ensuring the longevity and stability of the chip carrier IC socket.
Chip Carrier IC & Component Sockets ICF-640-S-O attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
Contact Style:
Installation Type:
Mating Contact Pitch:
PCB Contact Row Spacing:
Terminal Pitch:
Mounting Style:
PCB Contact Layout:
IC Socket Type:
Housing Material:
Length:
Width:
Depth:
JESD-609 Code:
Current Rating:
Dielectric Withstanding Voltage:
Insulation Resistance:
Minimum Operating Temperature:
Maximum Operating Temperature:
Compatible Device Type:
Special Features:
ICF-640-S-O Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
1N4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
STMicroelectronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
BAV99
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Taiwan Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Synsemi
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
Transys Electronics
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Shenzhen Socay Electronics
MICRODIODE ELECTRONICS SHENZHEN CO LTD
LM317T
LM317T by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. Operating temperature ranges from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. With a max output current of 1.5A, this through-hole package regulator is ideal for power supply designs where adjustable voltage levels are needed.
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
2N7002-T1-E3
Vishay Intertechnology
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
110-83-314-41-001101
Preci-dip Sa
110-83-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts, rated for 1A current. It features Beryllium Copper contact material, Gold mating finish, and Tin termination finish. With a PCB contact row spacing of 7.62mm, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for chip carrier IC applications due to its high insulation resistance and durable housing material.
XR2B-1611-N
Omron
IC SOCKET; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10);
1-390261-3
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
8134-HC-5P3
Augat
IC SOCKET; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Rating (Current): 5 A; Termination Type: PRESS FIT; No. of Contacts: 1;
ICF-328-T-O-TR
Samtec's ICF-328-T-O-TR is a Chip Carrier IC Socket with 28 contacts, featuring a PCB contact row spacing of 7.62mm and rectangular contact pattern. It utilizes liquid crystal polymer housing material and has a mating contact pitch of 0.1 inch. Ideal for DIP28 devices, it offers surface mount termination and operates b/w -55°C to 125°C.
203-2737-55-1102
3m Electronic Products Division
203-2737-55-1102 by 3M Electronic Products Division is a chip carrier IC socket with POLYPHENYLENE SULFIDE housing and BERYLLIUM COPPER contacts. It features 3 gold-over-nickel contacts for mating and termination. Ideal for electronic applications requiring reliable connections in IC sockets.
MPAS-069-ZHGT-11
Samtec's MPAS-069-ZHGT-11 is a PGA69 IC socket with 69 contacts, 2.54mm terminal pitch, and rectangular PCB contact pattern. It features polyester housing material, solder termination type, and operates b/w -65°C to 125°C. Ideal for chip carrier applications requiring a mating contact pitch of 0.1 inch and insulation resistance of 5G ohm.
XR2C-2001-N
IC SOCKET; Manufacturer Series: XR2; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
4-1571552-8
TE Connectivity
TE Connectivity's 4-1571552-8 is a DIP24 IC socket with 24 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 15.24mm row spacing and PCT-plastic polyester housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and operating temperatures ranging from -55°C to 105°C.
ICF-308-T-I-TR
Samtec's ICF-308-T-I-TR is a Chip Carrier IC Socket with 8 contacts, rated at 1A current. It features a rectangular contact pattern on a 7.62mm PCB row spacing, suitable for DIP8 devices. With liquid crystal polymer housing and operating temperatures from -55°C to 125°C, it offers surface mount termination for various applications.
4-1419106-0
IC SOCKET; Termination Type: SOLDER; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
5-1393143-1
IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Termination Type: SOLDER LUG; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
551-10-155-18-121005
Mill-max Mfg
Mill-max Mfg's 551-10-155-18-121005 is a chip carrier IC & component socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. It is used on PGA155 devices and has 155 contacts with GOLD (10) mating finish over NICKEL (150). The IC socket type features Gold (Au) termination finish with Nickel (Ni) barrier.
5-210781-0
5-210781-0 by Tyco Electronics Amp is a 50-contact IC socket with gold finish, suitable for SIP50 devices. It features GLASS FILLED POLYETHYLENE POLYESTER housing and BERYLLIUM COPPER contacts. Ideal for chip carrier IC applications requiring reliable connections.
ZA8-20-2-1.00-Z-10
IC SOCKET;
HLS-1820-T-22
The Samtec HLS-1820-T-22 is a plastic IC socket with 360 gold contacts for PGA360 devices. It offers gold contact finish for mating and termination, suitable for chip carrier applications. This component is designed to provide reliable connections in electronic assemblies.
2833615
Phoenix Contact
RELAY SOCKET; Device Type Used On: RELAY; Maximum Operating Temperature: 85 Cel; Termination Type: SCREW; Minimum Operating Temperature: -40 Cel; Rating (Current): 10 A;
8468-11B1-RK-TP
8468-11B1-RK-TP by 3M is a PLCC68 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. It features 68 contacts made of PHOSPHOR BRONZE, operating from -40°C to 105°C. Ideal for applications requiring a durable and reliable chip carrier socket with solder termination.
818-AG11D-ESL-LF
TE Connectivity's 818-AG11D-ESL-LF is a Chip Carrier IC Socket with 18 contacts, rated at 3A current. Featuring rectangular PCB contact pattern with 7.62mm row spacing, it uses solder termination and operates b/w -55°C to 105°C. Ideal for DIP18 devices, this socket has a dielectric voltage of 1000VAC and insulation resistance of 5G ohm.
S421
TE Connectivity's S421 is a chip carrier IC socket with 18 contacts and a PCB contact row spacing of 7.62mm. It has a housing made of glass-filled PBT and can operate in temperatures ranging from -40 to 105 °C. This IC socket is commonly used for solder termination in various electronic applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
ICF-624-T-O-TR
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Length: 1.2 inch;
ICF-624-F-O
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-624-TM-O
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Maximum Operating Temperature: 125 Cel;
ICF-624-TM-O-TR
ICF-624-TM-O-TR by Samtec is a chip carrier IC socket with 24 contacts and a rectangular contact pattern. It has a PCB contact row spacing of 15.24mm and is made of liquid crystal polymer. This socket is used on DIP24 devices and can operate in temperatures ranging from -55°C to 125°C.
ICF-628-T-O
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-628-T-O-TR
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Width: .675 inch;
ICF-624-S-I
ICF-628-S-O
ICF-640-F-I
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-640-F-O
ICF-640-T-O
ICF-640-TL-I
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Mating): NOT SPECIFIED;
ICF-640-TL-O-TR
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; PCB Contact Pattern: RECTANGULAR;
ICF-640-FM-I-TR
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Length: 2 inch;
ICF-640-FM-I
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Depth: .18 inch;
ICF-640-STL-O-TR
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Rating (Current): 1 A;
ICF-640-STL-O
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Termination Type: SURFACE MOUNT;
ICF-640-TM-I-TR
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: BERYLLIUM COPPER ALLOY;
ICF-640-TM-I
ICF-640-TM-O-TR
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; PCB Contact Row Spacing (mm): 15.24;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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