Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
Mill-max Mfg's 342-40-156-00-593000 is a POLYETHYLENE IC SOCKET for SIP56 devices with 56 contacts. It features MATTE TIN OVER NICKEL finish, RECTANGLE contact config, ideal for Chip Carrier IC & Component Sockets applications.
Median Price
$17.605
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Nova Conductors
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
VNN
AZTECH Wire
$1.450
$1.390
$1.360
$1.340
Aranea Global
$17.253
$16.563
Continental Prestige Electronics
Ampacity Inc.
$22.000
Argo Parts USA
Aztec Data Supply Inc.
POLYETHYLENE is a durable and lightweight material that provides good insulation and protection for the chip carrier IC, ensuring long-term reliability.
Designed specifically for SIP56 devices, this chip carrier IC & component socket offers a secure and precise fit, reducing the risk of connectivity issues.
With 56 contacts, this chip carrier IC & component socket can accommodate a wide range of integrated circuits, making it versatile for various electronic applications.
The matte tin over nickel finish provides excellent conductivity and corrosion resistance, enhancing the overall performance and longevity of the chip carrier IC & component socket.
Being an IC socket type, this product allows for easy installation and removal of integrated circuits, making it convenient for testing and replacing components as needed.
The rectangular contact configuration ensures a secure and stable connection between the integrated circuit and the socket, minimizing the risk of signal interference or disruptions.
Chip Carrier IC & Component Sockets 342-40-156-00-593000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
342-40-156-00-593000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1552200168
Molex
WIRE AND CABLE;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
DP83848IVVX/NOPB
Texas Instruments
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
4554
Jw Miller Magnetics
Other Semiconductors;
LL4148
Semtech Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
LM317T/NOPB
LM317T/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount with three terminals for easy installation.
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
Panjit International
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
2N7002
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
CRGCQ0805F10R
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
Rugao Dachang Electronic
Gulf Semiconductor
1N4148WS
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0540T1G
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
27000000
RELAY SOCKET; JESD-609 Code: e3; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT APPLICABLE; Contact Finish (Termination): TIN;
123-13-322-41-001000
Mill-max Mfg
123-13-322-41-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP22 devices with 22 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
SY4S-05C
Idec
RELAY SOCKET;
XR2A-2001-N
Omron
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Manufacturer Series: XR2A;
XR2C-2005
IC SOCKET; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
4590
Keystone Electronics
Keystone Electronics 4590 is a TO-5 transistor socket with GLASS FILLED POLYESTER housing. Featuring 3 RND PIN-SKT contacts, it has a 0.165" body depth and SOLDER termination. Ideal for chip carrier IC applications requiring a STRAIGHT mounting style.
ICA-628-SST
Samtec
Samtec's ICA-628-SST is a DIP28 IC socket with 28 contacts, rated at 1A current. It features gold over nickel contact finish, polyester housing material, and operates b/w -65 to 125°C. Ideal for chip carrier applications with rectangular PCB contact pattern and 15.24mm row spacing.
APH-1508-G-T
The Samtec APH-1508-G-T is a DIP8 IC socket with 8 brass contacts and gold over nickel finish. It features a polyethylene housing material and rectangular contact configuration. Ideal for chip carrier applications, this IC socket is designed to provide reliable connections in electronic devices.
2625-6325-9UA-1902
3m Electronic Products Division
2625-6325-9UA-1902 by 3M Electronic Products Division is a POLYETHERSULFONE chip carrier IC socket for PGA625 with 625 gold contacts. It features gold (30) over nickel (50) finish for mating and termination, suitable for high-performance integrated circuit applications.
8-1393163-3
IC SOCKET; Housing Material: POLYAMIDE; Termination Type: SOLDER; No. of Contacts: 3; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
228-7396-55-1902
228-7396-55-1902 by 3M Electronic Products Division is a POLYETHERSULFONE IC SOCKET for SOIC28 devices. It features 28 BERYLLIUM COPPER contacts with GOLD (30) OVER NICKEL (50) mating finish and GOLD OVER NICKEL termination. Ideal for chip carrier IC applications requiring reliable connectivity.
XR2A-3202
IC SOCKET; Manufacturer Series: XR2A; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30);
HLS-0403-G-2
Samtec's HLS-0403-G-2 is a 12-contact IC socket with gold finish, ideal for PGA12 devices. Made of plastic, it offers reliable connectivity and durability. Suitable for chip carrier applications requiring secure component sockets.
40-6508-311
Aries Electronics
Aries Electronics 40-6508-311 is a DIP40 IC socket with 40 contacts, featuring rectangular PCB contact pattern spaced at 15.24mm. Made of glass-filled nylon46, it has wire wrap termination and uses round pin sockets. Ideal for applications requiring precise connections on a 2x0.7x0.19" board with 0.1" pitch mating contacts.
XR2A-2421-N
IC SOCKET; Contact Finish (Mating): GOLD FLASH; Contact Finish (Termination): GOLD FLASH; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2A;
110-87-308-41-001101
Preci-dip Sa
110-87-308-41-001101 by Preci-dip Sa is a DIP8 IC socket with 7.62mm PCB contact row spacing and Beryllium Copper contacts. It features a housing made of Polycyclohexydimethylene Terephthalate-Polyester, gold flash mating contact finish, and can withstand temperatures from -55 to 125 °C. Ideal for applications requiring reliable connections in electronic devices.
816-AG11D-ESL-LF
TE Connectivity's 816-AG11D-ESL-LF is a DIP16 IC socket with 16 contacts, rated at 3A current. Featuring a PCB contact row spacing of 7.62mm and rectangular pattern, it uses solder termination and has a thermoplastic polyester housing. Ideal for applications requiring a dielectric voltage withstand of 1000VAC in temperatures ranging from -55 to 105°C.
ICF-624-S-I
Samtec's ICF-624-S-I is a Chip Carrier IC Socket with 24 contacts, featuring a PCB contact row spacing of 15.24mm and rectangular contact pattern. It uses liquid crystal polymer housing material and has a mating contact pitch of 0.1". Ideal for DIP24 devices, it operates b/w -55°C to 125°C, with termination type as surface mount.
XR2B-3201-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD;
CQF100143E
IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 100;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
342-40-139-00-591000
Mill-max Mfg's 342-40-139-00-591000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 contacts. It features MATTE TIN OVER NICKEL finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
342-40-156-00-591000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): MATTE TIN OVER NICKEL;
342-40-156-00-592000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; Additional Features: SOCKET HEADER; JESD-609 Code: e3; No. of Contacts: 56;
342-40-156-00-594000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; Contact Finish (Mating): NOT SPECIFIED; Contact Config: RECTANGLE; Additional Features: SOCKET HEADER;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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