Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Samtec HLS-1217-T-22-L is a POLYETHYLENE chip carrier socket with 204 GOLD contacts for PGA204 devices. It features IC SOCKET type and GOLD (Au) contact finish for mating and termination. Ideal for high-performance applications requiring reliable connections in electronic systems.
Median Price
$20.800
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Suppliers In-Stock
2
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< 1k
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1+ parts
100+ parts
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Vyrian
AZTECH Wire
$18.315
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$20.384
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Netroflash
$19.760
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Polyethylene is a durable and lightweight material which helps in protecting the chip carrier IC effectively. It also ensures that the socket can withstand regular usage without damage.
Compatibility with PGA204 devices ensures that this chip carrier IC & component socket is specifically designed to work with these types of devices, providing a secure and reliable connection.
The high number of contacts allows for a wide range of connections, making this product suitable for complex integrated circuits that require multiple connections.
Gold plating on the mating contacts provides excellent conductivity and corrosion resistance, ensuring a stable and reliable connection between the chip carrier IC and the socket.
Gold termination finish provides good solderability and conductivity, enhancing the overall performance of the socket by facilitating efficient signal transmission and reducing signal loss.
Being an IC socket, this product offers easy insertion and removal of the chip carrier IC, allowing for convenient testing and replacement of integrated circuits without the need for soldering or desoldering.
Chip Carrier IC & Component Sockets HLS-1217-T-22-L attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
HLS-1217-T-22-L Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
LL4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
International Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
Eic Semiconductor
MMBT2907ALT1G
Onsemi
MMBT2907ALT1G by Onsemi is a PNP BJT transistor with 100 min hFE, 60V VCEO, and 200MHz fT. Ideal for switching applications, it has a small outline package with Gull Wing terminals and can handle up to 0.6A of collector current.
1N4148WS
Vishay Intertechnology
Vishay Intertechnology's 1N4148WS is a single rectifier diode with a max forward voltage of 1V and output current of 0.15A. With a fast reverse recovery time of 0.004us, it operates up to 150°C. Ideal for applications requiring high-speed switching and low power consumption in surface mount configurations.
STMicroelectronics
Pro-an Electronic
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS340T3G
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0520LT1G
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
380-10-120-10-003000
Mill-max Mfg
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
CQF100-155A
Texas Instruments
IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; No. of Contacts: 100; Manufacturer Series: CQF;
822472-3
TE Connectivity
TE Connectivity's 822472-3 is a PLASTIC Chip Carrier IC Socket for PLCC32 devices. With -55 to 105 °C operating range, it has 32 contacts and 600VAC dielectric voltage. Ideal for surface mount applications with bellowed contact style and TIN LEAD finish.
2271015
Phoenix Contact
RELAY SOCKET; Device Type Used On: SIP1; Housing Material: POLYAMIDE; No. of Contacts: 1; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
214-44-316-01-670800
214-44-316-01-670800 by Mill-max Mfg is a NYLON46 chip carrier IC socket for DIP16 devices with 16 contacts and matte tin finish. It features a rectangular contact configuration, ideal for secure connections in electronic applications like PCBs and integrated circuits.
ICF-640-S-O
Samtec
Samtec's ICF-640-S-O is a Chip Carrier IC Socket with 40 contacts, featuring Beryllium Copper pins and Liquid Crystal Polymer housing. It has a contact pitch of 0.1", suitable for DIP40 devices, with operating temperatures ranging from -55 to 125°C. Ideal for surface mount applications in electronics requiring high insulation resistance and dielectric voltage withstand capabilities.
P7SA-10P
Omron
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 10; Contact Material: NOT SPECIFIED;
110-87-308-41-001101
Preci-dip Sa
110-87-308-41-001101 by Preci-dip Sa is a DIP8 IC socket with 7.62mm PCB contact row spacing and Beryllium Copper contacts. It features a housing made of Polycyclohexydimethylene Terephthalate-Polyester, gold flash mating contact finish, and can withstand temperatures from -55 to 125 °C. Ideal for applications requiring reliable connections in electronic devices.
173-10-304-00-001000
173-10-304-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP4 devices with 4 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE configuration. Ideal for Chip Carrier IC & Component Sockets applications.
2-1571586-9
3m Electronic Products Division
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: THERMOPLASTIC;
PR2-BSP3/4X21
RELAY SOCKET;
RSE116685
Amphenol
Amphenol's RSE116685 is a RELAY SOCKET with 8 GOLD contacts. Made of POLYETHERIMIDE, it operates b/w -65°C to 125°C. Ideal for Chip Carrier ICs, this socket ensures reliable connections in various electronic applications.
A14-LC-TT
Assmann Wsw Components
A14-LC-TT by Assmann Wsw Components is a DIP14 IC socket with 14 phosphor bronze contacts and polybutylene terephthalate housing. It features tin contact finish for mating (80) and termination (Sn), suitable for chip carrier applications. The rectangular contact configuration makes it ideal for secure connections in electronic devices.
93.01.7.024
Finder
RELAY SOCKET; Device Type Used On: RELAY;
816-22-057-10-000101
IC SOCKET; Device Type Used On: SIP57; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 57; Contact Finish (Termination): GOLD OVER NICKEL;
134-10-328-00-020000
134-10-328-00-020000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 GOLD OVER NICKEL contacts. Its RECTANGLE contact config makes it ideal for Chip Carrier IC & Component Sockets applications.
342-90-156-00-593000
Mill-max Mfg's 342-90-156-00-593000 is a POLYETHYLENE chip carrier IC socket for SIP56 devices with 56 contacts. Features TIN LEAD (200) mating finish over NICKEL (150) and Tin/Lead termination with Nickel barrier. Ideal for rectangular contact configuration in electronic applications.
XR2A-2225
IC SOCKET; Manufacturer Series: XR2;
APH-1508-G-T
The Samtec APH-1508-G-T is a DIP8 IC socket with 8 brass contacts and gold over nickel finish. It features a polyethylene housing material and rectangular contact configuration. Ideal for chip carrier applications, this IC socket is designed to provide reliable connections in electronic devices.
PY11
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HLS-1204-TT-31
IC SOCKET; Device Type Used On: PGA48; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; No. of Contacts: 48;
HLS-1518-T-11
IC SOCKET; Device Type Used On: PGA270; Housing Material: PLASTIC; Additional Features: LOWPROFILE; No. of Contacts: 270; Contact Finish (Termination): Gold (Au);
HLS-1820-T-22
IC SOCKET; Device Type Used On: PGA360; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (30); Contact Material: NOT SPECIFIED; Contact Finish (Termination): Gold (Au);
HLS-1902-S-22-L
IC SOCKET; Device Type Used On: DIP38; Housing Material: POLYETHYLENE; No. of Contacts: 38; Contact Finish (Termination): Gold (Au); Contact Material: NOT SPECIFIED;
HLS-1219-T-15
IC SOCKET; Device Type Used On: PGA228; Housing Material: POLYETHYLENE; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
HLS-1217-T-10
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; Contact Finish (Mating): GOLD (30); Additional Features: LOWPROFILE; Contact Finish (Termination): Gold (Au);
HLS-1217-T-12
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); No. of Contacts: 204;
HLS-1217-T-14
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
HLS-1217-T-15
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; JESD-609 Code: e3; No. of Contacts: 204; Contact Material: NOT SPECIFIED;
HLS-1217-T-18
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; Contact Material: NOT SPECIFIED; No. of Contacts: 204; Contact Finish (Termination): Gold (Au);
HLS-1217-T-2-L
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; Contact Material: NOT SPECIFIED; Contact Finish (Termination): Gold (Au); No. of Contacts: 204;
HLS-1217-T-22
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30); No. of Contacts: 204;
HLS-1217-T-23
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30); No. of Contacts: 204;
HLS-1217-T-2
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); No. of Contacts: 204;
HLS-1217-T-32
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; No. of Contacts: 204; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30);
HLS-1217-T-34
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; JESD-609 Code: e3; No. of Contacts: 204; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
HLS-1217-T-35
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; JESD-609 Code: e4; No. of Contacts: 204; Contact Material: NOT SPECIFIED;
HLS-1217-T-38
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; JESD-609 Code: e3; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
HLS-1217-T-3
IC SOCKET; Device Type Used On: PGA204; Housing Material: THERMOPLASTIC; Contact Finish (Termination): Gold (Au); No. of Contacts: 204; Contact Finish (Mating): GOLD (30);
HLS-1217-T-19
IC SOCKET; Device Type Used On: PGA204; Contact Finish (Termination): Gold (Au); No. of Contacts: 204; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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