Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TE Connectivity's 1-390262-2 is a chip carrier IC socket with 28 contacts and a rectangular contact pattern. It has a PCB contact row spacing of 15.24mm and is used for DIP28 devices. With a temperature range of -40 to 105°C, it offers reliable performance in various applications.
Median Price
$0.289
Lifecycle Status
Suppliers In-Stock
26
In-Stock Inventory
1k+
Adafruit Industries
1+ parts
100+ parts
1k+ parts
10k+ parts
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Master Electronics
Freelance Electronics
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Component Electronics Inc.
$1.540
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$1.000
ACDS - Activité Composants Distribution Service
Dan-Mar Components
ComSIT Distribution GmbH
Vyrian
Connector Distribution Corp
Right Parts Inc.
Chip Stock
LIBRA Elektronik GmbH
First Choice Components Inc.
PC Components Company LLC
Bristol Electronics
LWI Electronics Inc
Sensible Micro Corp
Extreme Components
IBS Electronics
$2.777
$1.445
VNN
Inventory MP
Prism Electronics
Dark Horse Electronics
Carlin Systems, Inc.
Standard Data Resources
Semicontronic
$0.246
$0.240
$0.239
Advanced Electronics
Continental Prestige Electronics
$0.360
Argo Parts USA
$0.356
Netroflash
Perfect Parts
Metaverse IC Inc.
Kepictronics
Aztec Data Supply Inc.
Eliminating Global Boundries, Inc
Cyclops Electronics Ltd (Excess)
Glotronic Ltd.
The wide spacing between PCB contacts allows for efficient signal transmission and reduces the risk of interference, making this product suitable for high-performance applications.
The rectangular contact pattern ensures a secure and reliable connection between the PCB and the chip carrier, promoting stable and consistent operation of the integrated circuits.
The use of glass-filled polybutylene terephthalate ensures excellent mechanical strength and heat resistance, providing a durable and reliable housing for the chip carrier.
Designed specifically for DIP28 devices, this chip carrier IC socket provides proper alignment and support for the integrated circuits, facilitating easy installation and replacement.
With a minimum operating temperature of -40°C, this chip carrier IC socket is suitable for use in extreme environments and ensures reliable performance even in harsh conditions.
The solder termination ensures a robust electrical connection between the chip carrier socket and the PCB, minimizing signal loss and ensuring optimal transmission.
The 0.1-inch mating contact pitch offers compatibility with a wide range of electronic components, allowing for easy integration and versatility in various circuit designs.
The compact body length of 1.4 inches allows for space-saving installation of the chip carrier IC socket, making it ideal for applications where size is a constraint.
The use of phosphor bronze as the contact material ensures excellent electrical conductivity, corrosion resistance, and longevity, optimizing the performance and durability of the chip carrier IC socket.
With 28 contacts, this chip carrier IC socket offers compatibility with DIP28 devices, facilitating efficient and reliable connectivity for a variety of integrated circuits.
Boasting a high insulation resistance of 1,000,000,000 ohms, this chip carrier IC socket provides effective electrical isolation and prevents signal leakage, ensuring accurate and error-free data transmission.
The straight mounting style allows for simple and secure installation of the chip carrier IC socket on the PCB, providing stability and ensuring proper alignment of the integrated circuits.
The leaf contact style offers reliable and low-resistance connections, ensuring efficient electrical conductivity and minimizing power loss, making it a reliable choice for high-performance applications.
With a current rating of 1 ampere, this chip carrier IC socket can handle moderate power requirements, making it suitable for a variety of electronic devices and circuits.
The slim body width of 0.697 inches enables efficient space utilization on the PCB, making this chip carrier IC socket ideal for compact electronic designs.
With a high dielectric withstand voltage of 1000VAC, this chip carrier IC socket provides electrical insulation, preventing voltage breakdown and ensuring the safety of connected components.
The shallow body depth of 0.201 inches allows for efficient placement of the chip carrier IC socket in space-constrained designs, enhancing its compatibility and versatility.
As an IC socket, this product simplifies the installation and replacement of integrated circuits, allowing for easy maintenance and reducing the risk of damage to expensive chips.
The rectangular contact configuration ensures precise alignment and reliable electrical connections, minimizing signal loss and promoting efficient data transmission within the chip carrier IC socket.
With a maximum operating temperature of 105°C, this chip carrier IC socket can withstand elevated temperatures, ensuring stability and consistent performance even in demanding thermal conditions.
The 2.54 mm terminal pitch offers standard spacing for easy compatibility with various PCB designs and components, facilitating hassle-free integration and assembly.
Chip Carrier IC & Component Sockets 1-390262-2 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
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1-390262-2 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
1N4148WS
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
Rfe International
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
BAV99
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Texas Instruments
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
1N4148
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
FDN5618P
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
SBAV99LT1G
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
CC0603KRX7R9BB103
Yageo
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
415-43-236-41-001000
Mill-max Mfg
Mill-max Mfg's 415-43-236-41-001000 is a POLYETHYLENE chip carrier socket for SIP36 devices with 36 TIN contacts. Ideal for IC SOCKET applications due to its RECTANGLE contact configuration and reliable termination finish.
27E123
TE Connectivity
TE Connectivity's 27E123 is a Chip Carrier IC Socket with GLASS FILLED POLYESTER housing. It features 11 RND PIN-SKT contacts, SCREW termination, and a 10A current rating. Ideal for use on RELAY devices, measuring 2.322" in length, 2.385" in width, and 0.925" in depth.
M12883/47-10
Amphenol
RELAY SOCKET; Housing Material: POLYETHERIMIDE; No. of Contacts: 20; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD;
XR2D-2404
Omron
IC SOCKET; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
P2CF-08
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
788-312
Wago
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
1-1904045-1
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; No. of Contacts: 5;
115-47-632-41-003000
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e3; Contact Material: NOT SPECIFIED; Contact Finish (Termination): TIN;
M12883/45-01
Amphenol's M12883/45-01 is a POLYETHERIMIDE chip carrier socket with 8 GOLD contacts for RELAY devices. It is designed as a RELAY SOCKET, suitable for various relay applications due to its high-quality contact finish and durable housing material.
1-2199298-6
TE Connectivity 1-2199298-6 is a Chip Carrier IC Socket with 20 contacts, 7.62mm PCB row spacing, and GLASS FILLED PBT housing material. It has a solder termination type and operates b/w -40°C to 105°C. Ideal for applications requiring a current rating of 1A in straight mounting style.
1-390262-2
PLCC-32-AT-SMT
Adam Tech
PLCC-32-AT-SMT by Adam Tech is a Chip Carrier IC Socket with GLASS FILLED POLYPHENYLENE SULPHIDE housing. Featuring 32 P-CUSN contacts, it has -55 to 105 °C operating range and 1A current rating. Ideal for PLCC32 devices, this surface mount socket offers high insulation resistance and dielectric voltage withstand capability of 500VAC.
818-AG11D-ESL-LF
TE Connectivity's 818-AG11D-ESL-LF is a Chip Carrier IC Socket with 18 contacts, rated at 3A current. Featuring rectangular PCB contact pattern with 7.62mm row spacing, it uses solder termination and operates b/w -55°C to 105°C. Ideal for DIP18 devices, this socket has a dielectric voltage of 1000VAC and insulation resistance of 5G ohm.
XR2A-4802
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; JESD-609 Code: e4;
XR2A-2463-N
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
XR2B-2801-N
IC SOCKET; Manufacturer Series: XR2; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER;
PA1A-PS
Panasonic
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; No. of Contacts: 4; Contact Finish (Mating): NOT SPECIFIED;
XR2A-2465
IC SOCKET; Manufacturer Series: XR2;
PYF11A
RELAY SOCKET;
4828-6000-CP
3m Electronic Products Division
The 3m Electronic Products Division's 4828-6000-CP is a Chip Carrier IC Socket with 28 contacts, made of Glass Filled Polyester. It has a PCB contact row spacing of 15.24mm and operates b/w -25°C to 85°C. Ideal for DIP28 devices, it features solder termination and a mating contact pitch of 0.1 inch.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390261-5
TE Connectivity 1-390261-5 is a Chip Carrier IC Socket with 18 contacts, made of Glass Filled PBT. It has a contact pitch of 0.1", suitable for DIP18 devices. Operating temperature ranges from -40°C to 105°C, ideal for various electronic applications.
1-390261-3
TE Connectivity 1-390261-3 is a Chip Carrier IC Socket with 14 contacts, rated at 1A current. It has a PCB contact row spacing of 7.62mm and operates b/w -40°C to 105°C. Ideal for DIP14 devices, it features a rectangular contact pattern and uses solder termination.
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390261-6
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390261-4
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390262-1
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390262-5
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390262-6
IC SOCKET; Device Type Used On: DIP42; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390262-7
IC SOCKET; Device Type Used On: DIP48; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390261-2
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390262-3
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390263-1
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390263-2
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE/THERMOPLASTIC;
1-390263-4
1-390263-7
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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