Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TE Connectivity's 1-390262-2 is a chip carrier IC socket with 28 contacts and a rectangular contact pattern. It has a PCB contact row spacing of 15.24mm and is used for DIP28 devices. With a temperature range of -40 to 105°C, it offers reliable performance in various applications.
Median Price
$0.289
Lifecycle Status
Suppliers In-Stock
26
In-Stock Inventory
1k+
Adafruit Industries
1+ parts
100+ parts
1k+ parts
10k+ parts
-
Master Electronics
Freelance Electronics
$0.284
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$0.281
Nova Conductors
$0.367
Component Electronics Inc.
$1.540
$1.150
$1.000
ACDS - Activité Composants Distribution Service
Dan-Mar Components
ComSIT Distribution GmbH
Vyrian
Connector Distribution Corp
Right Parts Inc.
Chip Stock
LIBRA Elektronik GmbH
First Choice Components Inc.
PC Components Company LLC
Bristol Electronics
LWI Electronics Inc
Sensible Micro Corp
Extreme Components
IBS Electronics
$2.973
$1.543
VNN
Inventory MP
Prism Electronics
Dark Horse Electronics
Carlin Systems, Inc.
Standard Data Resources
Semicontronic
$0.246
$0.240
$0.239
Advanced Electronics
Continental Prestige Electronics
$0.360
Argo Parts USA
$0.356
Netroflash
Perfect Parts
Metaverse IC Inc.
Kepictronics
Aztec Data Supply Inc.
Eliminating Global Boundries, Inc
Futuretech Components
Cyclops Electronics Ltd (Excess)
Glotronic Ltd.
The wide spacing between PCB contacts allows for efficient signal transmission and reduces the risk of interference, making this product suitable for high-performance applications.
The rectangular contact pattern ensures a secure and reliable connection between the PCB and the chip carrier, promoting stable and consistent operation of the integrated circuits.
The use of glass-filled polybutylene terephthalate ensures excellent mechanical strength and heat resistance, providing a durable and reliable housing for the chip carrier.
Designed specifically for DIP28 devices, this chip carrier IC socket provides proper alignment and support for the integrated circuits, facilitating easy installation and replacement.
With a minimum operating temperature of -40°C, this chip carrier IC socket is suitable for use in extreme environments and ensures reliable performance even in harsh conditions.
The solder termination ensures a robust electrical connection between the chip carrier socket and the PCB, minimizing signal loss and ensuring optimal transmission.
The 0.1-inch mating contact pitch offers compatibility with a wide range of electronic components, allowing for easy integration and versatility in various circuit designs.
The compact body length of 1.4 inches allows for space-saving installation of the chip carrier IC socket, making it ideal for applications where size is a constraint.
The use of phosphor bronze as the contact material ensures excellent electrical conductivity, corrosion resistance, and longevity, optimizing the performance and durability of the chip carrier IC socket.
With 28 contacts, this chip carrier IC socket offers compatibility with DIP28 devices, facilitating efficient and reliable connectivity for a variety of integrated circuits.
Boasting a high insulation resistance of 1,000,000,000 ohms, this chip carrier IC socket provides effective electrical isolation and prevents signal leakage, ensuring accurate and error-free data transmission.
The straight mounting style allows for simple and secure installation of the chip carrier IC socket on the PCB, providing stability and ensuring proper alignment of the integrated circuits.
The leaf contact style offers reliable and low-resistance connections, ensuring efficient electrical conductivity and minimizing power loss, making it a reliable choice for high-performance applications.
With a current rating of 1 ampere, this chip carrier IC socket can handle moderate power requirements, making it suitable for a variety of electronic devices and circuits.
The slim body width of 0.697 inches enables efficient space utilization on the PCB, making this chip carrier IC socket ideal for compact electronic designs.
With a high dielectric withstand voltage of 1000VAC, this chip carrier IC socket provides electrical insulation, preventing voltage breakdown and ensuring the safety of connected components.
The shallow body depth of 0.201 inches allows for efficient placement of the chip carrier IC socket in space-constrained designs, enhancing its compatibility and versatility.
As an IC socket, this product simplifies the installation and replacement of integrated circuits, allowing for easy maintenance and reducing the risk of damage to expensive chips.
The rectangular contact configuration ensures precise alignment and reliable electrical connections, minimizing signal loss and promoting efficient data transmission within the chip carrier IC socket.
With a maximum operating temperature of 105°C, this chip carrier IC socket can withstand elevated temperatures, ensuring stability and consistent performance even in demanding thermal conditions.
The 2.54 mm terminal pitch offers standard spacing for easy compatibility with various PCB designs and components, facilitating hassle-free integration and assembly.
Chip Carrier IC & Component Sockets 1-390262-2 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
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1-390262-2 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Rectron
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
1N4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
Transys Electronics
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
Meritek Electronics
MMBT2907ALT1G
MMBT2907ALT1G by Onsemi is a PNP BJT transistor with 100 min hFE, 60V VCEO, and 200MHz fT. Ideal for switching applications, it has a small outline package with Gull Wing terminals and can handle up to 0.6A of collector current.
RSE116166
Amphenol
RELAY SOCKET;
PTF11A
Omron
RELAY SOCKET; No. of Contacts: 11; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
7-1393161-3
TE Connectivity
IC SOCKET; Housing Material: POLYAMIDE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
XR2A-2465
IC SOCKET; Manufacturer Series: XR2;
2227MC-08-03-18-F1
Multicomp Pro
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; JESD-609 Code: e4; Additional Features: STANDARD: UL94-0;
1825575-2
TE Connectivity's 1825575-2 is a Chip Carrier IC Socket with 8 contacts, BE-CU material, and SN finish. It has a PCB contact row spacing of 17.78mm and mating pitch of 0.1 inch, suitable for DIP8 devices. Ideal for surface mount applications in electronics, it operates b/w -55°C to 125°C with a current rating of 1A.
M12883/52-001
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
XR2C-1011-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10);
HLT-1712-T-H
Samtec
The Samtec HLT-1712-T-H is a plastic IC socket with 204 brass contacts, featuring Tin over Nickel mating finish. Designed for use on PGA204 devices, it offers reliable connectivity and durability in chip carrier applications.
1-1437535-2
TE Connectivity 1-1437535-2 is a DIP8 IC SOCKET with 8 contacts, rated at 3A current. It has a PCB contact row spacing of 7.62mm and uses gold termination for soldering. Ideal for applications requiring a chip carrier socket with insulation resistance of 5G ohm and operating temperatures from -55 to 125°C.
28-3508-311
Aries Electronics
Aries Electronics 28-3508-311 is a DIP28 IC socket with 28 contacts, featuring rectangular PCB contact pattern spaced at 7.62mm. It uses wire wrap termination and has a body size of 1.4" x 0.7" x 0.19". Ideal for applications requiring reliable connections in electronic circuits.
YFS-20-03-H-05-SB-K
YFS-20-03-H-05-SB-K by Samtec is a Chip Carrier IC Socket with 100 contacts. It features Phosphor Bronze contact material with Gold over Nickel finish. The housing material is Liquid Crystal Polymer, suitable for BGA100 devices.
240-1280-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 240-1280-00-0602J is a DIP40 IC socket with GLASS FILLED POLYSULFONE housing. It features 40 BERYLLIUM COPPER contacts with GOLD (30) over NICKEL (50) finish for mating and termination. Ideal for chip carrier ICs, this socket offers reliable connectivity in electronic applications.
D2828-42
Harwin Plc
Harwin PLC's D2828-42 is a plastic IC socket with 28 contacts, rated for 1A current. It has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for DIP28 devices, it features solder termination and round pin sockets, suitable for various electronic applications.
116-43-314-41-008000
Mill-max Mfg
116-43-314-41-008000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP14 devices with 14 contacts. Featuring MATTE TIN OVER NICKEL finish, it is ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
8-1393163-3
IC SOCKET; Housing Material: POLYAMIDE; Termination Type: SOLDER; No. of Contacts: 3; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
P2CF-08-E
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
342-90-139-00-592000
Mill-max Mfg's 342-90-139-00-592000 is a POLYETHYLENE Chip Carrier IC Socket with 39 contacts, TIN LEAD (200) mating finish, and Tin/Lead termination. It is designed for SIP39 devices and features a RECTANGLE contact configuration.
4-1415033-1
IC SOCKET; Termination Type: SOLDER; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 4;
SD-110-G-22-N
SD-110-G-22-N by Samtec is a Chip Carrier IC Socket with 20 contacts, rated for 1A current. Featuring rectangular contact configuration and body dimensions of 1" length, 0.2" width, and 0.175" depth. It is used in DIP20 devices with a mating pitch of 0.1".
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
1-390262-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390261-5
TE Connectivity 1-390261-5 is a Chip Carrier IC Socket with 18 contacts, made of Glass Filled PBT. It has a contact pitch of 0.1", suitable for DIP18 devices. Operating temperature ranges from -40°C to 105°C, ideal for various electronic applications.
1-390261-3
TE Connectivity 1-390261-3 is a Chip Carrier IC Socket with 14 contacts, rated at 1A current. It has a PCB contact row spacing of 7.62mm and operates b/w -40°C to 105°C. Ideal for DIP14 devices, it features a rectangular contact pattern and uses solder termination.
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390261-6
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390261-4
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390262-1
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390262-5
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390262-6
IC SOCKET; Device Type Used On: DIP42; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390262-7
IC SOCKET; Device Type Used On: DIP48; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390261-2
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390262-3
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390263-1
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
1-390263-2
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE/THERMOPLASTIC;
1-390263-4
1-390263-7
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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