Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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D2818-42 by Harwin PLC is a Chip Carrier IC Socket with 18 contacts, rated for 1A current. Made of plastic, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for DIP18 devices, this socket features solder termination and round pin contact style.
Median Price
$21.652
Lifecycle Status
Suppliers In-Stock
7
In-Stock Inventory
1k+
DigiKey
1+ parts
$2.150
100+ parts
$1.602
1k+ parts
$1.387
10k+ parts
$1.239
Mouser Electronics
$1.600
$1.380
$1.210
Element14
-
Newark
$40.430
$32.800
Farnell
$41.155
$26.186
Nova Conductors
$10.315
Vyrian
Semicontronic
$1.750
$1.706
$1.698
AZTECH Wire
$8.360
$8.030
$7.870
$7.710
Continental Prestige Electronics
$10.109
Aztec Data Supply Inc.
Argo Parts USA
Corohmni
Perfect Parts
Netroflash
$9.799
$9.593
The use of plastic ensures a lightweight and durable housing for the chip carrier, making it ideal for various applications while maintaining a cost-effective solution.
Designed to be used on DIP18 devices, this chip carrier socket provides a secure and reliable connection for the specific device type, ensuring compatibility and performance.
With a minimum operating temperature of -55°C, this chip carrier socket is suitable for use in extreme cold environments, providing reliable operation in such conditions.
The solder termination type offers a secure and stable connection for the chip carrier socket, ensuring proper functionality and preventing any potential signal loss or interference.
The specific body length of 0.898 inch is designed to accommodate the DIP18 device, providing a snug fit and proper alignment for optimal performance.
With 18 contacts, this chip carrier socket offers a sufficient number of connections for the DIP18 device, facilitating reliable data transmission and signal quality.
The high insulation resistance of 10 billion ohms ensures minimal signal leakage and interference, maintaining the integrity of the data being transmitted through the chip carrier socket.
The straight mounting style allows for easy installation and alignment of the chip carrier socket, simplifying the assembly process and ensuring a secure fit in the circuit board.
The round pin socket contact style offers a reliable and stable connection for the DIP18 device, ensuring proper signal transmission and reducing the risk of signal loss or distortion.
With a current rating of 1 ampere, this chip carrier socket is capable of handling moderate power requirements, making it suitable for a wide range of applications.
The specific body width of 0.394 inch is designed to accommodate the DIP18 device, providing a compact and space-saving solution for circuit board design.
The high dielectric withstanding voltage of 1400 volts AC ensures reliable insulation and protection against voltage spikes, enhancing the safety and durability of the chip carrier socket.
The contact finish of tin with nickel barrier provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance of the chip carrier socket.
The specific body depth of 0.165 inch is designed to provide a secure and stable housing for the DIP18 device, ensuring proper alignment and electrical connection within the socket.
Designed specifically as an IC socket, this chip carrier socket is optimized for use with integrated circuits, providing a reliable and efficient connection for IC applications.
With a maximum operating temperature of 125°C, this chip carrier socket is suitable for use in high-temperature environments, ensuring reliable performance under various thermal conditions.
Chip Carrier IC & Component Sockets D2818-42 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Harwin PLC
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D2818-42 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Harwin is a world-leading specialist in reliable and high-performance technologies for demanding applications. Through innovation, advanced technologies, service and inspiration we help customers to realize competitive advantage by solving demanding connectivity challenges. Harwin aim to be the first-choice supplier of mission-critical and high-performance connectivity solutions. We keep investing in the latest computer aided design and engineering facilities to drive advancements and retain our position as the industry’s innovators. We also replace equipment on a five-year cycle.
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
SS14
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
Itt Semiconductor
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
SMBJ18CA
Silicon Standard
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Protek Devices
1N4148
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
Eic Semiconductor
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
8134-HC-5P3
TE Connectivity
TE Connectivity's 8134-HC-5P3 is a Chip Carrier IC Socket with -65 to 125°C temp range, PRESS FIT termination, and 5A current rating. Ideal for straight mounting applications in electronic devices requiring reliable IC connections.
110-87-308-41-001101
Preci-dip Sa
110-87-308-41-001101 by Preci-dip Sa is a DIP8 IC socket with 7.62mm PCB contact row spacing and Beryllium Copper contacts. It features a housing made of Polycyclohexydimethylene Terephthalate-Polyester, gold flash mating contact finish, and can withstand temperatures from -55 to 125 °C. Ideal for applications requiring reliable connections in electronic devices.
1-1437504-4
TE Connectivity 1-1437504-4 is a FLUOROPOLYMER Chip Carrier IC Socket for TO-5 devices. With 3A current rating, it operates b/w -55°C to 125°C and has solder termination. Ideal for applications requiring high temperature resistance and secure electrical connections.
2-382402-1
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP14; Housing Material: GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; No. of Contacts: 14; Manufacturer Series: 382402;
PF113A-D
Omron
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 60 Cel; Contact Material: NOT SPECIFIED;
27E937
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT APPLICABLE;
PLCC-044-T-N
Samtec
Samtec's PLCC-044-T-N is a Chip Carrier IC Socket with LIQUID CRYSTAL POLYMER housing. Featuring 44 contacts, it has a -55 to 105 °C operating range and Matte Tin (Sn) finish. Ideal for PLCC44 devices, this surface mount socket is bellowed type with 11x11 contact configuration.
IC149-100-025-B5
Fujitsu
Fujitsu IC149-100-025-B5 is a 100-contact QFP100 chip carrier socket with POLYPHENYLENE SULPHIDE housing. It features BERYLLIUM COPPER contacts finished in GOLD (Au) with Nickel (Ni) barrier. Ideal for IC SOCKET applications requiring reliable connections and durability.
2833589
Phoenix Contact
RELAY SOCKET;
PY14QN-Y1
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
60431011
Aptiv
RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Additional Features: POLARIZED;
134-10-328-00-100000
Mill-max Mfg
134-10-328-00-100000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
200-6311-9UN-1900
3m Electronic Products Division
The 3M Electronic Products Division's 200-6311-9UN-1900 is a Chip Carrier IC Socket with POLYETHERSULFONE housing. It features 121 BERYLLIUM COPPER contacts with GOLD (30) OVER NICKEL (50) finish for PGA121 devices. Ideal for high-performance electronic applications requiring reliable connections.
1860991-1
IC SOCKET; Housing Material: POLYAMIDE; No. of Contacts: 8; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
XR2D-1404
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30);
551-10-155-18-121004
Mill-max Mfg's 551-10-155-18-121004 is a PGA155 IC socket with 155 contacts. It features gold (Au) mating finish over nickel (Ni) and termination finish, housed in POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. Ideal for chip carrier applications.
XR2T-2221-N
IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Termination): GOLD FLASH; JESD-609 Code: e4; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER;
1-1393824-0
IC SOCKET; Housing Material: POLYCARBONATE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
ICA-203-S-TG30
Robinson Nugent
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Manufacturer Series: ICE; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 20;
8428-21B1-RK-TP
8428-21B1-RK-TP by 3M is a PLCC28 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing material. Featuring 28 contacts, it has a temperature range of -40 to 105 °C and insulation resistance of 1G ohm. Ideal for surface mount applications requiring reliable connections in electronic devices.
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D2816-42
Harwin PLC
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: PLASTIC;
D2814-42
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: PLASTIC;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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