Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Samtec HLT-1217-T-T is a plastic IC socket with 204 brass contacts, featuring Tin over Nickel mating finish. Designed for PGA204 devices, it offers reliable connectivity with Tin-Ni termination. Ideal for chip carrier applications requiring high contact count and secure connections.
Median Price
$19.370
Lifecycle Status
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2
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< 1k
Nova Conductors
1+ parts
100+ parts
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10k+ parts
Vyrian
AZTECH Wire
$5.351
Continental Prestige Electronics
$18.983
Netroflash
Argo Parts USA
The plastic housing material offers durability and light weight, making it suitable for various applications.
Designed specifically for use with PGA204 devices, ensuring compatibility and optimal performance.
Brass contact material provides good conductivity and corrosion resistance for reliable connections.
With 204 contacts, this product can accommodate a wide range of integrated circuits and components.
The tin over nickel contact finish ensures smooth mating and secure connections for efficient signal transmission.
The tin with nickel barrier termination offers excellent protection against oxidation and wear, prolonging the socket's lifespan.
The IC socket type allows for easy insertion and removal of integrated circuits, facilitating maintenance and upgrades.
Chip Carrier IC & Component Sockets HLT-1217-T-T attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
HLT-1217-T-T Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
SS495A-SP
Honeywell Sensing And Control
SS495A-SP by Honeywell is a magnetic field sensor with 10.5V max supply voltage, 3" body width, and 1.5% linearity. Ideal for applications requiring a Hall effect sensor with -40 to 150°C operating temperature range, such as position sensing in automotive or industrial systems.
2N2222A
Bharat Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
LM317D2TG
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
MBR0530T1G
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
Telefunken Microelectronics
264-1300-29-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 264-1300-29-0602J is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features DIP64 device compatibility, GOLD (30) OVER NICKEL (50) mating finish, and Gold (Au) - with Nickel (Ni) termination finish. Ideal for applications requiring reliable connections in electronic circuits.
SS5-20-3.50-L-D-K-TR
Samtec
IC SOCKET;
XR2B-3211-N
Omron
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2;
315-43-120-41-003000
Mill-max Mfg
315-43-120-41-003000 by Mill-max Mfg is a PLASTIC IC SOCKET for SIP20 devices with 20 contacts. It features MATTE TIN OVER NICKEL finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
CQF100-155A
IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; No. of Contacts: 100; Manufacturer Series: CQF;
95.85.3
Finder
RELAY SOCKET; Device Type Used On: RELAY; No. of Contacts: 8;
IC149-100-025-B5
Yamaichi Electronics
IC SOCKET; Device Type Used On: QFP100; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 100VAC; Housing Material: PLASTIC;
P7LF-06D
RELAY SOCKET; Device Type Used On: RELAY; Dielectric Withstanding Voltage (V): 2000VAC; Rating (Current): 30 A; Insulation Resistance: 1000000000 ohm; Body Depth: .984 inch;
XR2T-2461-N
IC SOCKET; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD (30);
169-PRS13001-16
Aries Electronics
Aries Electronics 169-PRS13001-16 is a PGA169 IC socket with 169 contacts, made of POLYPHENYLENE SULPHIDE. It has a contact pitch of 0.1" and operates b/w -65°C to 200°C. Ideal for chip carrier ICs, it features solder termination and a rectangular PCB contact pattern.
HLS-1820-T-22
The Samtec HLS-1820-T-22 is a plastic IC socket with 360 gold contacts for PGA360 devices. It offers gold contact finish for mating and termination, suitable for chip carrier applications. This component is designed to provide reliable connections in electronic assemblies.
P2RFZ-05-E
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
ICA-308-JGG
Samtec's ICA-308-JGG is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It features wire wrap termination, gold over nickel finish, and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring a mating pitch of 0.1 inch and dielectric voltage of 1400VAC.
PYFZ-08-E
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
2-1571552-5
TE Connectivity
TE Connectivity's 2-1571552-5 is a DIP18 IC socket with 18 contacts, rated at 3A current. Featuring a rectangular PCB contact pattern with 7.62mm row spacing, it uses solder termination and has a thermoplastic polyester housing. Ideal for applications requiring a dielectric voltage of 1000VAC and operating temperatures ranging from -55 to 105°C.
173-10-310-00-001000
173-10-310-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP10 devices with 10 contacts. It features GOLD OVER NICKEL contact finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
HLS-1204-TT-31
The Samtec HLS-1204-TT-31 is a POLYETHYLENE chip carrier socket for PGA48 devices with 48 contacts. It features Tin contact finish for mating and Tin (Sn) with Nickel (Ni) barrier for termination. Ideal for IC applications requiring reliable connections in electronic assemblies.
HLS-1217-T-22-L
The Samtec HLS-1217-T-22-L is a POLYETHYLENE chip carrier socket with 204 GOLD contacts for PGA204 devices. It features IC SOCKET type and GOLD (Au) contact finish for mating and termination. Ideal for high-performance applications requiring reliable connections in electronic systems.
4-1571552-9
TE Connectivity's 4-1571552-9 is a Chip Carrier IC Socket with 28 contacts, Beryllium Copper material, and 15.24mm PCB row spacing. It is used for DIP28 devices in applications requiring a -55 to 105°C operating temperature range and solder termination.
2271028
Phoenix Contact
RELAY SOCKET;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HLT-1910-G-R
The Samtec HLT-1910-G-R is a 190-contact IC socket with brass contacts and gold over nickel finish. It is designed for use on PGA190 devices, featuring a plastic housing material. Ideal for chip carrier applications requiring reliable connections and durability in electronic systems.
HLT-1910-T-H
Samtec's HLT-1910-T-H is a 190-contact IC socket with brass contacts and plastic housing. It is designed for use on PGA190 devices, featuring Tin over Nickel mating finish and Tin with Nickel termination. Ideal for chip carrier applications requiring reliable connectivity in electronic systems.
HLT-1910-T-R
The Samtec HLT-1910-T-R is a plastic IC socket with 190 brass contacts, featuring Tin over Nickel mating finish. Designed for PGA190 devices, it offers reliable connectivity and durability in chip carrier applications. Ideal for high-performance electronic systems requiring secure component sockets.
HLT-1910-T-T
The Samtec HLT-1910-T-T is a 190-contact IC socket with brass contacts and plastic housing. It is designed for use on PGA190 devices, featuring tin over nickel mating finish and tin with nickel termination finish. Ideal for chip carrier applications requiring reliable connectivity in electronic systems.
HLT-1910-G-H
The Samtec HLT-1910-G-H is a plastic IC socket with 190 brass contacts. It features gold over nickel mating finish and gold with nickel termination finish. Designed for use on PGA190 devices, it is ideal for chip carrier applications.
HLT-1910-G-T
The Samtec HLT-1910-G-T is a 190-contact IC socket with brass contacts and gold over nickel finish. It is designed for use on PGA190 devices, featuring a plastic housing material. Ideal for chip carrier applications requiring reliable connections and durability.
HLT-1712-T-R
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; Contact Material: BRASS; No. of Contacts: 204; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
HLT-1712-G-R
The Samtec HLT-1712-G-R is a plastic IC socket with 204 brass contacts. It features gold over nickel contact finish for mating and termination. Designed for use on PGA204 devices, this chip carrier socket is ideal for high-performance electronic applications.
HLT-1712-T-T
The Samtec HLT-1712-T-T is a plastic IC socket with 204 brass contacts, featuring tin over nickel mating finish. It is designed for use on PGA204 devices and offers reliable connection termination with tin (Sn) and nickel (Ni) barrier. Ideal for chip carrier applications requiring secure component sockets.
HLT-1712-T-H
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; No. of Contacts: 204; JESD-609 Code: e3; Contact Finish (Mating): TIN OVER NICKEL (50);
HLT-1712-G-H
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; Contact Material: BRASS; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 204;
HLT-1712-G-T
Samtec's HLT-1712-G-T is a plastic chip carrier IC socket with 204 brass contacts. It is used on PGA204 devices and has gold (Au) mating finish over nickel (Ni). This IC socket is ideal for various applications requiring reliable connections.
HLT-1507-T-R
IC SOCKET; Device Type Used On: PGA105; Housing Material: PLASTIC; JESD-609 Code: e3; Contact Material: BRASS; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
HLT-1015-G-H
IC SOCKET; Device Type Used On: PGA150; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
HLT-1905-G-H
IC SOCKET; Device Type Used On: PGA95; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
HLT-1719-T-R
IC SOCKET; Device Type Used On: PGA323; Housing Material: PLASTIC; Contact Material: BRASS; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
HLT-1217-G-H
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; Contact Material: BRASS; No. of Contacts: 204; JESD-609 Code: e4;
HLT-1217-G-R
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); No. of Contacts: 204;
HLT-1217-T-H
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; Contact Material: BRASS; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; JESD-609 Code: e3;
HLT-1217-T-R
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; JESD-609 Code: e3; No. of Contacts: 204;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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