Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Samtec's HLT-1719-T-R is a plastic IC socket for PGA323 devices with 323 brass contacts. Features tin over nickel mating finish and tin with nickel termination. Ideal for chip carrier applications, offering reliable connectivity and durability in electronic assemblies.
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Netroflash
The use of plastic as the housing material makes the chip carrier IC socket lightweight and durable, providing good protection for the contacts and components within.
Being compatible with PGA323 devices, this socket can accommodate a wide range of integrated circuits, making it versatile for various applications.
Brass contacts offer excellent conductivity and durability, ensuring reliable connections with the ICs for consistent performance.
With 323 contacts, this IC socket can support complex circuitry and high pin count devices, making it suitable for advanced electronic applications.
The tin over nickel finish on the contacts provides corrosion resistance, ensuring a stable and long-lasting connection between the IC and socket.
The tin with nickel barrier termination offers good solderability and conductivity, making it easy to install and maintain the IC socket.
Designed specifically for ICs, this socket ensures a secure and reliable connection for the integrated circuits, promoting stable performance in electronic devices.
Chip Carrier IC & Component Sockets HLT-1719-T-R attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
HLT-1719-T-R Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
BAV99
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Crimson Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
1N4148WS
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
Hy Electronic
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
Db Lectro
SS14
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
Sangdest Microelectronics (Nanjing)
LM317T
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
PR2-BSP3/4X21
Phoenix Contact
RELAY SOCKET;
PGA-280
Robinson Nugent
IC SOCKET; Device Type Used On: PGA280; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 280; Manufacturer Series: PGA;
XR2B-2811-N
Omron
IC SOCKET; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2;
HLS-1902-S-22-L
Samtec
Samtec's HLS-1902-S-22-L is a POLYETHYLENE chip carrier IC socket with 38 contacts, GOLD finish for mating and termination. Designed for DIP38 devices, it offers reliable connectivity in various electronic applications.
SH2B-05C
Idec
SH2B-05C by Idec is a chip carrier IC socket with 2 contacts, rated for 10A current. It features screw termination and is designed for use on relay devices. With a body size of 2.716" x 1.181" x 1.161", this straight mounting style socket is ideal for relay applications.
27E894
TE Connectivity
TE Connectivity 27E894 is a GLASS FILLED POLYESTER IC SOCKET with SCREW termination, suitable for RELAY devices. Featuring 14 RND PIN-SKT contacts with Tin finish (Sn), it offers reliable connectivity in chip carrier applications.
1050281001
Molex
OTHER SOCKET; Device Type Used On: CAMERA; Housing Material: PLASTIC; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 32; Additional Features: STANDARD: UL 94V-0;
173-10-318-00-001000
Mill-max Mfg
173-10-318-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP18 devices with 18 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
110-13-316-41-001000
Mill-max Mfg's 110-13-316-41-001000 is a PCT POLYESTER Chip Carrier IC Socket for DIP16 devices. Featuring 16 contacts with GOLD OVER NICKEL finish, it is ideal for rectangular contact configurations in various electronic applications.
ICF-624-F-O
Samtec's ICF-624-F-O is a Chip Carrier IC Socket with 24 contacts, 15.24mm PCB row spacing, and liquid crystal polymer housing. It features gold flash over nickel contact finish, suitable for DIP24 devices in applications requiring a current rating of 1A and operating temperatures from -55°C to 125°C.
XR2D-3201-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
XR2D-4001-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
2-640359-4
TE Connectivity's 2-640359-4 is a Chip Carrier IC Socket with 18 contacts, made of Phosphor Bronze with Gold finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for DIP18 devices, it features a rectangular contact pattern and glass-filled polyethylene housing material.
KSS100-85TG
Advanced Interconnections
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Additional Features: SIP SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
1-2199299-2
TE Connectivity 1-2199299-2 is a DIP28 IC socket with 28 contacts, 15.24mm PCB row spacing, and glass-filled PBT housing material. It has a mating contact pitch of 0.1", solder termination, and operates b/w -40°C to 105°C. Ideal for applications requiring a reliable chip carrier socket with rectangular contact pattern and straight mounting style.
PL11
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
1-1437539-7
TE Connectivity 1-1437539-7 is a DIP14 IC SOCKET with 14 contacts, rated at 3A current. It has a PCB contact row spacing of 7.49mm and uses solder termination. This chip carrier socket is commonly used in applications requiring a mating contact pitch of 0.1 inch and operates within -55 to 105°C temperature range.
P2CF-08-E
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
XR2C-3202
IC SOCKET; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2; JESD-609 Code: e4;
XR2A-1402
IC SOCKET; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
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HLT-1910-G-R
The Samtec HLT-1910-G-R is a 190-contact IC socket with brass contacts and gold over nickel finish. It is designed for use on PGA190 devices, featuring a plastic housing material. Ideal for chip carrier applications requiring reliable connections and durability in electronic systems.
HLT-1910-T-H
Samtec's HLT-1910-T-H is a 190-contact IC socket with brass contacts and plastic housing. It is designed for use on PGA190 devices, featuring Tin over Nickel mating finish and Tin with Nickel termination. Ideal for chip carrier applications requiring reliable connectivity in electronic systems.
HLT-1910-T-R
The Samtec HLT-1910-T-R is a plastic IC socket with 190 brass contacts, featuring Tin over Nickel mating finish. Designed for PGA190 devices, it offers reliable connectivity and durability in chip carrier applications. Ideal for high-performance electronic systems requiring secure component sockets.
HLT-1910-T-T
The Samtec HLT-1910-T-T is a 190-contact IC socket with brass contacts and plastic housing. It is designed for use on PGA190 devices, featuring tin over nickel mating finish and tin with nickel termination finish. Ideal for chip carrier applications requiring reliable connectivity in electronic systems.
HLT-1910-G-H
The Samtec HLT-1910-G-H is a plastic IC socket with 190 brass contacts. It features gold over nickel mating finish and gold with nickel termination finish. Designed for use on PGA190 devices, it is ideal for chip carrier applications.
HLT-1910-G-T
The Samtec HLT-1910-G-T is a 190-contact IC socket with brass contacts and gold over nickel finish. It is designed for use on PGA190 devices, featuring a plastic housing material. Ideal for chip carrier applications requiring reliable connections and durability.
HLT-1712-T-R
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; Contact Material: BRASS; No. of Contacts: 204; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
HLT-1712-G-R
The Samtec HLT-1712-G-R is a plastic IC socket with 204 brass contacts. It features gold over nickel contact finish for mating and termination. Designed for use on PGA204 devices, this chip carrier socket is ideal for high-performance electronic applications.
HLT-1712-T-T
The Samtec HLT-1712-T-T is a plastic IC socket with 204 brass contacts, featuring tin over nickel mating finish. It is designed for use on PGA204 devices and offers reliable connection termination with tin (Sn) and nickel (Ni) barrier. Ideal for chip carrier applications requiring secure component sockets.
HLT-1712-T-H
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; No. of Contacts: 204; JESD-609 Code: e3; Contact Finish (Mating): TIN OVER NICKEL (50);
HLT-1712-G-H
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; Contact Material: BRASS; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 204;
HLT-1217-T-T
IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; No. of Contacts: 204; Contact Material: BRASS; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
HLT-1712-G-T
Samtec's HLT-1712-G-T is a plastic chip carrier IC socket with 204 brass contacts. It is used on PGA204 devices and has gold (Au) mating finish over nickel (Ni). This IC socket is ideal for various applications requiring reliable connections.
HLT-1507-T-R
IC SOCKET; Device Type Used On: PGA105; Housing Material: PLASTIC; JESD-609 Code: e3; Contact Material: BRASS; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
HLT-1015-G-H
IC SOCKET; Device Type Used On: PGA150; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
HLT-1905-G-H
IC SOCKET; Device Type Used On: PGA95; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
HLT-1719-G-H
IC SOCKET; Device Type Used On: PGA323; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
HLT-1719-G-R
IC SOCKET; Device Type Used On: PGA323; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 323; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
HLT-1719-T-H
IC SOCKET; Device Type Used On: PGA323; Housing Material: PLASTIC; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; No. of Contacts: 323;
HLT-1719-T-T
IC SOCKET; Device Type Used On: PGA323; Housing Material: PLASTIC; Contact Material: BRASS; No. of Contacts: 323; Contact Finish (Mating): TIN OVER NICKEL (50);
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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