Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Additional Features: SIP SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
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Chip Carrier IC & Component Sockets KSS100-85TG attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Advanced Interconnections
Number of Positions or Pins:
Contact Finish - Termination:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
KSS100-85TG Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
A Dedication to Solving Design Challenges Since 1982, Advanced Interconnections has been recognized as a leading designer and manufacturer of innovative, technologically advanced interconnect solutions. From our earliest invention of the world's first removable terminal carrier, Peel-A-Way®, to our rugged, high density B2B® SMT Connectors, our designs are used in electronic applications around the world including telecommunications, military, automotive development, high-end computer servers, medical equipment, and more. Whether your application is for development, test, or volume production, we design to your requirements – drawing from our Tool Box to create a customized solution that adds value and reduces your time-to-market from prototype through production. Our network of experienced Manufacturer's Representatives and Distributors offers design support and local sourcing in over 35 countries worldwide.
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
2N7002
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM2931AZ-5.0RPG
Onsemi
LM2931AZ-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage and 0.1A max output current. It features a low dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature range from -40 to 125°C. The package style is cylindrical with matte tin terminal finish, ideal for various electronic devices needing precise voltage regulation.
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
BAV99
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
Philips Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
1437538-3
IC SOCKET; Device Type Used On: DIP28; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 28;
P7SA-14P
Omron
Omron's P7SA-14P is a 14-contact relay socket with rectangular contact pattern and solder termination. It has a PCB row spacing of 10.59mm, suitable for G7SA devices. Operating temperature ranges from -40°C to 85°C, making it ideal for various industrial applications.
27E305
IC SOCKET; Housing Material: NYLON; Termination Type: SOLDER; No. of Contacts: 11; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
XR2A-4221-N
IC SOCKET; Manufacturer Series: XR2;
PF083A-D
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
XR2C-2015
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
8444-21B1-RK-TP
3m Electronic Products Division
8444-21B1-RK-TP by 3M is a PLCC44 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. Featuring 44 contacts in a bellowed contact style, it has an insulation resistance of 1G ohm. With a temperature range of -40 to 105 °C, it is ideal for surface mount applications.
27E130
IC SOCKET; Device Type Used On: RELAY; Housing Material: PHENOLIC; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER LUG;
XR2T-0821-N
IC SOCKET; Contact Finish (Mating): GOLD FLASH; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2T; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
134-10-328-00-050000
Mill-max Mfg
The Mill-max Mfg 134-10-328-00-050000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
CQF144-167D
Texas Instruments
IC SOCKET; Device Type Used On: QFP144; Housing Material: GLASS FILLED POLYETHERIMIDE; No. of Contacts: 144; Manufacturer Series: CQF;
P2RF-05-E
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Maximum Operating Temperature: 70 Cel; Contact Material: NOT APPLICABLE; No. of Contacts: 5; Minimum Operating Temperature: -40 Cel;
115-47-432-41-001000
IC SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
832-AG11D-ESL-LF
TE Connectivity's 832-AG11D-ESL-LF is a DIP32 IC socket with 32 contacts, rated at 3A current. Featuring a PCB contact row spacing of 15.24mm and rectangular pattern, it has a housing made of polyethylene/polyester. With a temperature range from -55 to 105 °C, it uses solder termination and has an insulation resistance of 5G ohm.
P2R-087P
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
2227MC-08-03-18-F1
Multicomp Pro
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; JESD-609 Code: e4; Additional Features: STANDARD: UL94-0;
ICM-624-1-GT
Adam Tech
ICM-624-1-GT by Adam Tech is a DIP24 IC socket with 24 contacts, 15.24mm PCB row spacing, and rectangular contact pattern. It has a solder termination type, operates b/w -40°C to 105°C, and supports a current rating of 3A. Ideal for applications requiring reliable chip carrier connections in electronic devices.
XR2B-4011-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Manufacturer Series: XR2;
110-87-324-41-001101
Preci-dip Sa
110-87-324-41-001101 by Preci-dip Sa is a DIP24 IC socket with 24 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and operates b/w -55°C to 125°C. Suitable for chip carrier ICs, it has a PCB contact row spacing of 7.62mm and Polycyclohexydimethylene Terephthalate-Polyester housing material.
110-43-308-41-001000
110-43-308-41-001000 by Mill-max Mfg is a DIP8 IC socket with 0.1" contact pitch, suitable for chip carrier ICs. Featuring polyethylene housing, matte tin over nickel termination, and 3A current rating, it operates b/w -55°C to 125°C. Ideal for applications requiring reliable connections in electronic devices.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KSS100-133TT
Advanced Interconnections
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Contact Finish (Mating): GOLD OVER NICKEL; JESD-609 Code: e0; No. of Contacts: 100;
KSS100-143TT
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; JESD-609 Code: e0; No. of Contacts: 100; Contact Material: NOT SPECIFIED;
KSS100-49TTRTV
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Contact Finish (Termination): TIN LEAD OVER NICKEL; No. of Contacts: 100; JESD-609 Code: e0;
KSS100-85TGRTV
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; No. of Contacts: 100; Manufacturer Series: KSS; JESD-609 Code: e0;
KSS100-85TTRTV
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; JESD-609 Code: e0; No. of Contacts: 100; Manufacturer Series: KSS;
KSS100-210TG3M
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Contact Finish (Termination): TIN LEAD OVER NICKEL; No. of Contacts: 100; Contact Material: NOT SPECIFIED;
KSS100-85TG3M
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; JESD-609 Code: e0;
KSS100-210TG
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Additional Features: SIP SOCKET; Contact Finish (Termination): TIN LEAD OVER NICKEL; No. of Contacts: 100;
KSS100-49TG
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 100; JESD-609 Code: e0;
KSS100-85GG
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Additional Features: SIP SOCKET; No. of Contacts: 100; Contact Material: NOT SPECIFIED;
KSS100-85TT
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 100; Additional Features: SIP SOCKET;
KSS100-50TT
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; No. of Contacts: 100; Additional Features: SOCKET ADAPTER; Contact Material: NOT SPECIFIED;
KSS100-01TTRTV
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Contact Finish (Termination): TIN LEAD OVER NICKEL; JESD-609 Code: e0; Manufacturer Series: KSS;
KSS100-810TG
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Additional Features: SIP SOCKET; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Material: BERYLLIUM COPPER;
KSS100-810TT
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Contact Material: BERYLLIUM COPPER; Additional Features: SIP SOCKET; Contact Finish (Mating): TIN LEAD OVER NICKEL;
KSS100-811TG
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e0; Additional Features: SIP SOCKET;
KSS100-811TT
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Additional Features: SIP SOCKET; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; JESD-609 Code: e0;
KSS100-812TG
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Additional Features: SIP SOCKET; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD OVER NICKEL;
KSS100-812TT
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Finish (Mating): TIN LEAD OVER NICKEL; No. of Contacts: 100;
KSS100-85MG
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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