Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TE Connectivity 1-2199298-5 is a DIP18 IC socket with 18 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It has a glass-filled PBT housing material and solder termination, suitable for applications requiring a current rating of 1A in temperatures ranging from -40°C to 105°C.
Median Price
$0.170
Lifecycle Status
Suppliers In-Stock
29
In-Stock Inventory
1k+
RS Americas
1+ parts
$0.075
100+ parts
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1k+ parts
10k+ parts
RS (Exports)
$0.110
Newark
$0.160
$0.148
Mouser Electronics
$0.280
$0.176
$0.155
Arrow
$0.302
$0.141
DigiKey
$0.330
$0.246
$0.209
$0.187
TE Connectivity
$0.300
$0.270
Future Electronics
$0.133
$0.124
Powell Electronics
$0.192
Chip1Stop
$0.130
Verical
$0.140
Farnell
$0.134
Master Electronics
$0.121
Avnet
$0.165
Element14
$0.260
$0.234
$0.232
TTI Europe
Heilind Electronics
$0.189
$0.154
Interstate Connecting
$0.190
$0.167
$0.159
TTI
$0.174
$0.150
Nova Conductors
$0.169
TME
$0.310
$0.210
IBS Electronics
NAC Semi
$0.292
Electro Sonic
$0.216
$0.144
Vyrian
VNN
Q Components
Bristol Electronics
Flex Direct, LLC
Semicontronic
$0.064
$0.062
Argo Parts USA
Netroflash
Perfect Parts
Abacus Technologies
Aztec Data Supply Inc.
Continental Prestige Electronics
$0.128
Kepictronics
Advanced Electronics
EMSNET (Excess)
Assy Fe
The PCB contact row spacing of 7.62mm allows for efficient connection and spacing on the PCB, ensuring proper functionality and compatibility.
The glass-filled PBT housing material provides durability and heat resistance, making it a reliable choice for long-term use in various applications.
With a minimum operating temperature of -40°C, this product can withstand extreme cold conditions without affecting its performance.
The solder termination type ensures a secure and stable connection between the component socket and the PCB, reducing the risk of loose connections or malfunctions.
The body length of 0.9 inches provides sufficient space for accommodating the DIP18 device type, allowing for a secure fit and proper alignment.
With an insulation resistance of 1,000,000,000 ohms, this product offers excellent electrical insulation properties, reducing the risk of short circuits or electrical failures.
The 1A current rating ensures that this product can safely handle up to 1 amp of electrical current, making it suitable for various electronic applications.
With a maximum operating temperature of 105°C, this product can withstand high heat conditions without compromising its performance or safety.
Chip Carrier IC & Component Sockets 1-2199298-5 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
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1-2199298-5 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAV99
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
1N5819HW-7-F
Diodes Incorporated
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
C1210C104K5RACTU
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
LM317T/NOPB
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-609 Code: e3; Package Shape: RECTANGULAR;
LL4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
L78L05ABZ-AP
STMicroelectronics
L78L05ABZ-AP by STMicroelectronics is a BIPOLAR fixed positive single output standard regulator with an operating temperature range of -40 to 125°C. It has a nominal output voltage of 5V, max load regulation of 0.06%, and can handle a max output current of 0.07A. Ideal for applications requiring stable voltage regulation in various electronic devices.
Formosa Microsemi
BSS123-7-F
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
2N2222A
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
C0603X104K5RACAUTO
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
XR3G-6411
Omron
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4;
540-88-044-17-400-TR
Preci-dip Sa
IC SOCKET; Device Type Used On: PLCC44; Housing Material: PPS THERMOPLASTIC; Additional Features: STANDARD: UL 94V-0, LOW PROFILE; No. of Contacts: 44; Contact Material: NOT SPECIFIED;
2-1571552-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT PLASTIC POLYESTER; Contact Finish (Termination): TIN OVER NICKEL; Contact Finish (Mating): GOLD FLASH OVER NICKEL (100); JESD-609 Code: e3;
1-2199298-3
TE Connectivity's 1-2199298-3 is a Chip Carrier IC Socket with 14 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It is used for DIP14 devices, has a solder termination type, and operates b/w -40°C to 105°C.
9-1437514-4
TE Connectivity 9-1437514-4 is a Chip Carrier IC Socket with 7.62mm PCB contact spacing, -55 to 105°C temp range, and 3A current rating. Ideal for PRESS FIT termination in electronic applications requiring high insulation resistance and precise mating contact pitch of 0.1 inch.
SH3B-05C
Idec
SH3B-05C by Idec is a Chip Carrier IC Socket with 3 contacts, rated for 10A current. It is used on relays with screw termination and straight mounting style. This socket has a body size of 2.716" x 1.181" x 1.161", making it suitable for various relay applications.
2-1571586-9
3m Electronic Products Division
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: THERMOPLASTIC;
8134-HC5P2-B
TE Connectivity's 8134-HC5P2-B chip carrier socket features PRESS FIT termination, RND PIN-SKT contact style, and 5A current rating. With a wide temperature range (-55 to 125°C), it is ideal for IC applications requiring high insulation resistance (1G ohm).
4-1571552-4
TE Connectivity 4-1571552-4 is a DIP16 IC SOCKET with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and rectangular pattern, suitable for applications requiring a mating contact pitch of 0.1 inch. The housing material is thermoplastic, ensuring reliable performance in temperatures ranging from -55°C to 105°C.
110-43-628-41-001000
Mill-max Mfg
110-43-628-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing material, 28 contacts, and Matte Tin over Nickel termination. It is designed for use on DIP28 devices, featuring a rectangular contact configuration suitable for various electronic applications.
PF113A-E
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; No. of Contacts: 11; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
PGA-280
Robinson Nugent
IC SOCKET; Device Type Used On: PGA280; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 280; Manufacturer Series: PGA;
1-1437539-6
TE Connectivity's 1-1437539-6 is a DIP14 IC socket with 14 contacts, rated at 3A current. It features a PCB contact row spacing of 7.75mm and rectangular contact pattern, suitable for applications requiring a mating pitch of 0.1 inch. The socket has a temperature range from -55°C to 105°C, making it ideal for various electronic devices.
PF083A-D
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
111-47-324-41-001000
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
150-90-320-00-001000
150-90-320-00-001000 by Mill-max Mfg is a plastic IC socket for DIP20 devices with 20 contacts. It features Tin/Lead contact finish over Nickel, suitable for chip carrier ICs. The rectangular contact configuration makes it ideal for various electronic applications.
IC149-100-025-B5
Yamaichi Electronics
IC SOCKET; Device Type Used On: QFP100; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 100VAC; Housing Material: PLASTIC;
XR2A-4025
IC SOCKET; Manufacturer Series: XR2;
2-1571550-9
TE Connectivity's 2-1571550-9 is a DIP28 IC socket with 28 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and uses solder termination. With a housing made of polyethylene, it operates b/w -55°C to 105°C, suitable for various electronic applications requiring reliable connections.
XR2A-2478
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1-2199298-2
TE Connectivity 1-2199298-2 is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It features glass-filled PBT housing material, solder termination, and operates b/w -40°C to 105°C. Ideal for applications requiring a mating pitch of 0.1 inch in straight mounting style.
1-2199298-4
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED PBT;
1-2199298-9
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED PBT;
1-2199299-2
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED PBT;
1-2199299-5
TE Connectivity 1-2199299-5 is a Chip Carrier IC Socket with 40 contacts, 0.1" pitch, and bellowed contact style. It has a PCB contact row spacing of 15.24mm and operates b/w -40°C to 105°C. Ideal for applications requiring high insulation resistance and dielectric voltage withstand capability.
1-2199298-6
IC SOCKET; Mounting Style: STRAIGHT; Housing Material: GLASS FILLED PBT; Contact Finish (Mating): NOT APPLICABLE; PCB Contact Row Spacing (mm): 7.62; Contact Material: NOT APPLICABLE;
1-2199298-1
IC SOCKET; Device Type Used On: DIP6; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED PBT;
1-2199300-2
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYESTER;
1-2199298-8
IC SOCKET; Mounting Style: STRAIGHT; Housing Material: GLASS FILLED PBT; Body Length: 1.2 inch; Additional Features: LOW PROFILE, STANDARD: UL 94V-0; Maximum Operating Temperature: 105 Cel;
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