Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity 1-2199300-2 is a DIP32 IC SOCKET with 32 contacts, PCB spacing of 15.24mm, and housing made of POLYESTER. It has a current rating of 1A, operates b/w -40 to 105 °C, and uses SOLDER termination. Ideal for applications requiring chip carrier sockets with bellowed contact style.
Median Price
$0.840
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22
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1k+
Element14
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TE Connectivity
$0.890
$0.780
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Mouser Electronics
$0.910
$0.674
$0.623
$0.579
Newark
$1.110
$0.799
$0.671
$0.622
DigiKey
$1.130
$0.814
$0.726
$0.640
Powell Electronics
$1.696
$1.187
Verical
$0.855
$0.618
$0.583
Master Electronics
$0.825
$0.507
$0.494
TTI Europe
$0.385
$0.357
$0.337
Farnell
$0.353
TTI
$0.510
Arrow
$0.298
Chip1Stop
IBS Electronics
$1.004
$0.881
$0.469
Rapid Electronics
$0.478
Electro Sonic
$0.268
$0.254
VNN
TME
$0.550
NAC Semi
Inventory MP
Bristol Electronics
Nova Conductors
Semicontronic
$0.236
$0.230
$0.229
Continental Prestige Electronics
$0.831
$0.559
Perfect Parts
Assy Fe
Argo Parts USA
Netroflash
Optimal spacing ensures efficient connection with PCB for stable performance.
Polyester material provides durability and resistance to heat, making the product reliable for long-term use.
Wide temperature range allows for use in various environments and conditions.
Solder termination provides secure and stable connection, ensuring reliable performance.
Sufficient number of contacts for connecting multiple components, making it versatile for different applications.
Straight mounting style simplifies installation process and ensures proper alignment.
High current rating allows for efficient power transfer without risk of overheating.
High dielectric strength ensures safe operation and protection against electrical breakdown.
Tin contact finish provides good conductivity and corrosion resistance, ensuring reliable connections.
Wide temperature range allows for use in high-temperature environments without compromising performance.
Chip Carrier IC & Component Sockets 1-2199300-2 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
Number of Positions or Pins:
Contact Finish - Termination:
Contact Style:
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Mating Contact Pitch:
PCB Contact Row Spacing:
Terminal Pitch:
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PCB Contact Layout:
IC Socket Type:
Housing Material:
Length:
Width:
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JESD-609 Code:
Current Rating:
Dielectric Withstanding Voltage:
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Compatible Device Type:
Special Features:
1-2199300-2 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
PCN Obsolescence/ EOL - 1-2199299-(2,5),1-2199300-2 01/Mar/2016 Multiple Devices Reversal 10/Mar/2016
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
LM358AN
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
LM317T
Texas Instruments
LM317T by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. Operating temperature ranges from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. With a max output current of 1.5A, this through-hole package regulator is ideal for power supply designs where adjustable voltage levels are needed.
KYOCERA AVX
LM78L05ACMX/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
BAV99
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
2N2222A
Telcom Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Continental Device India
LM358N
Kec
CRGCQ0805F10R
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
STM32H743BIT6
STMicroelectronics
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
1N4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
214-44-320-01-670800
Mill-max Mfg
214-44-320-01-670800 by Mill-max Mfg is a Chip Carrier IC Socket with NYLON46 housing and BERYLLIUM COPPER contacts. It features 20 contacts with TIN finish, designed for DIP20 devices. Ideal for applications requiring reliable rectangular contact configuration in electronic assemblies.
342-10-139-00-591000
Mill-max Mfg's 342-10-139-00-591000 is a POLYETHYLENE chip carrier IC socket with GOLD OVER NICKEL contacts. It features 39 contacts for SIP39 devices and rectangular contact configuration. Ideal for electronic applications requiring reliable connections in IC components.
342-10-156-00-593000
Mill-max Mfg's 342-10-156-00-593000 is a POLYETHYLENE chip carrier IC socket for SIP56 devices. Featuring 56 gold over nickel contacts in RECTANGLE configuration, it offers reliable connectivity for various electronic applications.
PYF11A
Omron
RELAY SOCKET;
27E937
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT APPLICABLE;
M12883/40-11
Amphenol's M12883/40-11 is a POLYETHERIMIDE chip carrier socket with 14 GOLD contacts for RELAY devices. It is designed as a RELAY SOCKET, suitable for various electronic applications requiring reliable connection and performance.
XR2A-2221-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER;
P7SA-14P
Omron's P7SA-14P is a 14-contact relay socket with rectangular contact pattern and solder termination. It has a PCB row spacing of 10.59mm, suitable for G7SA devices. Operating temperature ranges from -40°C to 85°C, making it ideal for various industrial applications.
510-93-169-17-101001
The Mill-max Mfg 510-93-169-17-101001 is a PGA169 IC socket with 169 contacts. It features gold over nickel mating finish and tin/lead termination. The housing material is POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, making it ideal for chip carrier IC applications.
ICF-308-T-O
Samtec
Samtec's ICF-308-T-O is a Chip Carrier IC Socket with 8 contacts, 0.1" pitch, and Liquid Crystal Polymer housing. It is used for DIP8 devices in applications requiring -55 to 125°C operating temperature range and surface mount termination.
M12883/44-01
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; No. of Contacts: 14; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
RM78705
IC SOCKET; Contact Material: NOT APPLICABLE; Termination Type: SCREW; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11;
HLT-0919-G-R
Samtec's HLT-0919-G-R is a plastic chip carrier socket with 171 brass contacts. It features gold over nickel contact finish for mating and termination, suitable for PGA171 devices. This IC socket type is ideal for high-performance applications requiring reliable connections.
XR2A-2201-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4;
5778
Pomona Electronics
IC SOCKET; Device Type Used On: PQFP132; Housing Material: PLASTIC; No. of Contacts: 132; Manufacturer Series: 5778;
27E212
IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER LUG; No. of Contacts: 10;
2-1419106-5
TE Connectivity 2-1419106-5 is a NYLON chip carrier socket with 11 RND PIN-SKT contacts. It is designed for use on RELAY devices, featuring SCREW termination type. Ideal for IC SOCKET applications.
304-13-142-41-770000
The Mill-max Mfg 304-13-142-41-770000 is a POLYETHYLENE chip carrier IC socket for SIP42 devices with 42 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact configuration, and is ideal for electronic applications requiring reliable connections.
APO-320-G-H
Samtec APO-320-G-H is a 20-contact IC socket with brass contacts finished in gold over nickel. It features a polyester housing and is designed for DIP20 devices. Ideal for chip carrier applications due to its rectangular contact configuration and reliable gold finish.
ICF-308-T-I-TR
Samtec's ICF-308-T-I-TR is a Chip Carrier IC Socket with 8 contacts, rated at 1A current. It features a rectangular contact pattern on a 7.62mm PCB row spacing, suitable for DIP8 devices. With liquid crystal polymer housing and operating temperatures from -55°C to 125°C, it offers surface mount termination for various applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
1-2199298-2
TE Connectivity 1-2199298-2 is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It features glass-filled PBT housing material, solder termination, and operates b/w -40°C to 105°C. Ideal for applications requiring a mating pitch of 0.1 inch in straight mounting style.
1-2199298-4
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED PBT;
1-2199298-3
TE Connectivity's 1-2199298-3 is a Chip Carrier IC Socket with 14 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It is used for DIP14 devices, has a solder termination type, and operates b/w -40°C to 105°C.
1-2199298-5
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED PBT;
1-2199298-9
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED PBT;
1-2199299-2
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED PBT;
1-2199299-5
TE Connectivity 1-2199299-5 is a Chip Carrier IC Socket with 40 contacts, 0.1" pitch, and bellowed contact style. It has a PCB contact row spacing of 15.24mm and operates b/w -40°C to 105°C. Ideal for applications requiring high insulation resistance and dielectric voltage withstand capability.
1-2199298-6
IC SOCKET; Mounting Style: STRAIGHT; Housing Material: GLASS FILLED PBT; Contact Finish (Mating): NOT APPLICABLE; PCB Contact Row Spacing (mm): 7.62; Contact Material: NOT APPLICABLE;
1-2199298-1
IC SOCKET; Device Type Used On: DIP6; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED PBT;
Supply Digital Components
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